Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
  • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
  • B81C1/00261—Processes for packaging MEMS devices
  • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• • A—HUMAN NECESSITIES
  • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
  • A47G—HOUSEHOLD OR TABLE EQUIPMENT
  • A47G25/00—Household implements used in connection with wearing apparel; Dress, hat or umbrella holders
  • A47G25/12—Cane or umbrella stands or holders
• • A—HUMAN NECESSITIES
  • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
  • A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
  • A47B61/00—Wardrobes
  • A47B61/04—Wardrobes for shoes, hats, umbrellas, or the like
• • A—HUMAN NECESSITIES
  • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
  • A47G—HOUSEHOLD OR TABLE EQUIPMENT
  • A47G25/00—Household implements used in connection with wearing apparel; Dress, hat or umbrella holders
  • A47G25/02—Dress holders; Dress suspending devices; Clothes-hanger assemblies; Clothing lifters
  • A47G25/06—Clothes hooks; Clothes racks; Garment-supporting stands with swingable or extending arms
  • A47G25/0607—Clothes hooks
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
  • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
  • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
  • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
  • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
  • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
  • B81B2207/00—Microstructural systems or auxiliary parts thereof
  • B81B2207/09—Packages
  • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
  • B81B2207/094—Feed-through, via
  • B81B2207/095—Feed-through, via through the lid
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Micromachines (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=36143359

Family Applications (1)

Country Status (5)

Families Citing this family (21)

Family Cites Families (6)

• 2005
  • 2005-02-04 KR KR1020050010647A patent/KR100594952B1/ko active IP Right Grant
• 2006
  • 2006-01-12 DE DE602006002137T patent/DE602006002137D1/de not_active Expired - Fee Related
  • 2006-01-12 EP EP06000605A patent/EP1688994B1/de not_active Expired - Fee Related
  • 2006-01-26 US US11/339,500 patent/US7579685B2/en not_active Expired - Fee Related
  • 2006-02-06 JP JP2006028001A patent/JP2006216963A/ja active Pending

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