DE60208625D1 - Vorrichtung zur Bedienerunterstützung bei manuellen Arbeitsvorgängen in Verbindung mit Bauteilezuführungseinrichtungen - Google Patents

Vorrichtung zur Bedienerunterstützung bei manuellen Arbeitsvorgängen in Verbindung mit Bauteilezuführungseinrichtungen

Info

Publication number
DE60208625D1
DE60208625D1 DE60208625T DE60208625T DE60208625D1 DE 60208625 D1 DE60208625 D1 DE 60208625D1 DE 60208625 T DE60208625 T DE 60208625T DE 60208625 T DE60208625 T DE 60208625T DE 60208625 D1 DE60208625 D1 DE 60208625D1
Authority
DE
Germany
Prior art keywords
operations associated
manual operations
operator assistance
component feeders
feeders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60208625T
Other languages
English (en)
Other versions
DE60208625T2 (de
Inventor
Takayoshi Kawai
Shinsuke Suhara
Yusuke Tsuchiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Application granted granted Critical
Publication of DE60208625D1 publication Critical patent/DE60208625D1/de
Publication of DE60208625T2 publication Critical patent/DE60208625T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0857—Product-specific machine setup; Changeover of machines or assembly lines to new product type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/0888—Ergonomics; Operator safety; Training; Failsafe systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE60208625T 2001-03-06 2002-03-06 Vorrichtung zur Bedienerunterstützung bei manuellen Arbeitsvorgängen in Verbindung mit Bauteilezuführungseinrichtungen Expired - Lifetime DE60208625T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001062183A JP4733281B2 (ja) 2001-03-06 2001-03-06 対フィーダ作業支援装置
JP2001062183 2001-03-06

Publications (2)

Publication Number Publication Date
DE60208625D1 true DE60208625D1 (de) 2006-04-06
DE60208625T2 DE60208625T2 (de) 2006-09-14

Family

ID=18921360

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60208625T Expired - Lifetime DE60208625T2 (de) 2001-03-06 2002-03-06 Vorrichtung zur Bedienerunterstützung bei manuellen Arbeitsvorgängen in Verbindung mit Bauteilezuführungseinrichtungen

Country Status (4)

Country Link
US (1) US6918730B2 (de)
EP (1) EP1239720B1 (de)
JP (1) JP4733281B2 (de)
DE (1) DE60208625T2 (de)

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US7555831B2 (en) * 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7813559B2 (en) * 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
EP1343363A1 (de) * 2002-03-08 2003-09-10 TraceXpert A/S Prüfung einer Zufuhreinrichtung mit einer Kamera
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
JP2005183679A (ja) * 2003-12-19 2005-07-07 Hitachi High-Tech Instruments Co Ltd 電子部品装着システム及び電子部品装着方法
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US7089074B2 (en) * 2004-11-10 2006-08-08 Universal Instruments Corporation Host feeder setup validation
JP4896136B2 (ja) * 2005-09-14 2012-03-14 サイバーオプティクス コーポレーション 改善された構成部品ピックイメージ処理を備えたピックアンドプレース機
JP2008085076A (ja) * 2006-09-27 2008-04-10 Juki Corp 部品実装機のメンテナンス情報管理装置
JP5293705B2 (ja) 2010-08-30 2013-09-18 富士通株式会社 部品管理装置、段替え支援方法、段替え支援プログラム、部品管理システム及び基板ユニットの製造方法
CN102050330B (zh) * 2010-11-05 2013-02-06 深圳市华星光电技术有限公司 机械手臂及具有该机械手臂的搬运装置
EP3557965A1 (de) 2012-03-12 2019-10-23 Mycronic AB Vorrichtung zur automatischen speicherung von elektronischen komponenten
JP5758541B2 (ja) * 2012-03-13 2015-08-05 富士機械製造株式会社 部品実装機のフィーダ管理システム
US20130277422A1 (en) * 2012-04-22 2013-10-24 Abb Inc. System and method for requesting and delivering targeted information
JP6232202B2 (ja) * 2012-05-02 2017-11-15 Juki株式会社 生産システム及びデータ生成方法
JP5872969B2 (ja) * 2012-06-08 2016-03-01 ヤマハ発動機株式会社 部品供給装置及び表面実装機
JP6402882B2 (ja) * 2013-09-19 2018-10-10 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法
JP6802782B2 (ja) * 2015-03-02 2020-12-23 株式会社Ｆｕｊｉ 部品実装装置、および部品実装装置における部品供給方法
JP6449431B2 (ja) * 2015-03-06 2019-01-09 株式会社Ｆｕｊｉ 部品種割り振りの最適化方法および部品種割り振りの最適化装置
EP3267780B1 (de) * 2015-03-06 2021-10-27 FUJI Corporation Verfahren zur optimierung der anordnung von teiltypen vorrichtung zur optimierung der anordnung von teiltypen
US10772249B2 (en) 2015-03-18 2020-09-08 Mycronic AB Method, system and device for providing and changing information related to an SMT job
JP6467634B2 (ja) * 2015-06-09 2019-02-13 パナソニックＩｐマネジメント株式会社 部品実装システム及び部品実装システムにおける部品実装方法
US9769970B2 (en) * 2015-12-16 2017-09-19 Panasonic Factory Solutions Asia Pacific Apparatus and method for feeding electronic components for insertion onto circuit boards
US11415967B2 (en) 2017-08-04 2022-08-16 Electrolux Appliances Aktiebolag Method for assembling a cooling apparatus, an assembling line implementing the same, and a compartment of said cooling apparatus
JP6932785B2 (ja) * 2017-09-19 2021-09-08 株式会社Ｆｕｊｉ 部品実装システム
US11937376B2 (en) * 2018-05-31 2024-03-19 Fuji Corporation Determination device and component mounting apparatus
WO2019234817A1 (ja) * 2018-06-05 2019-12-12 株式会社Ｆｕｊｉ テープフィーダ
DE112018008156T5 (de) * 2018-11-20 2021-07-29 Yamaha Hatsudoki Kabushiki Kaisha Teileneubestückungssystem und Teileneubestückungsverfahren
WO2023181150A1 (ja) * 2022-03-23 2023-09-28 株式会社Fuji セットアップ支援装置及びセットアップ支援システム
WO2024079781A1 (ja) * 2022-10-11 2024-04-18 株式会社Fuji キッティング装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121900A (ja) * 1982-12-27 1984-07-14 トヨタ自動車株式会社 部品選択指示装置
US4869813A (en) * 1987-07-02 1989-09-26 Northrop Corporation Drill inspection and sorting method and apparatus
US5325305A (en) 1992-07-24 1994-06-28 The Boeing Company Automated setup verification system
US5283943A (en) 1992-08-31 1994-02-08 Kermit Aguayo Automated assembly apparatus
TW276353B (de) * 1993-07-15 1996-05-21 Hitachi Seisakusyo Kk
JPH1065399A (ja) * 1996-07-05 1998-03-06 Pekin Kaho Keito Kotei Yugenkoshi 電子部品実装装置へのパーツフィーダ誤挿入防止装置
US6027019A (en) 1997-09-10 2000-02-22 Kou; Yuen-Foo Michael Component feeder configuration monitoring
JP2000209000A (ja) * 1999-01-19 2000-07-28 Sanyo Electric Co Ltd 電子部品装着装置

Also Published As

Publication number Publication date
US6918730B2 (en) 2005-07-19
JP4733281B2 (ja) 2011-07-27
EP1239720B1 (de) 2006-01-11
DE60208625T2 (de) 2006-09-14
EP1239720A2 (de) 2002-09-11
US20020124391A1 (en) 2002-09-12
EP1239720A3 (de) 2003-05-21
JP2002271089A (ja) 2002-09-20

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