DE60300223D1 - System und Verfahren zur Verbindung von Hochfrequenzübertragungsleitungen - Google Patents

System und Verfahren zur Verbindung von Hochfrequenzübertragungsleitungen

Info

Publication number
DE60300223D1
DE60300223D1 DE60300223T DE60300223T DE60300223D1 DE 60300223 D1 DE60300223 D1 DE 60300223D1 DE 60300223 T DE60300223 T DE 60300223T DE 60300223 T DE60300223 T DE 60300223T DE 60300223 D1 DE60300223 D1 DE 60300223D1
Authority
DE
Germany
Prior art keywords
radio frequency
transmission lines
frequency transmission
connecting radio
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60300223T
Other languages
English (en)
Other versions
DE60300223T2 (de
Inventor
Yasunori Miyazawa
Katsuji Kaminishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ryowa Electronics Co Ltd
Original Assignee
Ryowa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ryowa Electronics Co Ltd filed Critical Ryowa Electronics Co Ltd
Application granted granted Critical
Publication of DE60300223D1 publication Critical patent/DE60300223D1/de
Publication of DE60300223T2 publication Critical patent/DE60300223T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Waveguide Connection Structure (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE60300223T 2002-03-01 2003-02-25 System und Verfahren zur Verbindung von Hochfrequenzübertragungsleitungen Expired - Lifetime DE60300223T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002056400A JP3998996B2 (ja) 2002-03-01 2002-03-01 高周波伝送線路接続システムおよびその方法
JP2002056400 2002-03-01

Publications (2)

Publication Number Publication Date
DE60300223D1 true DE60300223D1 (de) 2005-01-27
DE60300223T2 DE60300223T2 (de) 2005-12-08

Family

ID=27678598

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60300223T Expired - Lifetime DE60300223T2 (de) 2002-03-01 2003-02-25 System und Verfahren zur Verbindung von Hochfrequenzübertragungsleitungen

Country Status (4)

Country Link
US (1) US6980068B2 (de)
EP (1) EP1341254B1 (de)
JP (1) JP3998996B2 (de)
DE (1) DE60300223T2 (de)

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US7592796B2 (en) * 2004-05-18 2009-09-22 Circuit Check Plate with an indicator for discerning among pre-identified probe holes in the plate
US7186927B2 (en) * 2004-07-30 2007-03-06 Bae Systems Information And Electronic Systems Integration Inc. High frequency via with stripped semi-rigid cable
US7180009B2 (en) * 2004-07-30 2007-02-20 Bae Systems Information And Electronic Systems Inteegration Inc. Transmission line with stripped semi-rigid cable
US7053729B2 (en) * 2004-08-23 2006-05-30 Kyocera America, Inc. Impedence matching along verticle path of microwave vias in multilayer packages
TWI248330B (en) 2005-01-14 2006-01-21 Ind Tech Res Inst High frequency and wide band impedance matching via
US7498523B2 (en) * 2006-02-06 2009-03-03 Efficere Inc. Direct wire attach
US7557431B2 (en) * 2007-01-18 2009-07-07 Miteq, Inc. Microwave surface mount hermetically sealed package and method of forming the same
JP2008262989A (ja) * 2007-04-10 2008-10-30 Toshiba Corp 高周波回路基板
FR2916601A1 (fr) * 2007-05-21 2008-11-28 Thomson Licensing Sas Perfectionnement a l'empreinte de report d'un connecteur sur une carte imprimee.
JP5004824B2 (ja) * 2007-08-29 2012-08-22 京セラ株式会社 信号端子と信号線路導体との接続構造および電子部品搭載用パッケージならびに電子装置
FR2928066A1 (fr) * 2008-02-27 2009-08-28 Thomson Licensing Sas Systeme d'interconnexion de deux substrats comportant chacun au moins une ligne de transmission
US8410874B2 (en) * 2010-08-03 2013-04-02 Finisar Corporation Vertical quasi-CPWG transmission lines
US20130265733A1 (en) * 2012-04-04 2013-10-10 Texas Instruments Incorporated Interchip communication using an embedded dielectric waveguide
DE102012223562A1 (de) 2012-12-18 2014-04-03 Robert Bosch Gmbh Batterie mit Batteriezellen und dazwischen angeordnetem Ausgleichselement sowie Batteriesystem und Kraftfahrzeug mit Batterie
US8957325B2 (en) 2013-01-15 2015-02-17 Fujitsu Limited Optimized via cutouts with ground references
US9887462B2 (en) * 2013-10-31 2018-02-06 Motorola Solutions, Inc. Antenna with embedded wideband matching substrate
CN103647127B (zh) * 2013-12-09 2017-02-01 上海贝尔股份有限公司 用于将同轴电缆耦接至带状线的连接器
US10103494B2 (en) * 2014-05-08 2018-10-16 Apple Inc. Connector system impedance matching
KR102268385B1 (ko) * 2014-08-14 2021-06-23 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법
US9590583B2 (en) 2015-06-29 2017-03-07 Agilent Technologies, Inc. Alternating current (AC) coupler for wideband AC signals and related methods
US20180191061A1 (en) * 2017-01-05 2018-07-05 Intel Corporation Process technology for embedded horn structures with printed circuit boards
ES2742254T3 (es) * 2017-07-25 2020-02-13 Md Elektronik Gmbh Unión de conexión con una disposición de cable y una disposición de placa, así como método para establecer esta unión de conexión
DE102019118733B3 (de) * 2019-07-10 2020-06-18 Md Elektronik Gmbh Anschlussverbindung mit einer Hybridkabelanordnung und einer Leiterplattenanordnung
JP7332026B2 (ja) * 2020-07-22 2023-08-23 日本電信電話株式会社 高周波パッケージ
JP7453891B2 (ja) * 2020-10-06 2024-03-21 日本航空電子工業株式会社 電気部品検査器具
US11903124B2 (en) * 2021-08-10 2024-02-13 Rockwell Collins, Inc. Wide band printed circuit board through connector
WO2023027874A1 (en) * 2021-08-27 2023-03-02 Commscope Technologies Llc Connection assembly for antenna and base station antenna
US12068519B2 (en) * 2021-12-20 2024-08-20 Lawrence Livermore National Security, Llc Gyromagnetic nonlinear transmission line for radio frequency signal generation and pulse compression

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US4846696A (en) * 1988-06-15 1989-07-11 M/A-Com Omni Spectra, Inc. Microwave stripline connector
US5923234A (en) * 1997-10-27 1999-07-13 Lockheed Martin Corp. Hermetic feedthrough using three-via transmission lines
JP2001102817A (ja) 1999-09-29 2001-04-13 Nec Corp 高周波回路及び該高周波回路を用いたシールディドループ型磁界検出器
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JP3976473B2 (ja) * 2000-05-09 2007-09-19 日本電気株式会社 高周波回路及びそれを用いたモジュール、通信機

Also Published As

Publication number Publication date
EP1341254A3 (de) 2003-09-17
US20030164244A1 (en) 2003-09-04
EP1341254B1 (de) 2004-12-22
JP2003258403A (ja) 2003-09-12
DE60300223T2 (de) 2005-12-08
US6980068B2 (en) 2005-12-27
EP1341254A2 (de) 2003-09-03
JP3998996B2 (ja) 2007-10-31

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