DE602004007598T2 - Polierkissen mit Rillenanordnung zur Minderung des Schlammverbrauchs - Google Patents

Polierkissen mit Rillenanordnung zur Minderung des Schlammverbrauchs Download PDF

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Publication number
DE602004007598T2
DE602004007598T2 DE602004007598T DE602004007598T DE602004007598T2 DE 602004007598 T2 DE602004007598 T2 DE 602004007598T2 DE 602004007598 T DE602004007598 T DE 602004007598T DE 602004007598 T DE602004007598 T DE 602004007598T DE 602004007598 T2 DE602004007598 T2 DE 602004007598T2
Authority
DE
Germany
Prior art keywords
polishing
grooves
slurry
groove
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004007598T
Other languages
German (de)
English (en)
Other versions
DE602004007598D1 (de
Inventor
Gregory P. Earleville Muldowney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE602004007598D1 publication Critical patent/DE602004007598D1/de
Application granted granted Critical
Publication of DE602004007598T2 publication Critical patent/DE602004007598T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE602004007598T 2003-11-13 2004-11-04 Polierkissen mit Rillenanordnung zur Minderung des Schlammverbrauchs Expired - Lifetime DE602004007598T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US712362 1991-06-10
US10/712,362 US7125318B2 (en) 2003-11-13 2003-11-13 Polishing pad having a groove arrangement for reducing slurry consumption

Publications (2)

Publication Number Publication Date
DE602004007598D1 DE602004007598D1 (de) 2007-08-30
DE602004007598T2 true DE602004007598T2 (de) 2008-04-17

Family

ID=34435666

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004007598T Expired - Lifetime DE602004007598T2 (de) 2003-11-13 2004-11-04 Polierkissen mit Rillenanordnung zur Minderung des Schlammverbrauchs

Country Status (7)

Country Link
US (1) US7125318B2 (https=)
EP (1) EP1533076B1 (https=)
JP (1) JP4689240B2 (https=)
KR (1) KR101109160B1 (https=)
CN (1) CN100347828C (https=)
DE (1) DE602004007598T2 (https=)
TW (1) TWI337564B (https=)

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KR100721196B1 (ko) * 2005-05-24 2007-05-23 주식회사 하이닉스반도체 연마패드 및 이를 이용한 화학적기계적연마장치
US9107568B2 (en) 2005-06-17 2015-08-18 Intellectual Ventures Ii Llc Capsule type endoscope and method for fabricating the same
CN101326235B (zh) * 2005-12-09 2012-04-04 三井化学株式会社 振动控制用材料、振动控制用成形体和振动控制用多层叠层体
JP2007201449A (ja) * 2005-12-28 2007-08-09 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
US7300340B1 (en) * 2006-08-30 2007-11-27 Rohm and Haas Electronics Materials CMP Holdings, Inc. CMP pad having overlaid constant area spiral grooves
US7267610B1 (en) 2006-08-30 2007-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having unevenly spaced grooves
JP2008062367A (ja) * 2006-09-11 2008-03-21 Nec Electronics Corp 研磨装置、研磨パッド、研磨方法
JP4909706B2 (ja) * 2006-10-24 2012-04-04 東洋ゴム工業株式会社 研磨パッド
US7520798B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US7311590B1 (en) 2007-01-31 2007-12-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to retain slurry on the pad texture
US7520796B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US9180570B2 (en) * 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
JP6065208B2 (ja) * 2012-12-25 2017-01-25 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN105058224B (zh) * 2015-07-23 2017-07-14 福州恒光光电有限公司 一种多晶片研磨装置及其研磨方法
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10861702B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857648B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN110153873B (zh) * 2018-02-14 2021-06-11 台湾积体电路制造股份有限公司 研磨设备、检测装置以及半导体基板的研磨方法
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
CN109623554A (zh) * 2019-01-08 2019-04-16 天津中环领先材料技术有限公司 一种降低硅片边缘粗糙度的边抛工艺
CN112091817B (zh) * 2020-09-08 2022-06-17 中国航发贵州黎阳航空动力有限公司 一种薄壁环形零件端面研磨工具
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN114473857B (zh) * 2021-12-29 2023-03-14 湖北鼎汇微电子材料有限公司 一种抛光垫及半导体器件的制造方法
CN115741457A (zh) * 2022-11-18 2023-03-07 京东方科技集团股份有限公司 研磨盘、清洁机构及其清洁方法
CN117245542B (zh) * 2023-11-17 2024-01-23 苏州博宏源机械制造有限公司 晶圆双面抛光设备及工艺

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US5527215A (en) * 1992-01-10 1996-06-18 Schlegel Corporation Foam buffing pad having a finishing surface with a splash reducing configuration
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
US5645469A (en) * 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
JP3149807B2 (ja) * 1997-01-08 2001-03-26 三菱マテリアル株式会社 ウェーハ研磨装置
US5990012A (en) * 1998-01-27 1999-11-23 Micron Technology, Inc. Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads
JP2000000755A (ja) * 1998-06-16 2000-01-07 Sony Corp 研磨パッド及び研磨方法
GB2345255B (en) * 1998-12-29 2000-12-27 United Microelectronics Corp Chemical-Mechanical Polishing Pad
US20020068516A1 (en) 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6241596B1 (en) 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
KR20020022198A (ko) * 2000-09-19 2002-03-27 윤종용 표면에 비 선형 트랙이 형성된 연마 패드를 구비하는화학적 기계적 연마 장치
KR20030015567A (ko) * 2001-08-16 2003-02-25 에스케이에버텍 주식회사 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드
JP2003209077A (ja) * 2002-01-15 2003-07-25 Mitsubishi Electric Corp Ｃｍｐ装置及び半導体装置
US6843711B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration
JP4563025B2 (ja) * 2003-12-19 2010-10-13 東洋ゴム工業株式会社 Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法
US7059949B1 (en) * 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having an overlapping stepped groove arrangement

Also Published As

Publication number Publication date
KR20050046621A (ko) 2005-05-18
JP2005150744A (ja) 2005-06-09
CN1617307A (zh) 2005-05-18
EP1533076B1 (en) 2007-07-18
CN100347828C (zh) 2007-11-07
KR101109160B1 (ko) 2012-02-24
US7125318B2 (en) 2006-10-24
TWI337564B (en) 2011-02-21
TW200531783A (en) 2005-10-01
EP1533076A1 (en) 2005-05-25
US20050106878A1 (en) 2005-05-19
DE602004007598D1 (de) 2007-08-30
JP4689240B2 (ja) 2011-05-25

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