DE602004007068D1 - Polyamidimidharz, Verfahren zu seiner Herstellung, Polyamidimidzusammensetzung, daraus hergestellte filmbildendes Material und Klebstoff für elektronische Teile - Google Patents

Polyamidimidharz, Verfahren zu seiner Herstellung, Polyamidimidzusammensetzung, daraus hergestellte filmbildendes Material und Klebstoff für elektronische Teile

Info

Publication number
DE602004007068D1
DE602004007068D1 DE602004007068T DE602004007068T DE602004007068D1 DE 602004007068 D1 DE602004007068 D1 DE 602004007068D1 DE 602004007068 T DE602004007068 T DE 602004007068T DE 602004007068 T DE602004007068 T DE 602004007068T DE 602004007068 D1 DE602004007068 D1 DE 602004007068D1
Authority
DE
Germany
Prior art keywords
resin
general formula
structural unit
polyamideimide
unit represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004007068T
Other languages
English (en)
Other versions
DE602004007068T2 (de
Inventor
Takami Hikita
Takashi Kondo
Amane Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602004007068D1 publication Critical patent/DE602004007068D1/de
Application granted granted Critical
Publication of DE602004007068T2 publication Critical patent/DE602004007068T2/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE602004007068T 2003-07-07 2004-07-07 Polyamidimidharz, Verfahren zu seiner Herstellung, Polyamidimidzusammensetzung, daraus hergestellte filmbildendes Material und Klebstoff für elektronische Teile Expired - Fee Related DE602004007068T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003193031 2003-07-07
JP2003193031 2003-07-07
JP2004018655A JP2005042086A (ja) 2003-07-07 2004-01-27 ポリアミドイミド樹脂、ポリアミドイミド樹脂の製造方法、ポリアミドイミド樹脂組成物、被膜形成材料、及び電子部品用接着剤
JP2004018655 2004-01-27

Publications (2)

Publication Number Publication Date
DE602004007068D1 true DE602004007068D1 (de) 2007-08-02
DE602004007068T2 DE602004007068T2 (de) 2008-02-21

Family

ID=33455602

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004007068T Expired - Fee Related DE602004007068T2 (de) 2003-07-07 2004-07-07 Polyamidimidharz, Verfahren zu seiner Herstellung, Polyamidimidzusammensetzung, daraus hergestellte filmbildendes Material und Klebstoff für elektronische Teile

Country Status (7)

Country Link
US (1) US20050043502A1 (de)
EP (1) EP1496078B1 (de)
JP (1) JP2005042086A (de)
KR (1) KR20050006054A (de)
CN (1) CN1304460C (de)
AT (1) ATE365184T1 (de)
DE (1) DE602004007068T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200613370A (en) * 2004-06-22 2006-05-01 Nitto Denko Corp Heat-resistant resin, method for manufacturing the same and dust-removing substrate of substrate processing equipment by using the resin thereof
JP4704082B2 (ja) * 2005-03-22 2011-06-15 住友電工プリントサーキット株式会社 接着剤組成物およびそれを用いたフレキシブル印刷配線板
JP5245338B2 (ja) * 2006-10-11 2013-07-24 日立化成株式会社 ポリアミドイミド、ポリアミドイミドの製造方法、並びにポリアミドイミドを含む樹脂組成物及び樹脂ワニス
JP5208399B2 (ja) * 2006-10-24 2013-06-12 ニッタ株式会社 ポリイミド樹脂
US20080200084A1 (en) * 2007-02-16 2008-08-21 Angus Richard O Compositions for thin circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP5214999B2 (ja) * 2008-02-28 2013-06-19 帝人株式会社 非水電解質電池セパレータ及びその製造方法並びにそれを用いた非水電解質二次電池
JP5214998B2 (ja) * 2008-02-28 2013-06-19 帝人株式会社 非水電解質電池セパレータ及びその製造方法並びにそれを用いた非水電解質二次電池
CN101684182B (zh) * 2008-09-25 2011-11-16 比亚迪股份有限公司 一种聚酰亚胺膜的制备方法
KR20130080803A (ko) * 2010-05-27 2013-07-15 바스프 에스이 재료, 이의 제조 방법 및 그의 성분
IN2014DN05779A (de) 2011-12-15 2015-04-10 Fujifilm Hunt Chemicals Us Inc
US9029441B2 (en) 2011-12-15 2015-05-12 Fujifilm Hunt Chemicals Us, Inc. Low toxicity solvent system for polyamideimide and polyamide amic acid resins and coating solutions thereof
US9725617B2 (en) 2014-04-17 2017-08-08 Fujifilm Hunt Chemicals U.S.A., Inc. Low toxicity solvent system for polyamideimide and polyamide amic acid resin coating
US9815941B2 (en) 2014-04-17 2017-11-14 Cymer-Dayton, Llc Low toxicity solvent system for polyamdieimide and polyamide amic acid resin manufacture
JP6425922B2 (ja) * 2014-06-13 2018-11-21 株式会社ブリヂストン ゴム組成物
JP6403212B2 (ja) * 2015-04-23 2018-10-10 住鉱潤滑剤株式会社 ポリアミドイミド塗料組成物及びその塗布方法、並びにポリアミドイミド被膜
JP7312931B2 (ja) * 2016-09-28 2023-07-24 東特塗料株式会社 電気絶縁電線
JP7209470B2 (ja) * 2018-03-13 2023-01-20 帝人株式会社 プリプレグ及び炭素繊維強化複合材料

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0388243B1 (de) * 1989-03-17 1994-06-22 Tomoegawa Paper Co. Ltd. Blockcopolymer und Verfahren zu seiner Herstellung
JPH10330449A (ja) * 1997-05-27 1998-12-15 Hitachi Chem Co Ltd 変性ポリアミドイミド樹脂の製造法及び変性ポリアミドイミド樹脂
JPH1129637A (ja) * 1997-07-08 1999-02-02 Hitachi Chem Co Ltd ポリアミドイミド樹脂の製造法及びポリアミドイミド樹脂組成物
JP4016226B2 (ja) * 1998-01-14 2007-12-05 味の素株式会社 変成ポリイミド樹脂及びこれを含有する熱硬化性樹脂組成物
JPH11246759A (ja) * 1998-03-04 1999-09-14 Hitachi Chem Co Ltd ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料
JP2000086888A (ja) * 1998-09-14 2000-03-28 Hitachi Chem Co Ltd 樹脂組成物、接着剤、接着フィルム、これを用いたリードフレーム及び半導体装置
DE19858921A1 (de) * 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen

Also Published As

Publication number Publication date
KR20050006054A (ko) 2005-01-15
US20050043502A1 (en) 2005-02-24
EP1496078B1 (de) 2007-06-20
CN1576295A (zh) 2005-02-09
EP1496078A1 (de) 2005-01-12
CN1304460C (zh) 2007-03-14
ATE365184T1 (de) 2007-07-15
JP2005042086A (ja) 2005-02-17
DE602004007068T2 (de) 2008-02-21

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