DE602007009459D1 - Schneideverfahren für ein Klebeband und Vorrichtung zum Schneiden eines Klebebands - Google Patents

Schneideverfahren für ein Klebeband und Vorrichtung zum Schneiden eines Klebebands

Info

Publication number
DE602007009459D1
DE602007009459D1 DE200760009459 DE602007009459T DE602007009459D1 DE 602007009459 D1 DE602007009459 D1 DE 602007009459D1 DE 200760009459 DE200760009459 DE 200760009459 DE 602007009459 T DE602007009459 T DE 602007009459T DE 602007009459 D1 DE602007009459 D1 DE 602007009459D1
Authority
DE
Germany
Prior art keywords
adhesive tape
ring frame
cutting
cutter blade
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200760009459
Other languages
English (en)
Inventor
Masayuki Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602007009459D1 publication Critical patent/DE602007009459D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/02—Means for moving the cutting member into its operative position for cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Dicing (AREA)
DE200760009459 2006-09-07 2007-08-31 Schneideverfahren für ein Klebeband und Vorrichtung zum Schneiden eines Klebebands Active DE602007009459D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006243003A JP4953738B2 (ja) 2006-09-07 2006-09-07 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置

Publications (1)

Publication Number Publication Date
DE602007009459D1 true DE602007009459D1 (de) 2010-11-11

Family

ID=39102948

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200760009459 Active DE602007009459D1 (de) 2006-09-07 2007-08-31 Schneideverfahren für ein Klebeband und Vorrichtung zum Schneiden eines Klebebands

Country Status (8)

Country Link
US (1) US20080066849A1 (de)
EP (1) EP1912250B1 (de)
JP (1) JP4953738B2 (de)
KR (1) KR101359251B1 (de)
CN (1) CN101140856B (de)
AT (1) ATE483248T1 (de)
DE (1) DE602007009459D1 (de)
TW (1) TWI420583B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4974626B2 (ja) * 2006-09-20 2012-07-11 日東電工株式会社 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置
JP4746003B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
JP4995796B2 (ja) * 2008-09-30 2012-08-08 日東電工株式会社 粘着テープ貼付け方法および粘着テープ貼付け装置
JP5457014B2 (ja) * 2008-11-19 2014-04-02 三星ダイヤモンド工業株式会社 樹脂フィルムの切断方法及び切断装置並びにそれらに用いるカッター
JP5431053B2 (ja) * 2009-07-27 2014-03-05 日東電工株式会社 粘着テープ貼付け方法および粘着テープ貼付け装置
JP5417131B2 (ja) * 2009-11-20 2014-02-12 日東電工株式会社 粘着テープ貼付け装置および粘着テープ貼付け方法
JP4761088B1 (ja) * 2010-03-29 2011-08-31 株式会社東京精密 ダイシング装置及びダイシング方法
KR101028789B1 (ko) * 2010-07-06 2011-04-11 주식회사 아레스 링 테이핑장치
JP5591267B2 (ja) * 2012-03-09 2014-09-17 日東電工株式会社 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置
JP2014226743A (ja) * 2013-05-21 2014-12-08 三星ダイヤモンド工業株式会社 カッタユニット、切断装置、切断方法及びホルダー

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3057065A (en) * 1955-12-02 1962-10-09 Zimmerman Packing Company Gasket cutter
US4064627A (en) * 1976-12-15 1977-12-27 Vincent Zanfini Carpet cutter
US4620368A (en) * 1985-01-07 1986-11-04 Bowman Terry R Carpet cutting tool
JPH074148Y2 (ja) * 1988-03-10 1995-02-01 富士通株式会社 テープ切断装置
US5337482A (en) * 1992-08-06 1994-08-16 Pacific Handy Cutter, Inc. Safety blade for utility knife
JPH10116884A (ja) * 1996-10-11 1998-05-06 Teikoku Seiki Kk ウェハ保護テープ用カッター
KR100259015B1 (ko) * 1998-01-17 2000-06-15 윤종용 복수개의 테이프 절단기를 포함하는 테이프 부착 장치의테이프 절단부
JP2000317889A (ja) * 1999-04-30 2000-11-21 Brother Ind Ltd 裁断用カッタ装置
JP4201564B2 (ja) 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
JP2003209082A (ja) * 2002-01-15 2003-07-25 Nitto Denko Corp 保護テープの貼付方法およびその装置並びに保護テープの剥離方法
JP3983053B2 (ja) * 2002-01-17 2007-09-26 日東電工株式会社 保護テープの切断方法およびそれを用いた保護テープ貼付装置
JP4471563B2 (ja) * 2002-10-25 2010-06-02 株式会社ルネサステクノロジ 半導体装置の製造方法
JP4417028B2 (ja) * 2003-05-22 2010-02-17 株式会社タカトリ ダイシングフレームへのダイシングテープの貼り付け装置
SG148017A1 (en) * 2003-07-11 2008-12-31 Nitto Denko Corp Transport method and transport apparatus for semiconductor wafer
JP4136890B2 (ja) * 2003-10-17 2008-08-20 日東電工株式会社 保護テープの切断方法及び切断装置
JP2005159044A (ja) * 2003-11-26 2005-06-16 Takatori Corp リングフレームへの粘着テープ貼り付け方法とその装置及びリングフレームへの基板マウント装置
JP2006100728A (ja) * 2004-09-30 2006-04-13 Nitto Denko Corp 保護テープ剥離方法およびこれを用いた装置
US20070101576A1 (en) * 2005-11-10 2007-05-10 Irwin Industrial Tool Company Blunt tip utility blade

Also Published As

Publication number Publication date
KR101359251B1 (ko) 2014-02-05
CN101140856B (zh) 2011-12-28
CN101140856A (zh) 2008-03-12
EP1912250A1 (de) 2008-04-16
KR20080023150A (ko) 2008-03-12
TW200822201A (en) 2008-05-16
US20080066849A1 (en) 2008-03-20
JP4953738B2 (ja) 2012-06-13
JP2008066523A (ja) 2008-03-21
TWI420583B (zh) 2013-12-21
EP1912250B1 (de) 2010-09-29
ATE483248T1 (de) 2010-10-15

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