JP5527080B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP5527080B2 JP5527080B2 JP2010165317A JP2010165317A JP5527080B2 JP 5527080 B2 JP5527080 B2 JP 5527080B2 JP 2010165317 A JP2010165317 A JP 2010165317A JP 2010165317 A JP2010165317 A JP 2010165317A JP 5527080 B2 JP5527080 B2 JP 5527080B2
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- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823892—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]
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- H01L21/8232—Field-effect technology
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Description
先ず、図1を参照して、本願の発明者が行った基礎実験について説明する。ゲート酸化膜厚の異なる複数のトランジスタを集積する場合、全てのトランジスタへのチャネル注入を完了した後に、それぞれのトランジスタのゲート絶縁膜を形成するための複数の酸化工程が実行される。このとき、In注入を含むチャネル注入後にポストアニールとして1000〜1100℃の急速昇降温アニールを行ったとしても、In注入したトランジスタのゲート酸化膜の信頼性が劣化することが見出された。
次に、図19を参照して、第2実施形態に従った半導体装置の製造方法を説明する。この方法は、多くのステップを、図2を参照して説明した第1実施形態に係る方法と共通にする。故に、ここでは、第1実施形態と共通するステップについては、図2と同一の参照符号を付し、詳細には説明しない。
(付記1)
半導体基板の第1領域に、インジウムを注入する注入工程と、
前記注入工程の後に、前記第1領域および前記第1領域とは異なる第2領域に、第1の膜厚を有する第1ゲート絶縁膜を形成する酸化工程と、
前記第1領域の前記第1ゲート絶縁膜を除去する工程と、
前記酸化工程の後に、前記半導体基板を熱処理するアニール工程と、
前記アニール工程の後に、前記第1領域上に、第2の膜厚を有する第2ゲート絶縁膜を形成する工程と
を有し、
前記アニール工程における熱処理の降温レートは20℃/sec以上である
ことを特徴とする半導体装置の製造方法。
(付記2)
半導体基板の第1領域に、インジウムを注入する注入工程と、
前記注入工程の後に、前記第1領域および前記第1領域とは異なる第2領域に、第1の膜厚を有する第1ゲート絶縁膜を形成する酸化工程と、
前記第1領域の前記第1ゲート絶縁膜を除去する工程と、
前記酸化工程の後に、前記半導体基板を非酸化性雰囲気で熱処理するアニール工程と、
前記アニール工程の後に、前記第1領域上に、第2の膜厚を有する第2ゲート絶縁膜を形成する工程と
を有することを特徴とする半導体装置の製造方法。
(付記3)
前記アニール工程は、前記半導体基板を1000℃以上の温度でアニールすることを含むことを特徴とする付記1又は2に記載の半導体装置の製造方法。
(付記4)
前記アニール工程は、前記半導体基板を1000℃以上1100℃以下の温度でアニールすることを含むことを特徴とする付記1乃至3の何れか一に記載の半導体装置の製造方法。
(付記5)
前記アニール工程における熱処理の降温レートは20℃/sec以上であることを特徴とする付記1乃至4の何れか一に記載の半導体装置の製造方法。
(付記6)
前記アニール工程は、フラッシュランプアニール又はレーザーアニールにより前記半導体基板をアニールすることを含むことを特徴とする付記1乃至5の何れか一に記載の半導体装置の製造方法。
(付記7)
前記第2の膜厚は前記第1の膜厚よりも薄いことを特徴とする付記1乃至6の何れか一に記載の半導体装置の製造方法。
(付記8)
前記非酸化性雰囲気は水素雰囲気または窒素雰囲気であることを特徴とする付記1乃至7の何れか一に記載の半導体装置の製造方法。
(付記9)
前記注入工程と前記酸化工程との間に、前記インジウムを熱処理により活性化する工程を含むことを特徴とする付記1乃至8の何れか一に記載の半導体装置の製造方法。
(付記10)
前記アニール工程は、前記第1領域上の前記第1ゲート絶縁膜を除去した後に行なわれることを特徴とする付記1乃至9の何れか一に記載の半導体装置の製造方法。
(付記11)
前記アニール工程は、前記第1領域の前記第1ゲート絶縁膜を除去する工程の前に行われることを特徴とする付記1乃至9の何れか一に記載の半導体装置の製造方法。
(付記12)
前記第2ゲート絶縁膜は、前記第1ゲート絶縁膜より厚く形成されることを特徴とする付記1乃至11の何れか一に記載の半導体装置の製造方法。
(付記13)
第1のN型トランジスタ及び第2のトランジスタを含む半導体装置の製造方法であって、
前記第2のトランジスタのゲート絶縁膜を形成する酸化工程と、
前記酸化工程の後に、半導体基板の、前記第1のN型トランジスタのチャネル領域に相当する領域に、インジウムを注入する注入工程と、
前記注入工程の後に、前記半導体基板を熱処理するアニール工程と、
前記アニール工程の後に、前記チャネル領域上に前記第1のN型トランジスタのゲート絶縁膜を形成する工程と
を有し、
前記アニール工程における熱処理の降温レートは20℃/sec以上である
ことを特徴とする半導体装置の製造方法。
(付記14)
第1のN型トランジスタ及び第2のトランジスタを含む半導体装置の製造方法であって、
前記第2のトランジスタのゲート絶縁膜を形成する酸化工程と、
前記酸化工程の後に、半導体基板の、前記第1のN型トランジスタのチャネル領域に相当する領域に、インジウムを注入する注入工程と、
前記注入工程の後に、前記半導体基板を非酸化雰囲気で熱処理するアニール工程と、
前記アニール工程の後に、前記チャネル領域上に前記第1のN型トランジスタのゲート絶縁膜を形成する工程と
を有することを特徴とする半導体装置の製造方法。
(付記15)
前記アニール工程は、前記半導体基板を1000℃以上の温度でアニールすることを含むことを特徴とする付記13又は14に記載の半導体装置の製造方法。
(付記16)
前記アニール工程における熱処理の降温レートは20℃/sec以上であることを特徴とする付記13乃至15の何れか一に記載の半導体装置の製造方法。
(付記17)
前記酸化工程に先立って、
前記第1のN型トランジスタ及び前記第2のトランジスタのウェルを形成するための不純物を注入し、且つ前記第2のトランジスタのチャネル領域に不純物を注入するウェル・チャネル注入工程と、
前記ウェル・チャネル注入工程により注入された不純物を熱処理により活性化する工程と
を更に有することを特徴とする付記13乃至16の何れか一に記載の半導体装置の製造方法。
(付記18)
前記ウェル・チャネル注入工程は、前記第1のN型トランジスタのチャネル領域に、インジウムと異なる不純物を注入することを含むことを特徴とする付記17に記載の半導体装置の製造方法。
(付記19)
前記注入工程は、前記第1のN型トランジスタのチャネル領域上に形成された前記第2のトランジスタ用の前記ゲート絶縁膜を介してインジウムを注入することを含み、
前記アニール工程は、前記第1のN型トランジスタのチャネル領域上の該ゲート絶縁膜を除去した後に、前記半導体基板を熱処理することを含む、
ことを特徴とする付記13乃至18の何れか一に記載の半導体装置の製造方法。
(付記20)
前記注入工程は、前記第1のN型トランジスタのチャネル領域上に形成された前記第2のトランジスタ用の前記ゲート絶縁膜を介してインジウムを注入することを含み、
前記アニール工程の後に、前記第1のN型トランジスタのチャネル領域上の該ゲート絶縁膜を除去する工程を更に含むことを特徴とする付記13乃至18の何れか一に記載の半導体装置の製造方法。
11 素子分離
12 酸化膜
13、14、21−26、32、34、52、55、57、64 レジスト
31、33、35 ゲート絶縁膜
41 ゲート電極
51 LDD領域
54 サイドウォール
56 ソース/ドレイン領域
58 シリサイド層
61、62、63 層間膜
66 コンタクト
Claims (14)
- 半導体基板の第1領域に、インジウムを注入する注入工程と、
前記注入工程の後に、前記第1領域および前記第1領域とは異なる第2領域に、第1の膜厚を有する第1ゲート絶縁膜を形成する酸化工程と、
前記第1領域の前記第1ゲート絶縁膜を除去する工程と、
前記酸化工程の後に、前記半導体基板を熱処理するアニール工程と、
前記アニール工程の後に、前記第1領域上に、第2の膜厚を有する第2ゲート絶縁膜を形成する工程と
を有し、
前記アニール工程における熱処理の降温レートは20℃/sec以上である
ことを特徴とする半導体装置の製造方法。 - 半導体基板の第1領域に、インジウムを注入する注入工程と、
前記注入工程の後に、前記第1領域および前記第1領域とは異なる第2領域に、第1の膜厚を有する第1ゲート絶縁膜を形成する酸化工程と、
前記第1領域の前記第1ゲート絶縁膜を除去する工程と、
前記酸化工程の後に、前記半導体基板を非酸化性雰囲気で熱処理するアニール工程と、
前記アニール工程の後に、前記第1領域上に、第2の膜厚を有する第2ゲート絶縁膜を形成する工程と
を有することを特徴とする半導体装置の製造方法。 - 前記アニール工程は、前記半導体基板を1000℃以上の温度でアニールすることを含むことを特徴とする請求項1又は2に記載の半導体装置の製造方法。
- 前記アニール工程における熱処理の降温レートは20℃/sec以上であることを特徴とする請求項1乃至3の何れか一項に記載の半導体装置の製造方法。
- 前記第2の膜厚は前記第1の膜厚よりも薄いことを特徴とする請求項1乃至4の何れか一項に記載の半導体装置の製造方法。
- 前記注入工程と前記酸化工程との間に、前記インジウムを熱処理により活性化する工程を含むことを特徴とする請求項1乃至5の何れか一項に記載の半導体装置の製造方法。
- 前記アニール工程は、前記第1領域上の前記第1ゲート絶縁膜を除去した後に行なわれることを特徴とする請求項1乃至6の何れか一項に記載の半導体装置の製造方法。
- 前記アニール工程は、前記第1領域の前記第1ゲート絶縁膜を除去する工程の前に行われることを特徴とする請求項1乃至6の何れか一項に記載の半導体装置の製造方法。
- 第1のN型トランジスタ及び第2のトランジスタを含む半導体装置の製造方法であって、
前記第2のトランジスタのゲート絶縁膜を形成する酸化工程と、
前記酸化工程の後に、半導体基板の、前記第1のN型トランジスタのチャネル領域に相当する領域に、インジウムを注入する注入工程と、
前記注入工程の後に、前記半導体基板を熱処理するアニール工程と、
前記アニール工程の後に、前記チャネル領域上に前記第1のN型トランジスタのゲート絶縁膜を形成する工程と
を有し、
前記アニール工程における熱処理の降温レートは20℃/sec以上である
ことを特徴とする半導体装置の製造方法。 - 第1のN型トランジスタ及び第2のトランジスタを含む半導体装置の製造方法であって、
前記第2のトランジスタのゲート絶縁膜を形成する酸化工程と、
前記酸化工程の後に、半導体基板の、前記第1のN型トランジスタのチャネル領域に相当する領域に、インジウムを注入する注入工程と、
前記注入工程の後に、前記半導体基板を非酸化雰囲気で熱処理するアニール工程と、
前記アニール工程の後に、前記チャネル領域上に前記第1のN型トランジスタのゲート絶縁膜を形成する工程と
を有することを特徴とする半導体装置の製造方法。 - 前記アニール工程は、前記半導体基板を1000℃以上の温度でアニールすることを含むことを特徴とする請求項9又は10に記載の半導体装置の製造方法。
- 前記酸化工程に先立って、
前記第1のN型トランジスタ及び前記第2のトランジスタのウェルを形成するための不純物を注入し、且つ前記第2のトランジスタのチャネル領域に不純物を注入するウェル・チャネル注入工程と、
前記ウェル・チャネル注入工程により注入された不純物を熱処理により活性化する工程と
を更に有することを特徴とする請求項9乃至11の何れか一項に記載の半導体装置の製造方法。 - 前記注入工程は、前記第1のN型トランジスタのチャネル領域上に形成された前記第2のトランジスタ用の前記ゲート絶縁膜を介してインジウムを注入することを含み、
前記アニール工程は、前記第1のN型トランジスタのチャネル領域上の該ゲート絶縁膜を除去した後に、前記半導体基板を熱処理することを含む、
ことを特徴とする請求項9乃至12の何れか一項に記載の半導体装置の製造方法。 - 前記注入工程は、前記第1のN型トランジスタのチャネル領域上に形成された前記第2のトランジスタ用の前記ゲート絶縁膜を介してインジウムを注入することを含み、
前記アニール工程の後に、前記第1のN型トランジスタのチャネル領域上の該ゲート絶縁膜を除去する工程を更に含むことを特徴とする請求項9乃至12の何れか一項に記載の半導体装置の製造方法。
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