DE60239779D1 - Keramisches MEMS-Bauelement - Google Patents

Keramisches MEMS-Bauelement

Info

Publication number
DE60239779D1
DE60239779D1 DE60239779T DE60239779T DE60239779D1 DE 60239779 D1 DE60239779 D1 DE 60239779D1 DE 60239779 T DE60239779 T DE 60239779T DE 60239779 T DE60239779 T DE 60239779T DE 60239779 D1 DE60239779 D1 DE 60239779D1
Authority
DE
Germany
Prior art keywords
mems device
ceramic mems
ceramic
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60239779T
Other languages
English (en)
Inventor
Yukihisa Takeuchi
Tsutomu Nanataki
Koji Kimura
Masao Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE60239779D1 publication Critical patent/DE60239779D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/09—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02133—Means for compensation or elimination of undesirable effects of stress
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/12—Mounting in enclosures for networks with interaction of optical and acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/173—Air-gaps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/176—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of ceramic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Compositions Of Oxide Ceramics (AREA)
DE60239779T 2001-08-31 2002-08-29 Keramisches MEMS-Bauelement Expired - Lifetime DE60239779D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001263857 2001-08-31
JP2002246484A JP4074493B2 (ja) 2001-08-31 2002-08-27 セラミック素子

Publications (1)

Publication Number Publication Date
DE60239779D1 true DE60239779D1 (de) 2011-06-01

Family

ID=26621415

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60239779T Expired - Lifetime DE60239779D1 (de) 2001-08-31 2002-08-29 Keramisches MEMS-Bauelement

Country Status (4)

Country Link
US (1) US6998763B2 (de)
EP (1) EP1291317B1 (de)
JP (1) JP4074493B2 (de)
DE (1) DE60239779D1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050012434A1 (en) * 2003-03-26 2005-01-20 Continuum Photonics, Inc. Robust piezoelectric power generation module
US7009328B2 (en) * 2003-06-20 2006-03-07 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device made of piezoelectric/electrostrictive film and manufacturing method
JP4228827B2 (ja) * 2003-07-31 2009-02-25 パナソニック電工株式会社 圧電型超音波センサ及びその共振周波数調節方法
JP2005073175A (ja) 2003-08-27 2005-03-17 Fujitsu Media Device Kk 圧電薄膜共振子及びその製造方法
KR100622955B1 (ko) * 2004-04-06 2006-09-18 삼성전자주식회사 박막 벌크 음향 공진기 및 그 제조방법
KR100631216B1 (ko) * 2004-05-17 2006-10-04 삼성전자주식회사 에어갭형 박막벌크음향공진기 및 그 제조방법
JP2006148402A (ja) * 2004-11-18 2006-06-08 Matsushita Electric Ind Co Ltd 共振器の製造方法
US7562429B2 (en) * 2005-06-20 2009-07-21 Avago Technologies General Ip (Singapore) Pte. Ltd. Suspended device and method of making
JP4896487B2 (ja) * 2005-10-17 2012-03-14 日本碍子株式会社 誘電体デバイスの製造方法、及び誘電体デバイス
EP2124269B1 (de) * 2007-02-20 2013-05-08 NGK Insulators, Ltd. Piezoelektrisches bauelement
JP4640459B2 (ja) * 2008-07-04 2011-03-02 ソニー株式会社 角速度センサ
US8448494B2 (en) 2008-12-30 2013-05-28 Stmicroelectronics S.R.L. Integrated electronic microbalance plus chemical sensor
EP2254243B1 (de) * 2009-05-20 2011-10-05 STmicroelectronics SA Akustischer Volumenwellenresonator und Herstellungsverfahren dafür
US8499613B2 (en) * 2010-01-29 2013-08-06 Stmicroelectronics S.R.L. Integrated chemical sensor for detecting odorous matters
US9180451B2 (en) 2010-06-28 2015-11-10 Stmicroelectronics S.R.L. Fluidic cartridge for detecting chemicals in samples, in particular for performing biochemical analyses
US20120167392A1 (en) 2010-12-30 2012-07-05 Stmicroelectronics Pte. Ltd. Razor with chemical and biological sensor
JP5827866B2 (ja) * 2011-10-20 2015-12-02 日本碍子株式会社 膜型圧電／電歪素子およびその製造方法
US9027400B2 (en) 2011-12-02 2015-05-12 Stmicroelectronics Pte Ltd. Tunable humidity sensor with integrated heater
US9019688B2 (en) 2011-12-02 2015-04-28 Stmicroelectronics Pte Ltd. Capacitance trimming with an integrated heater
JP6460387B2 (ja) 2015-01-26 2019-01-30 Tdk株式会社 圧電薄膜素子、圧電アクチュエータ、圧電センサ、並びにハードディスクドライブ、及びインクジェットプリンタ装置
JP2017103267A (ja) * 2015-11-30 2017-06-08 セイコーエプソン株式会社 圧電素子、圧電素子の形成方法および超音波装置
WO2020026611A1 (ja) * 2018-07-30 2020-02-06 株式会社村田製作所 圧電デバイス

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
DE69026765T2 (de) * 1989-07-11 1996-10-24 Ngk Insulators Ltd Einen piezoelektrischen/elektrostriktiven Film enthaltende piezoelektrischer/elektrostriktiver Antrieb
JP2842448B2 (ja) 1989-07-11 1999-01-06 日本碍子株式会社 圧電／電歪膜型アクチュエータ
JP2693291B2 (ja) 1990-07-26 1997-12-24 日本碍子株式会社 圧電／電歪アクチュエータ
US5210455A (en) 1990-07-26 1993-05-11 Ngk Insulators, Ltd. Piezoelectric/electrostrictive actuator having ceramic substrate having recess defining thin-walled portion
US5233259A (en) * 1991-02-19 1993-08-03 Westinghouse Electric Corp. Lateral field FBAR
JPH04337681A (ja) 1991-05-14 1992-11-25 Onoda Cement Co Ltd 積層型固体変位素子
JPH0530763A (ja) 1991-07-23 1993-02-05 Ube Ind Ltd アクチユエータ
JPH0624842A (ja) 1992-07-03 1994-02-01 Honda Motor Co Ltd 圧電電歪セラミック材料
US5504388A (en) 1993-03-12 1996-04-02 Ngk Insulators, Ltd. Piezoelectric/electrostrictive element having electrode film(s) with specified surface roughness
US5729262A (en) * 1993-08-31 1998-03-17 Ricoh Company, Ltd. Ink jet head including phase transition material actuators
US6049158A (en) 1994-02-14 2000-04-11 Ngk Insulators, Ltd. Piezoelectric/electrostrictive film element having convex diaphragm portions and method of producing the same
JP3187669B2 (ja) 1994-04-01 2001-07-11 日本碍子株式会社 ディスプレイ素子及びディスプレイ装置
JP3471447B2 (ja) 1994-11-16 2003-12-02 日本碍子株式会社 セラミックダイヤフラム構造体およびその製造方法
JP3501860B2 (ja) 1994-12-21 2004-03-02 日本碍子株式会社 圧電／電歪膜型素子及びその製造方法
JP2703207B2 (ja) 1995-01-30 1998-01-26 松下電工株式会社 ジルコニア系複合セラミック焼結体及びその製法
JP3344888B2 (ja) 1995-12-28 2002-11-18 日本碍子株式会社 圧電／電歪膜型素子及びその製造方法
US6091182A (en) 1996-11-07 2000-07-18 Ngk Insulators, Ltd. Piezoelectric/electrostrictive element
WO1998024130A1 (fr) 1996-11-29 1998-06-04 Ngk Insulators, Ltd. Element ceramique, procede de fabrication d'un element ceramique, ceramique, dispositif de relais, et condensateur
JPH10211698A (ja) 1997-01-30 1998-08-11 Ricoh Co Ltd インクジェット記録用ヘッド
JPH11121820A (ja) * 1997-10-09 1999-04-30 Hitachi Ltd 積層型圧電アクチュエータ
US6518690B2 (en) 2000-04-19 2003-02-11 Ngk Insulators, Ltd. Piezoelectric/electrostrictive film type elements and process for producing the same
WO2002052657A1 (fr) 2000-12-22 2002-07-04 Ngk Insulators,Ltd. Actionneur matriciel

Also Published As

Publication number Publication date
JP4074493B2 (ja) 2008-04-09
EP1291317B1 (de) 2011-04-20
US20030062807A1 (en) 2003-04-03
US6998763B2 (en) 2006-02-14
EP1291317A3 (de) 2005-04-06
JP2003152235A (ja) 2003-05-23
EP1291317A2 (de) 2003-03-12

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