DE602004003395T2 - Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe - Google Patents

Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe Download PDF

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Publication number
DE602004003395T2
DE602004003395T2 DE200460003395 DE602004003395T DE602004003395T2 DE 602004003395 T2 DE602004003395 T2 DE 602004003395T2 DE 200460003395 DE200460003395 DE 200460003395 DE 602004003395 T DE602004003395 T DE 602004003395T DE 602004003395 T2 DE602004003395 T2 DE 602004003395T2
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Germany
Prior art keywords
weight
parts
catalyst solution
iodonium
coating composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE200460003395
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German (de)
English (en)
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DE602004003395D1 (de
Inventor
Ramkrishna Clifton Park GHOSHAL
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Polyset Co
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Polyset Co
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Expired - Fee Related legal-status Critical Current
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3254Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/38Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • C09D183/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31525Next to glass or quartz
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31529Next to metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31551Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609Particulate metal or metal compound-containing
    • Y10T428/31612As silicone, silane or siloxane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
DE200460003395 2003-08-07 2004-08-05 Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe Expired - Fee Related DE602004003395T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/636,101 US6962948B2 (en) 2003-08-07 2003-08-07 Solventless, non-polluting radiation and thermal curable coatings
US636101 2003-08-07
PCT/US2004/025176 WO2005017057A1 (en) 2003-08-07 2004-08-05 Solventless, non-polluting radiation and thermally curable coatings

Publications (2)

Publication Number Publication Date
DE602004003395D1 DE602004003395D1 (de) 2007-01-04
DE602004003395T2 true DE602004003395T2 (de) 2007-09-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE200460003395 Expired - Fee Related DE602004003395T2 (de) 2003-08-07 2004-08-05 Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe

Country Status (6)

Country Link
US (2) US6962948B2 (US20050170187A1-20050804-C00020.png)
EP (1) EP1651731B1 (US20050170187A1-20050804-C00020.png)
AT (1) ATE346124T1 (US20050170187A1-20050804-C00020.png)
AU (1) AU2004264507A1 (US20050170187A1-20050804-C00020.png)
DE (1) DE602004003395T2 (US20050170187A1-20050804-C00020.png)
WO (1) WO2005017057A1 (US20050170187A1-20050804-C00020.png)

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* Cited by examiner, † Cited by third party
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JP2005008691A (ja) * 2003-06-17 2005-01-13 Konica Minolta Medical & Graphic Inc 活性エネルギー線硬化型インクジェットインク及び印刷物
US6962948B2 (en) * 2003-08-07 2005-11-08 Polyset Company, Inc. Solventless, non-polluting radiation and thermal curable coatings
JP2006124636A (ja) * 2004-06-28 2006-05-18 Konica Minolta Medical & Graphic Inc 活性光線硬化型組成物、活性光線硬化型インクジェットインク、該活性光線硬化型インクジェットインクを用いた画像形成方法及びインクジェット記録装置
US7288607B2 (en) * 2004-10-12 2007-10-30 E. I. Du Pont De Nemours & Co. High solids primer composition based on epoxy ring opening curing reaction
JP4986423B2 (ja) * 2005-08-03 2012-07-25 日東電工株式会社 剥離処理基材及びその製造方法
ES2527101T3 (es) * 2005-08-12 2015-01-20 Markem-Imaje Corporation Formulaciones de tintas catiónicas
US8048981B2 (en) * 2005-09-20 2011-11-01 General Electric Company Thermally curable compositions and method
FR2912605B1 (fr) * 2007-02-16 2011-07-15 Xeda International Combinaisons d'esters de l'acide abietique avec un ou plusieurs terpenes et leur utilisation pour l'enrobage des fruits et legumes
JP5325206B2 (ja) * 2008-03-24 2013-10-23 昭和電工株式会社 エポキシ化合物およびその製造方法
US20090294724A1 (en) * 2008-05-27 2009-12-03 Appealing Products, Inc. Anti-icing material and surface treatments
JP5793491B2 (ja) * 2010-03-02 2015-10-14 サンスター技研株式会社 硬化性組成物
US8629688B2 (en) * 2010-09-29 2014-01-14 International Business Machines Corporation Method for sulfur-based corrosion testing
TWI557183B (zh) * 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
KR101339772B1 (ko) * 2011-02-28 2014-02-05 한국과학기술원 광경화 투명 수지 조성물
EP2699623B1 (de) 2011-04-18 2019-12-18 Momentive Performance Materials GmbH Funktionalisierte polyorganosiloxane oder silane zur behandlung von lignocellulosischen werkstoffen
MY169938A (en) * 2012-08-31 2019-06-18 Daicel Corp Curable composition, cured product thereof, optical member and optical device
EP3112389B1 (en) * 2014-02-28 2019-06-05 Daicel Corporation Curable composition, cured product thereof, and wafer level lens
CN106687499B (zh) * 2014-09-17 2019-07-19 株式会社大赛璐 固化性组合物、以及使用其的光学元件
CN107709400B (zh) * 2015-06-17 2020-05-12 株式会社大赛璐 固化性组合物
TWI557177B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 低介電無溶劑型樹脂組成物及基板結構
US20170369654A1 (en) * 2016-06-24 2017-12-28 Dow Global Technologies Llc Curable resin composition
MX2020001733A (es) 2017-08-18 2020-03-20 Fina Technology Polifarnesenos epoxidizados y metodos para producirlos.
US10858541B2 (en) * 2017-12-19 2020-12-08 Rohm And Haas Electronic Materials Llc Curable composition
CN114181581A (zh) * 2021-12-27 2022-03-15 深圳市法鑫忠信新材料有限公司 一种高硬度的涂料组合物及其制备方法
CN117285706A (zh) * 2022-06-24 2023-12-26 常州正洁智造科技有限公司 阳离子型光固化组合物、涂料、具有光固化涂层的制品、油墨

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US5073643A (en) * 1990-08-30 1991-12-17 Polyset Corporation High yield synthesis of hydroxyl-containing cationic photoinitiators
US5260349A (en) * 1991-01-04 1993-11-09 Polyset Corporation Electron beam curable epoxy compositions
DE69425473T3 (de) * 1993-11-05 2005-11-03 Shin-Etsu Chemical Co., Ltd. Verfahren zur Herstellung von Organo-funktionelle Gruppen enthaltenden Organopolysiloxanen und daraus hergestellte Organopolysiloxane, Mercapto- und Alkoxygruppen enthaltende Organopolysiloxane und Verfahren zu deren Herstellung
US5757313A (en) * 1993-11-09 1998-05-26 Markem Corporation Lacer-induced transfer printing medium and method
US5863970A (en) 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
US6069259A (en) * 1998-02-06 2000-05-30 Rensselaer Polytechnic Institute Multifunctional polymerizible alkoxy siloxane oligomers
US6602602B1 (en) * 1999-04-26 2003-08-05 Renssealer Polytechnic Institute Epoxy-functional polymeric microbeads
US6632960B2 (en) * 2002-06-21 2003-10-14 Goldschmidt Ag Diaryliodonium salt catalysts made from iodotoluene and a method for preparing them
US6832036B2 (en) * 2002-10-11 2004-12-14 Polyset Company, Inc. Siloxane optical waveguides
US6962948B2 (en) * 2003-08-07 2005-11-08 Polyset Company, Inc. Solventless, non-polluting radiation and thermal curable coatings
US7019386B2 (en) * 2004-04-27 2006-03-28 Polyset Company, Inc. Siloxane epoxy polymers for low-k dielectric applications

Also Published As

Publication number Publication date
US7285579B2 (en) 2007-10-23
US6962948B2 (en) 2005-11-08
EP1651731A1 (en) 2006-05-03
AU2004264507A1 (en) 2005-02-24
DE602004003395D1 (de) 2007-01-04
EP1651731B1 (en) 2006-11-22
ATE346124T1 (de) 2006-12-15
US20050042458A1 (en) 2005-02-24
US20050170187A1 (en) 2005-08-04
WO2005017057A1 (en) 2005-02-24

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