DE60211672D1 - Ionenstrahlerzeugungsvorrichtung - Google Patents

Ionenstrahlerzeugungsvorrichtung

Info

Publication number
DE60211672D1
DE60211672D1 DE60211672T DE60211672T DE60211672D1 DE 60211672 D1 DE60211672 D1 DE 60211672D1 DE 60211672 T DE60211672 T DE 60211672T DE 60211672 T DE60211672 T DE 60211672T DE 60211672 D1 DE60211672 D1 DE 60211672D1
Authority
DE
Germany
Prior art keywords
axis
ion beam
ions
generating apparatus
beam generating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60211672T
Other languages
English (en)
Other versions
DE60211672T2 (de
Inventor
Jacques Gierak
Yvon Lagadec
Albert Septier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National de la Recherche Scientifique CNRS
Original Assignee
Centre National de la Recherche Scientifique CNRS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre National de la Recherche Scientifique CNRS filed Critical Centre National de la Recherche Scientifique CNRS
Application granted granted Critical
Publication of DE60211672D1 publication Critical patent/DE60211672D1/de
Publication of DE60211672T2 publication Critical patent/DE60211672T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J27/00Ion beam tubes
    • H01J27/02Ion sources; Ion guns
    • H01J27/26Ion sources; Ion guns using surface ionisation, e.g. field effect ion sources, thermionic ion sources
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J27/00Ion beam tubes
    • H01J27/02Ion sources; Ion guns
    • H01J27/022Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J27/00Ion beam tubes
    • H01J27/02Ion sources; Ion guns
    • H01J27/20Ion sources; Ion guns using particle beam bombardment, e.g. ionisers
    • H01J27/22Metal ion sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/08Ion sources; Ion guns
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/09Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002Details
    • H01J37/3007Electron or ion-optical systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045Object or beam position registration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H01J37/3053Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
    • H01J37/3056Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching for microworking, e.g. etching of gratings, trimming of electrical components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02Details
    • H01J2237/024Moving components not otherwise provided for
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06Sources
    • H01J2237/08Ion sources
    • H01J2237/0802Field ionization sources
    • H01J2237/0805Liquid metal sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15Means for deflecting or directing discharge
    • H01J2237/1501Beam alignment means or procedures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15Means for deflecting or directing discharge
    • H01J2237/1502Mechanical adjustments
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/304Controlling tubes
    • H01J2237/30433System calibration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/3174Etching microareas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Plasma & Fusion (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Physical Vapour Deposition (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Drying Of Semiconductors (AREA)
DE60211672T 2001-03-28 2002-03-26 Ionenstrahlerzeugungsvorrichtung Expired - Lifetime DE60211672T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0104173A FR2823005B1 (fr) 2001-03-28 2001-03-28 Dispositif de generation d'un faisceau d'ions et procede de reglage de ce faisceau
FR0104173 2001-03-28
PCT/FR2002/001041 WO2002078036A2 (fr) 2001-03-28 2002-03-26 Dispositif de generation d'un faisceau d'ions

Publications (2)

Publication Number Publication Date
DE60211672D1 true DE60211672D1 (de) 2006-06-29
DE60211672T2 DE60211672T2 (de) 2007-05-03

Family

ID=8861630

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60211672T Expired - Lifetime DE60211672T2 (de) 2001-03-28 2002-03-26 Ionenstrahlerzeugungsvorrichtung
DE60228637T Expired - Lifetime DE60228637D1 (de) 2001-03-28 2002-03-26 Verfahren zur Regelung eines Ionenstrahls

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60228637T Expired - Lifetime DE60228637D1 (de) 2001-03-28 2002-03-26 Verfahren zur Regelung eines Ionenstrahls

Country Status (9)

Country Link
US (1) US6864495B2 (de)
EP (2) EP1699067B1 (de)
JP (1) JP2004527078A (de)
AT (2) ATE406665T1 (de)
CA (1) CA2442189C (de)
DE (2) DE60211672T2 (de)
ES (2) ES2313542T3 (de)
FR (1) FR2823005B1 (de)
WO (1) WO2002078036A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4611755B2 (ja) * 2005-01-13 2011-01-12 株式会社日立ハイテクノロジーズ 走査電子顕微鏡及びその撮像方法
EP1752992A1 (de) * 2005-08-12 2007-02-14 Siemens Aktiengesellschaft Vorrichtung zur Anpassung mindestens eines Partikelstrahlparameters eines Partikelstrahls einer Partikelbeschleunigeranlage und Partikelbeschleunigeranlage mit einer derartigen Vorrichtung
CN101461026B (zh) 2006-06-07 2012-01-18 Fei公司 与包含真空室的装置一起使用的滑动轴承
WO2010029269A1 (fr) * 2008-09-15 2010-03-18 Centre National De La Recherche Scientifique (C.N.R.S) Dispositif de génération d'un faisceau d'ions avec filtre magnétique
FR2936092B1 (fr) * 2008-09-15 2012-04-06 Centre Nat Rech Scient Dispositif de generation d'un faisceau d'ions avec piege cryogenique.
FR2936091B1 (fr) * 2008-09-15 2010-10-29 Centre Nat Rech Scient Dispositif de generation d'un faisceau d'ions avec filtre magnetique.
US9006688B2 (en) * 2009-04-08 2015-04-14 Varian Semiconductor Equipment Associates, Inc. Techniques for processing a substrate using a mask
US8900982B2 (en) * 2009-04-08 2014-12-02 Varian Semiconductor Equipment Associates, Inc. Techniques for processing a substrate
US9076914B2 (en) * 2009-04-08 2015-07-07 Varian Semiconductor Equipment Associates, Inc. Techniques for processing a substrate
FR3094046B1 (fr) * 2019-03-18 2021-04-23 Centre Nat Rech Scient Procédé de contrôle d’un propulseur ionique, et système de propulsion ionique

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4426582A (en) * 1980-01-21 1984-01-17 Oregon Graduate Center Charged particle beam apparatus and method utilizing liquid metal field ionization source and asymmetric three element lens system
JPS5856332A (ja) * 1981-09-30 1983-04-04 Hitachi Ltd マスクの欠陥修正方法
JPS6062045A (ja) * 1983-09-14 1985-04-10 Hitachi Ltd イオンマイクロビ−ム打込み装置
JPS6190161A (ja) * 1984-10-09 1986-05-08 Seiko Instr & Electronics Ltd 集束イオンビ−ムのビ−ム形状調整方法
JPS63305358A (ja) * 1987-06-05 1988-12-13 Seiko Instr & Electronics Ltd パターン膜修正方法
US5149976A (en) * 1990-08-31 1992-09-22 Hughes Aircraft Company Charged particle beam pattern generation apparatus and method
FR2722333B1 (fr) * 1994-07-07 1996-09-13 Rech Scient Snrs Centre Nat De Source d'ions de metaux liquides
EP0706199B1 (de) 1994-10-07 2003-07-02 International Business Machines Corporation Flüssige ionische Zusammensetzungen verwendende Ionenpunktquellen hoher Luminosität
JP3305553B2 (ja) * 1995-11-17 2002-07-22 株式会社荏原製作所 高速原子線源
US5916424A (en) * 1996-04-19 1999-06-29 Micrion Corporation Thin film magnetic recording heads and systems and methods for manufacturing the same
WO2002025692A1 (en) * 2000-09-20 2002-03-28 Fei Company Real time monitoring for simultaneous imaging and exposure in charged particle beam systems

Also Published As

Publication number Publication date
CA2442189C (fr) 2014-09-30
US6864495B2 (en) 2005-03-08
FR2823005A1 (fr) 2002-10-04
JP2004527078A (ja) 2004-09-02
DE60211672T2 (de) 2007-05-03
FR2823005B1 (fr) 2003-05-16
WO2002078036A2 (fr) 2002-10-03
EP1374270A2 (de) 2004-01-02
EP1699067A2 (de) 2006-09-06
ATE406665T1 (de) 2008-09-15
EP1699067B1 (de) 2008-08-27
EP1699067A3 (de) 2007-06-06
ES2265496T3 (es) 2007-02-16
ATE327570T1 (de) 2006-06-15
EP1374270B1 (de) 2006-05-24
ES2313542T3 (es) 2009-03-01
WO2002078036A3 (fr) 2002-11-14
US20040094725A1 (en) 2004-05-20
CA2442189A1 (fr) 2002-10-03
DE60228637D1 (de) 2008-10-09

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Legal Events

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