DE602005026677D1 - Elektrisch gesteuerte lötbehältervorrichtung - Google Patents

Elektrisch gesteuerte lötbehältervorrichtung

Info

Publication number
DE602005026677D1
DE602005026677D1 DE602005026677T DE602005026677T DE602005026677D1 DE 602005026677 D1 DE602005026677 D1 DE 602005026677D1 DE 602005026677 T DE602005026677 T DE 602005026677T DE 602005026677 T DE602005026677 T DE 602005026677T DE 602005026677 D1 DE602005026677 D1 DE 602005026677D1
Authority
DE
Germany
Prior art keywords
electrically controlled
tank device
solder tank
solder bath
controlled solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005026677T
Other languages
English (en)
Inventor
Yoshitomo Teraoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hakko Corp
Original Assignee
Hakko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hakko Corp filed Critical Hakko Corp
Publication of DE602005026677D1 publication Critical patent/DE602005026677D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Coating With Molten Metal (AREA)
DE602005026677T 2004-09-15 2005-09-14 Elektrisch gesteuerte lötbehältervorrichtung Active DE602005026677D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/942,688 US7392926B2 (en) 2004-09-15 2004-09-15 Electrically-controlled soldering pot apparatus
PCT/JP2005/017320 WO2006030955A1 (en) 2004-09-15 2005-09-14 Electrically-controlled soldering pot apparatus

Publications (1)

Publication Number Publication Date
DE602005026677D1 true DE602005026677D1 (de) 2011-04-14

Family

ID=35462187

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005026677T Active DE602005026677D1 (de) 2004-09-15 2005-09-14 Elektrisch gesteuerte lötbehältervorrichtung

Country Status (7)

Country Link
US (1) US7392926B2 (de)
EP (1) EP1793959B1 (de)
JP (1) JP4612676B2 (de)
CN (1) CN101035643B (de)
AT (1) ATE500019T1 (de)
DE (1) DE602005026677D1 (de)
WO (1) WO2006030955A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2932060B1 (fr) * 2008-06-02 2014-12-12 Bosch Gmbh Robert Creuset pour un dispositif de brasage comportant une surface realisee en un materiau neutre par rapport a un metal d'apport pour le brasage.
US8354617B2 (en) * 2009-10-21 2013-01-15 Jung Kook Lee Coolant temperature control apparatus for a wet saw
CN104741725B (zh) * 2013-12-27 2017-03-22 博世汽车部件(苏州)有限公司 一种焊接工具
CN104627465A (zh) * 2015-01-29 2015-05-20 苏州市职业大学 一种实验操作台电子器件管脚废料收集器
JP2019034337A (ja) * 2017-08-10 2019-03-07 白光株式会社 はんだこて制御装置、カートリッジ、はんだこて管理システム
CN112503933B (zh) * 2020-11-17 2023-09-26 湖南仁发材料科技有限公司 一种锡废料再利用生产融化装置

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US154077A (en) 1874-08-11 Improvement in soldering apparatus
US164077A (en) * 1875-06-08 Improvement in machines for cutting hoops
US1394954A (en) * 1919-12-04 1921-10-25 Gen Electric Metal-melting pot
US1745455A (en) * 1928-09-25 1930-02-04 Lenell R Seaborn Soldering ladle
US2390498A (en) * 1941-12-12 1945-12-11 Emil R Capita Apparatus and method for applying solder
US2767300A (en) * 1954-05-07 1956-10-16 Verter Walton G De Electrical soldering pot
US2908796A (en) * 1956-11-27 1959-10-13 Western Electric Co Electrical solder pot
US3037274A (en) * 1957-03-06 1962-06-05 Western Electric Co Methods of and apparatus for mass soldering wiring boards
US3269633A (en) * 1964-11-04 1966-08-30 Sanders Associates Inc Automatic spin soldering machine
US3578948A (en) * 1969-03-19 1971-05-18 Gen Electric Soldering and desoldering hand tool employing air blast or suction
US3834604A (en) * 1972-10-03 1974-09-10 Western Electric Co Apparatus for solid-phase bonding mating members through an interposed pre-shaped compliant medium
US3833163A (en) * 1973-03-08 1974-09-03 Branson Instr Ultrasonic apparatus
JPS5634666U (de) * 1979-08-22 1981-04-04
JPS6019814Y2 (ja) * 1982-06-17 1985-06-14 株式会社広業社通信機器製作所 半田槽装置
US4775776A (en) * 1983-02-28 1988-10-04 Electrovert Limited Multi stage heater
US4562337A (en) * 1984-05-30 1985-12-31 Eldon Industries, Inc. Solder pot
JPS6186069A (ja) * 1984-10-02 1986-05-01 Tamura Seisakusho Co Ltd 自動はんだ付けシステムの制御装置
FR2572972B1 (fr) * 1984-11-15 1987-02-13 Outillages Scient Lab Machine de soudage.
US4659002A (en) * 1985-08-08 1987-04-21 Pace, Incorporated Apparatus for replacement of through-hole mounted PCB components
JPS62224720A (ja) * 1986-03-26 1987-10-02 Mitsubishi Electric Corp 軸受のグリ−ス残量警報装置
US4691497A (en) * 1986-03-28 1987-09-08 Lantech, Inc. Film lamination stretch wrapping
JPH0435005Y2 (de) * 1987-03-26 1992-08-19
EP0287066B1 (de) * 1987-04-16 1993-09-22 Kuraray Co., Ltd. Verfahren zur kontinuierlichen Herstellung von Octa-2,7-dien-1-ol
JPH0224540Y2 (de) * 1987-12-14 1990-07-05
JPH01254381A (ja) 1988-04-02 1989-10-11 Hakko Kinzoku Kogyo Kk 半田こての温度調整装置
JPH0228137U (de) * 1988-08-12 1990-02-23
US5023848A (en) * 1989-05-15 1991-06-11 Highes Aircraft Company Solder wave dwell timer
JPH04367368A (ja) * 1991-06-12 1992-12-18 Toshiba Corp 半田付け装置　
JPH05329629A (ja) 1992-05-29 1993-12-14 Nec Kansai Ltd 半田ディップ装置
JP2714520B2 (ja) * 1992-08-28 1998-02-16 株式会社日立製作所 実装部品着脱装置
US6087631A (en) 1997-03-14 2000-07-11 Hakko Corporation Soldering iron with temperature control cycles related to rectified voltage cycles
JP3789041B2 (ja) * 1998-05-24 2006-06-21 ソニー株式会社 半田付け性測定装置
US6250537B1 (en) * 2000-03-06 2001-06-26 Delphi Technologies, Inc. Self-cleaning soldering thimble assembly
US6705506B1 (en) * 2000-05-08 2004-03-16 William Sund Inert atmosphere soldering apparatus
WO2006089032A1 (en) * 2005-02-18 2006-08-24 P. Kay Metal, Inc. Metal containers for solder paste

Also Published As

Publication number Publication date
JP2008513211A (ja) 2008-05-01
CN101035643B (zh) 2010-08-25
ATE500019T1 (de) 2011-03-15
US7392926B2 (en) 2008-07-01
US20060054658A1 (en) 2006-03-16
WO2006030955A1 (en) 2006-03-23
JP4612676B2 (ja) 2011-01-12
EP1793959B1 (de) 2011-03-02
EP1793959A1 (de) 2007-06-13
CN101035643A (zh) 2007-09-12

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