DE602004003091D1 - Polierzusammensetzung - Google Patents

Polierzusammensetzung

Info

Publication number
DE602004003091D1
DE602004003091D1 DE602004003091T DE602004003091T DE602004003091D1 DE 602004003091 D1 DE602004003091 D1 DE 602004003091D1 DE 602004003091 T DE602004003091 T DE 602004003091T DE 602004003091 T DE602004003091 T DE 602004003091T DE 602004003091 D1 DE602004003091 D1 DE 602004003091D1
Authority
DE
Germany
Prior art keywords
polishing composition
polishing
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004003091T
Other languages
English (en)
Other versions
DE602004003091T2 (de
Inventor
Tatsuhito Mutoh
Hirohito Kitano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of DE602004003091D1 publication Critical patent/DE602004003091D1/de
Application granted granted Critical
Publication of DE602004003091T2 publication Critical patent/DE602004003091T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE602004003091T 2003-03-31 2004-03-31 Polierzusammensetzung Expired - Fee Related DE602004003091T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003097247 2003-03-31
JP2003097247A JP4219722B2 (ja) 2003-03-31 2003-03-31 研磨用組成物

Publications (2)

Publication Number Publication Date
DE602004003091D1 true DE602004003091D1 (de) 2006-12-21
DE602004003091T2 DE602004003091T2 (de) 2007-05-03

Family

ID=32959554

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004003091T Expired - Fee Related DE602004003091T2 (de) 2003-03-31 2004-03-31 Polierzusammensetzung

Country Status (5)

Country Link
US (1) US7211121B2 (de)
EP (1) EP1471124B1 (de)
JP (1) JP4219722B2 (de)
DE (1) DE602004003091T2 (de)
DK (1) DK1471124T3 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7241324B2 (en) * 2004-04-13 2007-07-10 Universal Photonics Llc Method of producing abrasive tools
JP4667025B2 (ja) * 2004-12-03 2011-04-06 日本ミクロコーティング株式会社 研磨スラリー及び方法
KR101267971B1 (ko) * 2005-08-31 2013-05-27 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마 방법
JP2007063440A (ja) * 2005-08-31 2007-03-15 Fujimi Inc 研磨用組成物及び研磨方法
DE102006061891A1 (de) * 2006-12-28 2008-07-03 Basf Se Zusammensetzung zum Polieren von Oberflächen aus Siliziumdioxid
JP5570685B2 (ja) * 2007-03-16 2014-08-13 花王株式会社 ハードディスク基板用研磨液組成物
JP2009155469A (ja) * 2007-12-26 2009-07-16 Kao Corp 研磨液組成物
WO2012102144A1 (ja) * 2011-01-26 2012-08-02 株式会社 フジミインコーポレーテッド 研磨用組成物、それを用いた研磨方法及び基板の製造方法
CN102585706B (zh) * 2012-01-09 2013-11-20 清华大学 酸性化学机械抛光组合物
US9388330B2 (en) * 2012-12-17 2016-07-12 Fuji Engineering Co., Ltd. Bag containing blasting material
CN105102188B (zh) * 2013-03-12 2021-06-01 国立大学法人九州大学 研磨垫及研磨方法
JP6148932B2 (ja) * 2013-08-20 2017-06-14 花王株式会社 磁気ディスク基板用研磨液組成物
KR102289629B1 (ko) 2013-09-25 2021-08-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 세라믹 연마 복합재 폴리싱 용액
CN109054747A (zh) * 2018-09-13 2018-12-21 深圳市佳欣纳米科技有限公司 一种含有氧化硅和金刚石的不锈钢研磨液及其制备方法
US11198797B2 (en) * 2019-01-24 2021-12-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions having stabilized abrasive particles for polishing dielectric substrates
CN115353808B (zh) * 2022-07-13 2024-01-23 锦矽半导体(上海)有限公司 一种镍镀层用抛光液

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5489389A (en) 1977-12-27 1979-07-16 Fujimi Kenmazai Kougiyou Kk Composition for polishing of moldings in synthetic resin
US4956015A (en) 1988-01-19 1990-09-11 Mitsubishi Kasei Corporation Polishing composition
JPH0214280A (ja) 1988-07-01 1990-01-18 Showa Denko Kk プラスチック研磨用組成物
JP3582017B2 (ja) 1993-06-25 2004-10-27 株式会社フジミインコーポレーテッド 研磨用組成物およびプラスチック研磨用組成物
SG83711A1 (en) * 1998-04-23 2001-10-16 Tokyo Magnetic Printing Free abrasive slurry compositions
JP2000183002A (ja) * 1998-12-10 2000-06-30 Okamoto Machine Tool Works Ltd ウエハの研磨終点検出方法および研磨終点検出装置
US6332831B1 (en) * 2000-04-06 2001-12-25 Fujimi America Inc. Polishing composition and method for producing a memory hard disk
US6569215B2 (en) * 2000-04-17 2003-05-27 Showa Denko Kabushiki Kaisha Composition for polishing magnetic disk substrate
JP4009986B2 (ja) 2000-11-29 2007-11-21 株式会社フジミインコーポレーテッド 研磨用組成物、およびそれを用いてメモリーハードディスクを研磨する研磨方法

Also Published As

Publication number Publication date
DE602004003091T2 (de) 2007-05-03
EP1471124B1 (de) 2006-11-08
EP1471124A1 (de) 2004-10-27
US20040187393A1 (en) 2004-09-30
JP2004300347A (ja) 2004-10-28
JP4219722B2 (ja) 2009-02-04
DK1471124T3 (da) 2007-03-19
US7211121B2 (en) 2007-05-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee