DE602004004732D1 - Verfahren zur Herstellung von Sonden für Atomkraftmikroskopie - Google Patents

Verfahren zur Herstellung von Sonden für Atomkraftmikroskopie

Info

Publication number
DE602004004732D1
DE602004004732D1 DE602004004732T DE602004004732T DE602004004732D1 DE 602004004732 D1 DE602004004732 D1 DE 602004004732D1 DE 602004004732 T DE602004004732 T DE 602004004732T DE 602004004732 T DE602004004732 T DE 602004004732T DE 602004004732 D1 DE602004004732 D1 DE 602004004732D1
Authority
DE
Germany
Prior art keywords
holder
probe
contact region
substrate
atomic force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004004732T
Other languages
English (en)
Other versions
DE602004004732T2 (de
Inventor
Marc Fouchier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Publication of DE602004004732D1 publication Critical patent/DE602004004732D1/de
Application granted granted Critical
Publication of DE602004004732T2 publication Critical patent/DE602004004732T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
    • G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
    • G01Q60/38—Probes, their manufacture, or their related instrumentation, e.g. holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating And Analyzing Materials By Characteristic Methods (AREA)
DE602004004732T 2003-12-17 2004-12-10 Verfahren zur Herstellung von Sonden für Atomkraftmikroskopie Active DE602004004732T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03447294 2003-12-17
EP03447294A EP1548748A1 (de) 2003-12-17 2003-12-17 Verfahren zur Herstellung von Sonden für Atomkraftmikroskopie

Publications (2)

Publication Number Publication Date
DE602004004732D1 true DE602004004732D1 (de) 2007-03-29
DE602004004732T2 DE602004004732T2 (de) 2007-10-25

Family

ID=34530882

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004004732T Active DE602004004732T2 (de) 2003-12-17 2004-12-10 Verfahren zur Herstellung von Sonden für Atomkraftmikroskopie

Country Status (5)

Country Link
US (2) US7240428B2 (de)
EP (1) EP1548748A1 (de)
JP (1) JP4447447B2 (de)
AT (1) ATE354168T1 (de)
DE (1) DE602004004732T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101105984B1 (ko) 2001-01-19 2012-01-18 비로노바티브 비.브이. 감응성 포유류에서 호흡계 질환을 유발하는 바이러스
CN1646684B (zh) 2002-02-21 2010-10-06 免疫医疗疫苗公司 重组副流感病毒表达系统以及包含源自间质肺病毒的异种抗原的疫苗
EP1748447B1 (de) * 2005-07-28 2008-10-22 Interuniversitair Microelektronica Centrum ( Imec) Atomkraftmikroskop-Sonde mit einer doppelten Spitze und deren Herstellungsverfahren.
US8089294B2 (en) * 2008-08-05 2012-01-03 WinMENS Technologies Co., Ltd. MEMS probe fabrication on a reusable substrate for probe card application

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4423401A (en) * 1982-07-21 1983-12-27 Tektronix, Inc. Thin-film electrothermal device
US4958585A (en) * 1988-07-11 1990-09-25 Skeeter Products, Inc. Boat hull
US5221415A (en) * 1989-01-17 1993-06-22 Board Of Trustees Of The Leland Stanford Junior University Method of forming microfabricated cantilever stylus with integrated pyramidal tip
JP3053456B2 (ja) * 1990-08-31 2000-06-19 オリンパス光学工業株式会社 走査型プローブ顕微鏡用カンチレバー及びその作製方法
JP3109861B2 (ja) * 1991-06-12 2000-11-20 キヤノン株式会社 情報の記録及び／又は再生装置
ATE269588T1 (de) * 1993-02-04 2004-07-15 Cornell Res Foundation Inc Mikrostrukturen und einzelmask, einkristall- herstellungsverfahren
DE19642378C2 (de) * 1996-10-14 2000-06-08 Fraunhofer Ges Forschung Kontaktlose Chipkarte
JPH1194863A (ja) * 1997-09-12 1999-04-09 Nikon Corp カンチレバー及びその製造方法
DE60042067D1 (de) * 2000-09-15 2009-06-04 Imec Inter Uni Micro Electr Verfahren zur Herstellung montierter AFM-Sonden durch Löten
EP1202047A1 (de) * 2000-10-27 2002-05-02 Interuniversitair Micro-Elektronica Centrum Herstellungsverfahren für Spitzen und Probenköpfen von STM's oder AFM's
KR100746768B1 (ko) * 2002-03-19 2007-08-06 주식회사 엘지이아이 캔틸레버를 이용한 정보 기록 및 판독 장치
US7132723B2 (en) * 2002-11-14 2006-11-07 Raytheon Company Micro electro-mechanical system device with piezoelectric thin film actuator

Also Published As

Publication number Publication date
US7240428B2 (en) 2007-07-10
US20080230856A1 (en) 2008-09-25
ATE354168T1 (de) 2007-03-15
JP2005181324A (ja) 2005-07-07
US20050146046A1 (en) 2005-07-07
JP4447447B2 (ja) 2010-04-07
DE602004004732T2 (de) 2007-10-25
EP1548748A1 (de) 2005-06-29

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