DE602006011259D1 - Nachbearbeitungsverfahren für Photoresistfilm - Google Patents

Nachbearbeitungsverfahren für Photoresistfilm

Info

Publication number
DE602006011259D1
DE602006011259D1 DE602006011259T DE602006011259T DE602006011259D1 DE 602006011259 D1 DE602006011259 D1 DE 602006011259D1 DE 602006011259 T DE602006011259 T DE 602006011259T DE 602006011259 T DE602006011259 T DE 602006011259T DE 602006011259 D1 DE602006011259 D1 DE 602006011259D1
Authority
DE
Germany
Prior art keywords
post
processing method
photoresist film
photoresist
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006011259T
Other languages
English (en)
Inventor
Tsutomu Ogihara
Takafumi Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE602006011259D1 publication Critical patent/DE602006011259D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
DE602006011259T 2005-11-21 2006-11-09 Nachbearbeitungsverfahren für Photoresistfilm Active DE602006011259D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005335518A JP4597844B2 (ja) 2005-11-21 2005-11-21 フォトレジスト膜のリワーク方法

Publications (1)

Publication Number Publication Date
DE602006011259D1 true DE602006011259D1 (de) 2010-02-04

Family

ID=37726698

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006011259T Active DE602006011259D1 (de) 2005-11-21 2006-11-09 Nachbearbeitungsverfahren für Photoresistfilm

Country Status (6)

Country Link
US (1) US7638268B2 (de)
EP (1) EP1788437B1 (de)
JP (1) JP4597844B2 (de)
KR (1) KR101116935B1 (de)
DE (1) DE602006011259D1 (de)
TW (1) TWI349836B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602007000498D1 (de) 2006-04-11 2009-03-12 Shinetsu Chemical Co Siliziumhaltige, folienbildende Zusammensetzung, siliziumhaltige Folie, siliziumhaltiges, folientragendes Substrat und Strukturierungsverfahren
US7855043B2 (en) * 2006-06-16 2010-12-21 Shin-Etsu Chemical Co., Ltd. Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method
US20070298349A1 (en) * 2006-06-22 2007-12-27 Ruzhi Zhang Antireflective Coating Compositions Comprising Siloxane Polymer
US7704670B2 (en) * 2006-06-22 2010-04-27 Az Electronic Materials Usa Corp. High silicon-content thin film thermosets
CN101320683A (zh) * 2007-02-08 2008-12-10 三星电子株式会社 再加工半导体衬底的方法和形成半导体器件的图案的方法
US8026040B2 (en) * 2007-02-20 2011-09-27 Az Electronic Materials Usa Corp. Silicone coating composition
CN101622297A (zh) * 2007-02-26 2010-01-06 Az电子材料美国公司 制备硅氧烷聚合物的方法
KR101523393B1 (ko) 2007-02-27 2015-05-27 이엠디 퍼포먼스 머티리얼스 코프. 규소를 주성분으로 하는 반사 방지 코팅 조성물
JP5631738B2 (ja) * 2007-11-30 2014-11-26 オプティチューン オサケ ユキチュア 新規シロキサンポリマー組成物
US20090142694A1 (en) * 2007-11-30 2009-06-04 Braggone Oy Siloxane polymer compositions and methods of using the same
US8288271B2 (en) * 2009-11-02 2012-10-16 International Business Machines Corporation Method for reworking antireflective coating over semiconductor substrate
JP2014007306A (ja) * 2012-06-25 2014-01-16 Toshiba Corp パターン形成方法
CN103345130B (zh) * 2013-06-27 2016-01-27 上海华力微电子有限公司 光刻返工刻蚀工艺
JP7123668B2 (ja) * 2017-08-04 2022-08-23 信越化学工業株式会社 レジスト多層膜付き基板及びパターン形成方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100503A (en) * 1990-09-14 1992-03-31 Ncr Corporation Silica-based anti-reflective planarizing layer
US6087064A (en) * 1998-09-03 2000-07-11 International Business Machines Corporation Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method
EP1160843A1 (de) 2000-05-30 2001-12-05 Semiconductor 300 GmbH & Co. KG Planarisierende Antireflektionsschicht mit verbesserter Lichtabsorption
US7011935B2 (en) * 2002-09-19 2006-03-14 Arch Specialty Chemicals, Inc. Method for the removal of an imaging layer from a semiconductor substrate stack
JP3914492B2 (ja) * 2002-11-27 2007-05-16 東京応化工業株式会社 シリコン含有２層レジストプロセス用下層膜形成材料およびこれを用いた配線形成方法
JP3914493B2 (ja) * 2002-11-27 2007-05-16 東京応化工業株式会社 多層レジストプロセス用下層膜形成材料およびこれを用いた配線形成方法
JP4369203B2 (ja) * 2003-03-24 2009-11-18 信越化学工業株式会社 反射防止膜材料、反射防止膜を有する基板及びパターン形成方法
US20040220066A1 (en) * 2003-05-01 2004-11-04 Rohm And Haas Electronic Materials, L.L.C. Stripper
TW200503066A (en) * 2003-07-07 2005-01-16 Macronix Int Co Ltd Process for reworking semiconductor patterned photoresist layer
JP2005173552A (ja) * 2003-11-20 2005-06-30 Tokyo Ohka Kogyo Co Ltd リソグラフィー用下層膜形成材料およびこれを用いた配線形成方法
TWI291081B (en) * 2004-11-05 2007-12-11 Echem Solutions Corp Photoresist stripper composition
TWI323391B (en) * 2006-03-21 2010-04-11 Daxin Material Corp Remover solution composition and use thereof

Also Published As

Publication number Publication date
JP2007140252A (ja) 2007-06-07
US7638268B2 (en) 2009-12-29
JP4597844B2 (ja) 2010-12-15
TWI349836B (en) 2011-10-01
TW200739266A (en) 2007-10-16
KR101116935B1 (ko) 2012-03-12
US20070117411A1 (en) 2007-05-24
EP1788437A3 (de) 2008-11-26
KR20070053621A (ko) 2007-05-25
EP1788437B1 (de) 2009-12-23
EP1788437A2 (de) 2007-05-23

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