DE602006001078D1 - Verwendung von Metallsalzen organischer Säuren als Leitfähigkeitsförderer - Google Patents

Verwendung von Metallsalzen organischer Säuren als Leitfähigkeitsförderer

Info

Publication number
DE602006001078D1
DE602006001078D1 DE602006001078T DE602006001078T DE602006001078D1 DE 602006001078 D1 DE602006001078 D1 DE 602006001078D1 DE 602006001078 T DE602006001078 T DE 602006001078T DE 602006001078 T DE602006001078 T DE 602006001078T DE 602006001078 D1 DE602006001078 D1 DE 602006001078D1
Authority
DE
Germany
Prior art keywords
metal salts
organic acids
conductivity promoters
conductivity
promoters
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602006001078T
Other languages
English (en)
Inventor
Gordon T Emmerson
Harry Richard Kuder
Osama M Musa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Publication of DE602006001078D1 publication Critical patent/DE602006001078D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE602006001078T 2005-06-23 2006-06-20 Verwendung von Metallsalzen organischer Säuren als Leitfähigkeitsförderer Expired - Fee Related DE602006001078D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/166,860 US20060289839A1 (en) 2005-06-23 2005-06-23 Metal salts of organic acids as conductivity promoters

Publications (1)

Publication Number Publication Date
DE602006001078D1 true DE602006001078D1 (de) 2008-06-19

Family

ID=36991115

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006001078T Expired - Fee Related DE602006001078D1 (de) 2005-06-23 2006-06-20 Verwendung von Metallsalzen organischer Säuren als Leitfähigkeitsförderer

Country Status (9)

Country Link
US (1) US20060289839A1 (de)
EP (1) EP1736518B1 (de)
JP (1) JP2007002249A (de)
KR (1) KR20060134831A (de)
CN (1) CN1908045A (de)
AT (1) ATE394456T1 (de)
DE (1) DE602006001078D1 (de)
SG (1) SG128631A1 (de)
TW (1) TW200714687A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6899960B2 (en) * 2002-03-22 2005-05-31 Intel Corporation Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
US20060289837A1 (en) * 2005-06-23 2006-12-28 Mcneilly Kirk Silver salts of dicarboxcylic acids for precious metal powder and flakes
WO2007052661A1 (ja) * 2005-11-02 2007-05-10 Matsushita Electric Industrial Co., Ltd. 導電性接着剤
WO2009136920A1 (en) * 2008-05-07 2009-11-12 Henkel Corporation Multifunctional nitrones in non-radical systems
US8455602B2 (en) * 2009-08-24 2013-06-04 University Of The Witwatersrand, Johannesburg Supramolecular functional materials
KR101681046B1 (ko) * 2009-11-26 2016-11-30 주식회사 동진쎄미켐 입자를 형성하지 않는 전도성 잉크 조성물 및 이의 제조방법
KR101468759B1 (ko) * 2010-09-14 2014-12-03 주식회사 엘지화학 도전성 피막의 제조방법, 및 이를 위한 프라이머 조성물
CN102324266B (zh) * 2011-08-18 2012-10-03 江苏泓源光电科技有限公司 无玻璃粉晶体硅太阳能电池铝浆及其制备方法
CN103571269B (zh) 2012-07-30 2016-08-03 比亚迪股份有限公司 油墨组合物、线路板及其制备方法
CN107840795A (zh) * 2017-12-19 2018-03-27 齐齐哈尔大学 一种农业杀菌剂己二酸铜及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4859241A (en) * 1986-04-16 1989-08-22 Johnson Matthey Inc. Metal flake and use thereof
JP2702796B2 (ja) * 1990-02-23 1998-01-26 旭化成工業株式会社 銀合金導電性ペースト
US5143953A (en) * 1990-12-28 1992-09-01 The B. F. Goodrich Company N-alkyl maleimide thermal stabilizers for vinyl halide polymers
US5298562A (en) * 1991-08-19 1994-03-29 Sartomer Company, Inc. Calcium di(meth)acrylate cured halogenated polyethylene polymers
ES2082603T3 (es) * 1992-05-13 1996-03-16 Sartomer Co Inc Procedimiento para adherir una composicion elastomerica a una superficie polar.
JPH11512776A (ja) * 1995-10-05 1999-11-02 ヘンケル コーポレーション 熱硬化性樹脂組成物
US6194504B1 (en) * 1997-04-28 2001-02-27 Sartomer Technologies, Inc. Process for compounding metal salts in elastomers
US6534581B1 (en) * 2000-07-20 2003-03-18 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
US6599446B1 (en) * 2000-11-03 2003-07-29 General Electric Company Electrically conductive polymer composite compositions, method for making, and method for electrical conductivity enhancement
US20050075428A1 (en) * 2001-04-19 2005-04-07 W.F. Taylor Co., Inc. Low emissions one part adhesive
US20040225045A1 (en) * 2003-05-05 2004-11-11 Henkel Loctite Corporation Highly conductive resin compositions

Also Published As

Publication number Publication date
EP1736518B1 (de) 2008-05-07
JP2007002249A (ja) 2007-01-11
KR20060134831A (ko) 2006-12-28
TW200714687A (en) 2007-04-16
ATE394456T1 (de) 2008-05-15
SG128631A1 (en) 2007-01-30
US20060289839A1 (en) 2006-12-28
EP1736518A1 (de) 2006-12-27
CN1908045A (zh) 2007-02-07

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Representative=s name: MEISSNER, BOLTE & PARTNER GBR, 81679 MUENCHEN

8328 Change in the person/name/address of the agent

Representative=s name: MEISSNER, BOLTE & PARTNER GBR, 80538 MUENCHEN

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HENKEL AG & CO. KGAA, 40589 DUESSELDORF, DE

8339 Ceased/non-payment of the annual fee