DE60209065D1 - Verfahren zur Herstellung einer Halbleitervorrichtung - Google Patents

Verfahren zur Herstellung einer Halbleitervorrichtung

Info

Publication number
DE60209065D1
DE60209065D1 DE60209065T DE60209065T DE60209065D1 DE 60209065 D1 DE60209065 D1 DE 60209065D1 DE 60209065 T DE60209065 T DE 60209065T DE 60209065 T DE60209065 T DE 60209065T DE 60209065 D1 DE60209065 D1 DE 60209065D1
Authority
DE
Germany
Prior art keywords
producing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60209065T
Other languages
English (en)
Other versions
DE60209065T2 (de
Inventor
Taiji Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60209065D1 publication Critical patent/DE60209065D1/de
Publication of DE60209065T2 publication Critical patent/DE60209065T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
    • H01L21/2652—Through-implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025—Channel region of field-effect devices
    • H01L29/1029—Channel region of field-effect devices of field-effect transistors
    • H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
    • H01L29/1041—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568—Lateral single gate silicon transistors
    • H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
    • H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Recrystallisation Techniques (AREA)
DE60209065T 2001-09-07 2002-09-05 Verfahren zur Herstellung einer Halbleitervorrichtung Expired - Lifetime DE60209065T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001271330A JP3481223B2 (ja) 2001-09-07 2001-09-07 半導体装置の製造方法
JP2001271330 2001-09-07

Publications (2)

Publication Number Publication Date
DE60209065D1 true DE60209065D1 (de) 2006-04-20
DE60209065T2 DE60209065T2 (de) 2006-07-20

Family

ID=19096853

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60209065T Expired - Lifetime DE60209065T2 (de) 2001-09-07 2002-09-05 Verfahren zur Herstellung einer Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US6709961B2 (de)
EP (1) EP1291905B1 (de)
JP (1) JP3481223B2 (de)
DE (1) DE60209065T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6797593B2 (en) * 2002-09-13 2004-09-28 Texas Instruments Incorporated Methods and apparatus for improved mosfet drain extension activation
US7163867B2 (en) * 2003-07-28 2007-01-16 International Business Machines Corporation Method for slowing down dopant-enhanced diffusion in substrates and devices fabricated therefrom
US7071069B2 (en) * 2003-12-22 2006-07-04 Chartered Semiconductor Manufacturing, Ltd Shallow amorphizing implant for gettering of deep secondary end of range defects
US7172954B2 (en) * 2005-05-05 2007-02-06 Infineon Technologies Ag Implantation process in semiconductor fabrication
KR100702131B1 (ko) 2005-11-25 2007-03-30 주식회사 하이닉스반도체 반도체 소자의 제조방법
US8178430B2 (en) * 2009-04-08 2012-05-15 International Business Machines Corporation N-type carrier enhancement in semiconductors
US8269931B2 (en) 2009-09-14 2012-09-18 The Aerospace Corporation Systems and methods for preparing films using sequential ion implantation, and films formed using same
JP5527080B2 (ja) * 2010-07-22 2014-06-18 富士通セミコンダクター株式会社 半導体装置の製造方法
US8946864B2 (en) 2011-03-16 2015-02-03 The Aerospace Corporation Systems and methods for preparing films comprising metal using sequential ion implantation, and films formed using same
US9324579B2 (en) 2013-03-14 2016-04-26 The Aerospace Corporation Metal structures and methods of using same for transporting or gettering materials disposed within semiconductor substrates
JP6083404B2 (ja) * 2014-03-17 2017-02-22 信越半導体株式会社 半導体基板の評価方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW304301B (de) * 1994-12-01 1997-05-01 At & T Corp
US5793088A (en) * 1996-06-18 1998-08-11 Integrated Device Technology, Inc. Structure for controlling threshold voltage of MOSFET
US5989963A (en) * 1997-07-21 1999-11-23 Advanced Micro Devices, Inc. Method for obtaining a steep retrograde channel profile
US6063682A (en) * 1998-03-27 2000-05-16 Advanced Micro Devices, Inc. Ultra-shallow p-type junction having reduced sheet resistance and method for producing shallow junctions
US6333217B1 (en) * 1999-05-14 2001-12-25 Matsushita Electric Industrial Co., Ltd. Method of forming MOSFET with channel, extension and pocket implants
KR100332107B1 (ko) * 1999-06-29 2002-04-10 박종섭 반도체 소자의 트랜지스터 제조 방법
US6245619B1 (en) * 2000-01-21 2001-06-12 International Business Machines Corporation Disposable-spacer damascene-gate process for SUB 0.05 μm MOS devices

Also Published As

Publication number Publication date
DE60209065T2 (de) 2006-07-20
EP1291905A3 (de) 2003-12-03
US6709961B2 (en) 2004-03-23
JP2003086791A (ja) 2003-03-20
EP1291905A2 (de) 2003-03-12
US20030049917A1 (en) 2003-03-13
JP3481223B2 (ja) 2003-12-22
EP1291905B1 (de) 2006-02-08

Similar Documents

Publication Publication Date Title
DE60113574D1 (de) Verfahren zur Herstellung einer Halbleitervorrichtung
DE60307157D1 (de) Verfahren zur Herstellung einer Halbleitervorrichtung
DE60044639D1 (de) Verfahren zur herstellung einer halbleitervorrichtung
DE60042254D1 (de) Verfahren zur Herstellung einer Halbleiter-Anordnung
DE60143882D1 (de) Verfahren zur Herstellung einer MOS-gesteuerten Halbleiteranordnung
DE60218802D1 (de) Verfahren zur Herstellung einer Vorrichtung
DE60042787D1 (de) Verfahren zur Herstellung einer verpackten Halbleiteranordnung
DE69918636D1 (de) Verfahren zur herstellung einer halbleitervorrichtung
DE60236402D1 (de) Verfahren zur Herstellung von Halbleitervorrichtungen
DE60022857D1 (de) Verfahren zur Herstellung eines Halbleiterbauelements
DE60203426D1 (de) Verfahren zur Herstellung einer Anzeigevorrichtung
DE60224735D1 (de) Verfahren zur Herstellung einer Prüfkarte
DE102005014722B8 (de) Verfahren zur Herstellung einer Halbleitervorrichtung
DE60321883D1 (de) Verfahren zur Herstellung einer Vorrichtung
DE69942812D1 (de) Verfahren zur Herstellung einer Halbleitervorrichtung
DE69836401D1 (de) Verfahren zur Herstellung einer Halbleiteranordnung
DE60038423D1 (de) Verfahren zur Herstellung eines Halbleiterbauelements
DE60044470D1 (de) Verfahren zur herstellung eines halbleiterelement
DE50113179D1 (de) Verfahren zur Herstellung eines Halbleiterbauelements
DE60323051D1 (de) Verfahren zur Herstellung einer Vorrichtung
DE69940737D1 (de) Verfahren zur herstellung einer halbleiteranordnung
DE60239472D1 (de) Verfahren zur herstellung einer anzeigeeinrichtung
DE60223328D1 (de) Verfahren zur Herstellung einer Halbleiteranordnung
DE50206834D1 (de) Verfahren zur herstellung einer rohrfeder
DE60207907D1 (de) Verfahren zur Herstellung einer Halbleiterschaltung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP