DE602008003275D1 - Vorrichtung zur Wärmeübertragung für ein Lichtventil - Google Patents
Vorrichtung zur Wärmeübertragung für ein LichtventilInfo
- Publication number
- DE602008003275D1 DE602008003275D1 DE602008003275T DE602008003275T DE602008003275D1 DE 602008003275 D1 DE602008003275 D1 DE 602008003275D1 DE 602008003275 T DE602008003275 T DE 602008003275T DE 602008003275 T DE602008003275 T DE 602008003275T DE 602008003275 D1 DE602008003275 D1 DE 602008003275D1
- Authority
- DE
- Germany
- Prior art keywords
- light valve
- heat transfer
- valve device
- cooling
- elongate members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
- H04N9/3144—Cooling systems
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Projection Apparatus (AREA)
- Temperature-Responsive Valves (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Basic Packing Technique (AREA)
- Details Of Valves (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0715575A GB2451684A (en) | 2007-08-09 | 2007-08-09 | Heat transfer apparatus for cooling a light valve or digital micro mirror |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602008003275D1 true DE602008003275D1 (de) | 2010-12-16 |
Family
ID=38543339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602008003275T Active DE602008003275D1 (de) | 2007-08-09 | 2008-08-08 | Vorrichtung zur Wärmeübertragung für ein Lichtventil |
Country Status (5)
Country | Link |
---|---|
US (1) | US7796383B2 (de) |
EP (1) | EP2034358B1 (de) |
AT (1) | ATE487160T1 (de) |
DE (1) | DE602008003275D1 (de) |
GB (1) | GB2451684A (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9228785B2 (en) | 2010-05-04 | 2016-01-05 | Alexander Poltorak | Fractal heat transfer device |
US10852069B2 (en) | 2010-05-04 | 2020-12-01 | Fractal Heatsink Technologies, LLC | System and method for maintaining efficiency of a fractal heat sink |
TWI425298B (zh) * | 2010-05-21 | 2014-02-01 | Delta Electronics Inc | 可撓性連接之數位微鏡模組及其適用之投影裝置 |
US9507391B2 (en) * | 2011-11-28 | 2016-11-29 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Heat sink with orientable fins |
CN103278925A (zh) * | 2012-12-28 | 2013-09-04 | 清华大学 | 变形镜中间式水冷散热机构 |
TWI559072B (zh) * | 2015-04-15 | 2016-11-21 | 中強光電股份有限公司 | 投影機及光機模組 |
JP6604745B2 (ja) * | 2015-05-15 | 2019-11-13 | キヤノン株式会社 | 光変調素子ユニットおよび画像投射装置 |
DE102015222508A1 (de) * | 2015-11-16 | 2017-05-18 | Robert Bosch Gmbh | Mikromechanisches Bauteil, Beleuchtungsvorrichtung und entsprechendes Herstellungsverfahren |
US10088739B2 (en) * | 2016-03-23 | 2018-10-02 | Panasonic Intellectual Property Management Co., Ltd. | Cooling device, optical module provided with the same, and projecting device |
JP7012199B2 (ja) * | 2016-03-23 | 2022-01-28 | パナソニックIpマネジメント株式会社 | 冷却装置、およびこれを備えた光学モジュール、投影装置 |
US10082665B2 (en) * | 2016-10-31 | 2018-09-25 | Hisense Co., Ltd. | DMD assembly, DLP optical engine and DLP projection device |
CN107045253B (zh) * | 2017-02-22 | 2018-11-02 | 海信集团有限公司 | 激光投影设备的器件保护方法及装置 |
US10261286B2 (en) | 2017-07-18 | 2019-04-16 | Xerox Corporation | Digital micromirror device cooling system and method |
WO2019020198A1 (en) * | 2017-07-28 | 2019-01-31 | Barco N.V. | DEVICES FOR SPATIAL LIGHT MODULATION WITH COOLING |
CN111344632B (zh) * | 2018-02-02 | 2021-12-03 | 麦克赛尔株式会社 | 光源装置、投影仪和照明装置 |
JP2022026131A (ja) * | 2020-07-30 | 2022-02-10 | パナソニックIpマネジメント株式会社 | 投写型映像表示装置 |
JP7153203B2 (ja) * | 2020-08-20 | 2022-10-14 | カシオ計算機株式会社 | 密閉部材、電子装置、電子装置の製造方法、光源装置及び投影装置 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL275274A (de) * | 1961-11-21 | |||
US5022462A (en) * | 1986-04-30 | 1991-06-11 | International Business Machines Corp. | Flexible finned heat exchanger |
GB9212674D0 (en) * | 1992-06-15 | 1992-07-29 | Rank Brimar Ltd | Multipin structures |
DE19515122C2 (de) | 1995-04-25 | 1997-10-02 | Kurt Wolf Gmbh & Co | Schaltschrank mit Baugruppen |
DE69620731T2 (de) * | 1995-12-15 | 2002-10-17 | Texas Instruments Inc | Verbesserungen für räumliche Lichtmodulatoren |
US5978228A (en) | 1996-12-31 | 1999-11-02 | Intel Corporation | Apparatus for mounting a very large scale integration (VLSI) chip to a computer chassis for cooling |
JPH10319381A (ja) * | 1997-05-20 | 1998-12-04 | Matsushita Electric Ind Co Ltd | ライトバルブ装置とその製造方法、及びライトバルブ装置を用いた液晶投写装置 |
US5852339A (en) | 1997-06-18 | 1998-12-22 | Northrop Grumman Corporation | Affordable electrodeless lighting |
KR100320983B1 (ko) | 1997-08-22 | 2002-06-20 | 포만 제프리 엘 | 칩조립체및직접적인개방열전도성경로의제공방법 |
DE19807094A1 (de) * | 1998-02-20 | 1999-08-26 | Zeiss Carl Fa | Optische Anordnung und Projektionsbelichtungsanlage der Mikrolithographie mit passiver thermischer Kompensation |
JP4006833B2 (ja) * | 1998-07-03 | 2007-11-14 | 株式会社日立製作所 | 光学装置 |
US6883592B2 (en) | 1998-11-04 | 2005-04-26 | Zalman Tech Co., Ltd. | Heatsink for electronic component |
JP2000231154A (ja) * | 1999-02-10 | 2000-08-22 | Hitachi Ltd | 表示装置及び表示光学系部 |
JP3267279B2 (ja) * | 1999-10-04 | 2002-03-18 | 株式会社日立製作所 | 表示装置 |
US6411513B1 (en) * | 1999-12-10 | 2002-06-25 | Jacques Normand Bedard | Compliant thermal interface devices and method of making the devices |
US6244332B1 (en) | 1999-12-17 | 2001-06-12 | Flextek Components, Inc. | Heat sink |
US7077526B2 (en) * | 2001-09-28 | 2006-07-18 | Texas Instruments Incorporated | Mechanically adjustable thermal path for projection display device cooling |
US6856446B2 (en) * | 2001-12-12 | 2005-02-15 | Texas Instruments Incorporated | Digital micromirror device having mirror-attached spring tips |
US6711015B2 (en) | 2002-02-04 | 2004-03-23 | Acer Inc. | Device for cooling CPU chip |
KR100464046B1 (ko) | 2002-03-14 | 2005-01-03 | 엘지전자 주식회사 | 컴퓨터의 냉각장치 |
TW585278U (en) * | 2002-11-21 | 2004-04-21 | Young Optics Inc | Cooling device for light valve |
US7264363B2 (en) * | 2002-12-23 | 2007-09-04 | Bae Systems Plc | Deformable-mirror cooling |
US6774482B2 (en) | 2002-12-27 | 2004-08-10 | International Business Machines Corporation | Chip cooling |
US20040190245A1 (en) * | 2003-03-31 | 2004-09-30 | Murli Tirumala | Radial heat sink with skived-shaped fin and methods of making same |
TWI334035B (en) * | 2003-06-02 | 2010-12-01 | Seiko Epson Corp | Digital micromirror device mounting system |
KR100601639B1 (ko) | 2003-06-24 | 2006-07-14 | 삼성전자주식회사 | 화상투사장치 |
JP3834819B2 (ja) * | 2003-07-17 | 2006-10-18 | 船井電機株式会社 | プロジェクタ |
US7063127B2 (en) | 2003-09-18 | 2006-06-20 | International Business Machines Corporation | Method and apparatus for chip-cooling |
US6958915B2 (en) * | 2003-10-07 | 2005-10-25 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating device for electronic component |
TWI247188B (en) * | 2003-12-29 | 2006-01-11 | Coretronic Corp | Cooling apparatus for light valve |
JP4438423B2 (ja) * | 2004-01-21 | 2010-03-24 | 株式会社日立製作所 | 投射型映像表示装置 |
JP2005241969A (ja) | 2004-02-26 | 2005-09-08 | Chinontec Kk | 光学装置用吸熱装置及びプロジェクタ装置 |
JP2006011114A (ja) | 2004-06-28 | 2006-01-12 | Plus Vision Corp | クロスローファンによる冷却構造を備えたプロジェクタ |
US7230334B2 (en) | 2004-11-12 | 2007-06-12 | International Business Machines Corporation | Semiconductor integrated circuit chip packages having integrated microchannel cooling modules |
US7301770B2 (en) * | 2004-12-10 | 2007-11-27 | International Business Machines Corporation | Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins |
JP2006189650A (ja) * | 2005-01-06 | 2006-07-20 | Toshiba Corp | 投写型表示装置および冷却構造 |
GB0511692D0 (en) * | 2005-06-08 | 2005-07-13 | Digital Projection Ltd | Heat transfer apparatus |
TW200727067A (en) * | 2006-01-10 | 2007-07-16 | Coretronic Corp | Projector and heat dissipation apparatus thereof |
-
2007
- 2007-08-09 GB GB0715575A patent/GB2451684A/en not_active Withdrawn
-
2008
- 2008-08-08 EP EP08252653A patent/EP2034358B1/de active Active
- 2008-08-08 AT AT08252653T patent/ATE487160T1/de not_active IP Right Cessation
- 2008-08-08 US US12/221,967 patent/US7796383B2/en not_active Expired - Fee Related
- 2008-08-08 DE DE602008003275T patent/DE602008003275D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
EP2034358A1 (de) | 2009-03-11 |
ATE487160T1 (de) | 2010-11-15 |
EP2034358B1 (de) | 2010-11-03 |
GB0715575D0 (en) | 2007-09-19 |
US20090046425A1 (en) | 2009-02-19 |
US7796383B2 (en) | 2010-09-14 |
GB2451684A (en) | 2009-02-11 |
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