DE602004028516D1 - Hf-schaltung mit gestapelten leiterplatten - Google Patents

Hf-schaltung mit gestapelten leiterplatten

Info

Publication number
DE602004028516D1
DE602004028516D1 DE602004028516T DE602004028516T DE602004028516D1 DE 602004028516 D1 DE602004028516 D1 DE 602004028516D1 DE 602004028516 T DE602004028516 T DE 602004028516T DE 602004028516 T DE602004028516 T DE 602004028516T DE 602004028516 D1 DE602004028516 D1 DE 602004028516D1
Authority
DE
Germany
Prior art keywords
circuit
stacked pcb
tuner
mixer
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004028516T
Other languages
English (en)
Inventor
Tiam Fatt Tey
Lye Yoong Lum
Feng Lin
Original Assignee
Thomson Licensing SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing SAS filed Critical Thomson Licensing SAS
Publication of DE602004028516D1 publication Critical patent/DE602004028516D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Receivers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Filters And Equalizers (AREA)
DE602004028516T 2004-01-14 2004-11-04 Hf-schaltung mit gestapelten leiterplatten Active DE602004028516D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04300020A EP1555864A1 (de) 2004-01-14 2004-01-14 HF-Baugruppe mit gestapelten Leiterplatten
PCT/EP2004/012481 WO2005069709A1 (en) 2004-01-14 2004-11-04 Rf circuit with stacked printed circuit boards

Publications (1)

Publication Number Publication Date
DE602004028516D1 true DE602004028516D1 (de) 2010-09-16

Family

ID=34610243

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004028516T Active DE602004028516D1 (de) 2004-01-14 2004-11-04 Hf-schaltung mit gestapelten leiterplatten

Country Status (6)

Country Link
US (1) US7725095B2 (de)
EP (2) EP1555864A1 (de)
CN (2) CN2768314Y (de)
AT (1) ATE476862T1 (de)
DE (1) DE602004028516D1 (de)
WO (1) WO2005069709A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1945970B (zh) * 2005-10-08 2010-08-11 Thomson宽带研发（北京）有限公司 调谐器组件
KR101090066B1 (ko) * 2007-05-14 2011-12-07 삼성전자주식회사 방송신호 수신장치
US20100203922A1 (en) * 2009-02-10 2010-08-12 Knecht Thomas A Time Division Duplex Front End Module
CN102056448B (zh) * 2009-11-04 2013-02-27 环旭电子股份有限公司 电子模组
US8254862B2 (en) * 2009-12-29 2012-08-28 Silicon Laboratories Inc. Configurable radio front end
JP4858733B1 (ja) * 2010-10-06 2012-01-18 横浜ゴム株式会社 送信装置
WO2012094274A1 (en) * 2011-01-04 2012-07-12 Technicolor Usa, Inc. Set back box
US8818309B2 (en) 2011-03-28 2014-08-26 Silicon Laboratories Inc. Providing multiple inductors for a radio tuner
JP5803961B2 (ja) * 2013-03-21 2015-11-04 株式会社豊田自動織機 基板間隔保持部材及びインバータ装置
GB2518476B (en) 2013-09-20 2015-11-04 Silicon Lab Inc Multi-chip modules having stacked television demodulators
BR112016010823B1 (pt) 2013-11-12 2023-04-11 Interdigital Ce Patent Holdings Dispositivo e decodificador de sinais
US10390423B1 (en) * 2018-05-08 2019-08-20 International Business Machines Corporation Crosstalk mitigation for PCB to die transition in superconducting devices

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5007841A (en) * 1983-05-31 1991-04-16 Trw Inc. Integrated-circuit chip interconnection system
JPS6192039A (ja) * 1984-10-11 1986-05-10 Matsushita Electric Ind Co Ltd Ｒｆ復調装置とその製造方法
JPH0346827A (ja) * 1989-07-14 1991-02-28 Matsushita Electric Ind Co Ltd テレビジョンチューナ
US5049084A (en) * 1989-12-05 1991-09-17 Rogers Corporation Electrical circuit board interconnect
GB9017078D0 (en) * 1990-08-03 1990-09-19 Marconi Space Systems Limited Hybrid frame
JP2663823B2 (ja) * 1993-01-29 1997-10-15 松下電器産業株式会社 高周波装置
JPH0997993A (ja) * 1995-09-29 1997-04-08 Matsushita Electric Ind Co Ltd 高周波装置
EP0812066A4 (de) * 1995-12-25 1999-03-24 Matsushita Electric Ind Co Ltd Hochfrequenz gerät
CN1306349A (zh) * 2000-04-11 2001-08-01 深圳市中兴通讯股份有限公司 一种通用卫星数据广播接收系统
JP3582460B2 (ja) * 2000-06-20 2004-10-27 株式会社村田製作所 高周波モジュール
JP2002152063A (ja) * 2000-11-15 2002-05-24 Murata Mfg Co Ltd デジタル放送受信部
US6653885B2 (en) * 2001-05-03 2003-11-25 Peregrine Semiconductor Corporation On-chip integrated mixer with balun circuit and method of making the same
JP2003140773A (ja) * 2001-10-31 2003-05-16 Toshiba Corp 無線通信デバイスおよび情報処理装置
US7050765B2 (en) * 2003-01-08 2006-05-23 Xytrans, Inc. Highly integrated microwave outdoor unit (ODU)
US20050124307A1 (en) * 2003-12-08 2005-06-09 Xytrans, Inc. Low cost broadband wireless communication system
JP2006024087A (ja) * 2004-07-09 2006-01-26 Nec Corp 無線デバイス、その製造方法、その検査方法及び検査装置並びに無線装置及びその製造方法
JP4521602B2 (ja) * 2005-06-06 2010-08-11 ルネサスエレクトロニクス株式会社 マルチモード高周波回路
US20070207734A1 (en) * 2006-02-17 2007-09-06 International Rectifier Corporation Wireless communication between control devices and controlled devices within a common board and rf high side coupler with plane polarized antenna
US20080136559A1 (en) * 2006-12-08 2008-06-12 Wataru Takahashi Electronic device and rf module

Also Published As

Publication number Publication date
CN1918955B (zh) 2010-05-12
US7725095B2 (en) 2010-05-25
EP1719395A1 (de) 2006-11-08
US20070115359A1 (en) 2007-05-24
WO2005069709A1 (en) 2005-07-28
CN2768314Y (zh) 2006-03-29
ATE476862T1 (de) 2010-08-15
CN1918955A (zh) 2007-02-21
EP1719395B1 (de) 2010-08-04
EP1555864A1 (de) 2005-07-20

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)