DE60143981D1 - Substratstruktur - Google Patents
SubstratstrukturInfo
- Publication number
- DE60143981D1 DE60143981D1 DE60143981T DE60143981T DE60143981D1 DE 60143981 D1 DE60143981 D1 DE 60143981D1 DE 60143981 T DE60143981 T DE 60143981T DE 60143981 T DE60143981 T DE 60143981T DE 60143981 D1 DE60143981 D1 DE 60143981D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000358903A JP3857042B2 (ja) | 2000-11-27 | 2000-11-27 | 基板構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60143981D1 true DE60143981D1 (de) | 2011-03-17 |
Family
ID=18830736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60143981T Expired - Lifetime DE60143981D1 (de) | 2000-11-27 | 2001-11-27 | Substratstruktur |
Country Status (5)
Country | Link |
---|---|
US (1) | US6750537B2 (de) |
EP (1) | EP1209957B1 (de) |
JP (1) | JP3857042B2 (de) |
CN (1) | CN1190114C (de) |
DE (1) | DE60143981D1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012142371A (ja) * | 2010-12-28 | 2012-07-26 | Mitsubishi Electric Corp | 半導体パッケージ |
JP2023043862A (ja) * | 2021-09-16 | 2023-03-29 | 方略電子股▲ふん▼有限公司 | 電子装置 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3639443A1 (de) * | 1986-11-18 | 1988-05-26 | Ant Nachrichtentech | Leiterplatte und verfahren zu deren herstellung |
GB8705543D0 (en) * | 1987-03-10 | 1987-04-15 | Int Computers Ltd | Printed circuit board |
US4967314A (en) | 1988-03-28 | 1990-10-30 | Prime Computer Inc. | Circuit board construction |
JPH0499394A (ja) * | 1990-08-17 | 1992-03-31 | Cmk Corp | 多層プリント配線板 |
JPH05218618A (ja) * | 1992-01-30 | 1993-08-27 | Cmk Corp | プリント配線板の製造方法 |
JP2721093B2 (ja) * | 1992-07-21 | 1998-03-04 | 三菱電機株式会社 | 半導体装置 |
US5371403A (en) * | 1993-09-24 | 1994-12-06 | Vlsi Technology, Inc. | High performance package using high dielectric constant materials for power/ground and low dielectric constant materials for signal lines |
JPH08116174A (ja) * | 1994-08-25 | 1996-05-07 | Matsushita Electric Ind Co Ltd | 回路形成基板およびその製造方法 |
US5509200A (en) | 1994-11-21 | 1996-04-23 | International Business Machines Corporation | Method of making laminar stackable circuit board structure |
US5672911A (en) * | 1996-05-30 | 1997-09-30 | Lsi Logic Corporation | Apparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device package |
US5708296A (en) * | 1996-06-24 | 1998-01-13 | Intel Corporation | Power-ground plane for a C4 flip-chip substrate |
DE19642929A1 (de) * | 1996-10-17 | 1997-07-17 | Siemens Ag | Kontaktierung wenigstens eines Bauelementes auf einer mehrlagigen Leiterplatte |
TW424321B (en) * | 1996-10-31 | 2001-03-01 | Sharp Kk | Integrated electronic circuit |
JPH10284838A (ja) | 1997-04-01 | 1998-10-23 | Murata Mfg Co Ltd | 多層回路基板及びその実装方法 |
US5847936A (en) * | 1997-06-20 | 1998-12-08 | Sun Microsystems, Inc. | Optimized routing scheme for an integrated circuit/printed circuit board |
JP4099837B2 (ja) | 1997-08-27 | 2008-06-11 | 株式会社村田製作所 | 低温焼成セラミック多層基板の製造方法 |
EP1895589A3 (de) * | 1997-10-17 | 2013-04-03 | Ibiden Co., Ltd. | Substrat für eine Halbleiterpackung |
WO1999034654A1 (fr) * | 1997-12-29 | 1999-07-08 | Ibiden Co., Ltd. | Plaquette a circuits imprimes multicouche |
US5898217A (en) * | 1998-01-05 | 1999-04-27 | Motorola, Inc. | Semiconductor device including a substrate having clustered interconnects |
US6064113A (en) * | 1998-01-13 | 2000-05-16 | Lsi Logic Corporation | Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances |
US6008534A (en) * | 1998-01-14 | 1999-12-28 | Lsi Logic Corporation | Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines |
US6187652B1 (en) * | 1998-09-14 | 2001-02-13 | Fujitsu Limited | Method of fabrication of multiple-layer high density substrate |
JP2000100985A (ja) * | 1998-09-17 | 2000-04-07 | Nitto Denko Corp | 半導体素子実装用基板およびその製造方法と用途 |
US6239485B1 (en) * | 1998-11-13 | 2001-05-29 | Fujitsu Limited | Reduced cross-talk noise high density signal interposer with power and ground wrap |
US6413620B1 (en) * | 1999-06-30 | 2002-07-02 | Kyocera Corporation | Ceramic wiring substrate and method of producing the same |
US6137161A (en) * | 1999-09-14 | 2000-10-24 | International Business Machines Corporation | Interposer array module for capacitive decoupling and filtering |
JP2001168125A (ja) * | 1999-12-03 | 2001-06-22 | Nec Corp | 半導体装置 |
US6388207B1 (en) * | 2000-12-29 | 2002-05-14 | Intel Corporation | Electronic assembly with trench structures and methods of manufacture |
-
2000
- 2000-11-27 JP JP2000358903A patent/JP3857042B2/ja not_active Expired - Fee Related
-
2001
- 2001-11-27 US US09/993,561 patent/US6750537B2/en not_active Expired - Fee Related
- 2001-11-27 CN CNB011397039A patent/CN1190114C/zh not_active Expired - Fee Related
- 2001-11-27 DE DE60143981T patent/DE60143981D1/de not_active Expired - Lifetime
- 2001-11-27 EP EP01309936A patent/EP1209957B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1209957A2 (de) | 2002-05-29 |
EP1209957B1 (de) | 2011-02-02 |
JP3857042B2 (ja) | 2006-12-13 |
US6750537B2 (en) | 2004-06-15 |
CN1190114C (zh) | 2005-02-16 |
EP1209957A3 (de) | 2003-07-23 |
US20020063325A1 (en) | 2002-05-30 |
CN1356862A (zh) | 2002-07-03 |
JP2002164666A (ja) | 2002-06-07 |
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