DE60142540D1 - Schmiermittelfolie zur Herstellung von Löchern und Bohrverfahren zur Herstellung von Löchern - Google Patents

Schmiermittelfolie zur Herstellung von Löchern und Bohrverfahren zur Herstellung von Löchern

Info

Publication number
DE60142540D1
DE60142540D1 DE60142540T DE60142540T DE60142540D1 DE 60142540 D1 DE60142540 D1 DE 60142540D1 DE 60142540 T DE60142540 T DE 60142540T DE 60142540 T DE60142540 T DE 60142540T DE 60142540 D1 DE60142540 D1 DE 60142540D1
Authority
DE
Germany
Prior art keywords
holes
production
drilling process
lubricant film
lubricant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60142540T
Other languages
English (en)
Inventor
Mitsuo Eziri
Shinya Komatsu
Masaru Taguchi
Norio Nagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000267225A external-priority patent/JP4449196B2/ja
Priority claimed from JP2000267226A external-priority patent/JP4605323B2/ja
Priority claimed from JP2000267227A external-priority patent/JP4810722B2/ja
Priority claimed from JP2000310571A external-priority patent/JP5041621B2/ja
Priority claimed from JP2001107063A external-priority patent/JP2002301694A/ja
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Application granted granted Critical
Publication of DE60142540D1 publication Critical patent/DE60142540D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/55—Cutting by use of rotating axially moving tool with work-engaging structure other than Tool or tool-support
    • Y10T408/561—Having tool-opposing, work-engaging surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60142540T 2000-09-04 2001-09-04 Schmiermittelfolie zur Herstellung von Löchern und Bohrverfahren zur Herstellung von Löchern Expired - Lifetime DE60142540D1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000267225A JP4449196B2 (ja) 2000-09-04 2000-09-04 孔明け用滑剤シート及びドリル孔明け加工法
JP2000267226A JP4605323B2 (ja) 2000-09-04 2000-09-04 孔明け用滑剤シート及びドリル孔明け加工法
JP2000267227A JP4810722B2 (ja) 2000-09-04 2000-09-04 孔明け用滑剤シート及び孔明け加工法
JP2000310571A JP5041621B2 (ja) 2000-10-11 2000-10-11 孔明け用金属箔複合シート及びドリル孔明け加工法
JP2001107063A JP2002301694A (ja) 2001-04-05 2001-04-05 孔明け用金属箔複合シート及びドリル孔明け加工法

Publications (1)

Publication Number Publication Date
DE60142540D1 true DE60142540D1 (de) 2010-08-26

Family

ID=27531648

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60142540T Expired - Lifetime DE60142540D1 (de) 2000-09-04 2001-09-04 Schmiermittelfolie zur Herstellung von Löchern und Bohrverfahren zur Herstellung von Löchern

Country Status (7)

Country Link
US (1) US6753300B2 (de)
EP (3) EP2124513B1 (de)
KR (1) KR100832918B1 (de)
DE (1) DE60142540D1 (de)
MY (1) MY136615A (de)
SG (1) SG115399A1 (de)
TW (1) TW511427B (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001284510A1 (en) * 2000-09-14 2002-03-26 Ohtomo Chemical Ins., Corp. Entry boards for use in drilling small holes
US20050003169A1 (en) * 2003-01-28 2005-01-06 Nobuyuki Ikeguchi Lubricant sheet for drilling and method of drilling
JP4551654B2 (ja) * 2003-12-09 2010-09-29 株式会社神戸製鋼所 プリント配線基板の穴あけ加工に使用する樹脂被覆金属板
CN100348411C (zh) * 2004-04-13 2007-11-14 叶云照 钻孔润滑铝质复合材料
US20060062996A1 (en) * 2004-09-22 2006-03-23 Yun-Chao Yeh Resin matrix composite with aluminum for lubrication in drilling
KR100654522B1 (ko) * 2004-10-01 2006-12-05 예 윤 챠오 드릴링에서 윤활을 위한 알루미늄이 결합된 수지 매트릭스복합물
TWI298007B (en) * 2006-04-03 2008-06-11 Uniplus Electronics Co Ltd Heat-dissipating accessory plate for high speed drilling
JP5011823B2 (ja) * 2006-05-30 2012-08-29 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシートの製造方法
JP2008055644A (ja) * 2006-08-29 2008-03-13 Kobe Steel Ltd 樹脂被覆金属板およびこれを用いたプリント配線基板の穴あけ加工方法
TWM320275U (en) * 2007-04-23 2007-10-01 Uniplus Electronics Co Ltd Heat-dissipation auxiliary board for high-speed drilling
TWI407854B (zh) 2007-12-26 2013-09-01 Mitsubishi Gas Chemical Co 鑽孔用蓋板之製造方法及蓋板
CN102310342A (zh) * 2010-07-07 2012-01-11 合铭科技有限公司 低吸水的水溶性润滑膜及其制法
KR101859699B1 (ko) * 2011-01-07 2018-05-18 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 드릴 엔트리 시트
US9358618B2 (en) 2013-07-29 2016-06-07 Globalfoundries Inc. Implementing reduced drill smear
CN108025450B (zh) 2015-09-02 2018-12-07 三菱瓦斯化学株式会社 钻孔用盖板、和使用其的钻孔加工方法
EP3157310A1 (de) 2015-10-12 2017-04-19 Agfa Graphics Nv Erfassungsblatt zur perforation elektrischer platten, wie etwa leiterplatten
BR112018004848B1 (pt) * 2015-11-26 2023-02-14 Mitsubishi Gas Chemical Company, Inc. Método de corte
EP3417968B1 (de) 2016-02-17 2021-03-24 Mitsubishi Gas Chemical Company, Inc. Schneidverfahren und herstellungsverfahren für geschnittenes objekt
EP3539697A4 (de) 2016-11-14 2019-11-27 Mitsubishi Gas Chemical Company, Inc. Element zur formung einer aufgebauten kante und verfahren zur formung einer aufgebauten kante
EP3633014A4 (de) 2017-05-25 2020-06-10 Mitsubishi Gas Chemical Company, Inc. Schneidarbeitsunterstützendes schmiermaterial, schneidarbeitsunterstützende schmierblatt und schneidverfahren

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4781495A (en) * 1986-10-14 1988-11-01 Lubra Sheet Corp. Dry lubricant drilling of thru-holes in printed circuit boards
US4929370A (en) * 1986-10-14 1990-05-29 Lubra Sheet Corporation Dry lubricant drilling of thru-holes in printed circuit boards
US5067859A (en) * 1990-02-15 1991-11-26 Systems Division Incorporated Method for drilling small holes in printed circuit boards
JP2855824B2 (ja) 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
CN1047716C (zh) * 1991-02-07 1999-12-22 霍尔德斯科技有限公司 在印刷电路板钻孔过程中贴靠印刷电路板的引入板或垫板
NZ247942A (en) * 1992-06-29 1994-08-26 Grace W R & Co Composition comprising aqueous-processable polymer binder and a non-migrating surface active agent and its use as a slip film in a photo-curable element; manufacture of printing reliefs
JP2828129B2 (ja) * 1993-06-07 1998-11-25 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
US5507603A (en) * 1993-08-05 1996-04-16 Dai-Ichi Kogyo Seiyaku Co., Ltd. Method for drilling thru-holes on a lamination substrate and a sheet used therein
CA2146278C (en) * 1994-10-27 2001-06-19 Marshall A. Janoff Back-up material and method for drilling printed circuit boards
JPH08197496A (ja) * 1995-01-25 1996-08-06 Mitsubishi Gas Chem Co Inc プリント配線板の孔明け加工法
TW315338B (de) * 1996-02-08 1997-09-11 Showa Aluminiun Co Ltd
US5785465A (en) * 1996-07-30 1998-07-28 Systems Division Incorporated Entry overlay sheet and method for drilling holes
US5961255A (en) * 1996-07-30 1999-10-05 Systems Division Incorporated Entry overlay sheet and method for drilling holes
JP3693787B2 (ja) * 1997-05-30 2005-09-07 三菱アルミニウム株式会社 プリント配線板の孔明け加工用当て板及びプリント配線板の孔明け加工法
US6127038A (en) * 1997-12-11 2000-10-03 American Meter Company Printed circuit board coating and method
US6200074B1 (en) * 1999-04-07 2001-03-13 James J. Miller Method for drilling circuit boards

Also Published As

Publication number Publication date
US6753300B2 (en) 2004-06-22
TW511427B (en) 2002-11-21
EP2124512A3 (de) 2010-01-20
EP2124512A2 (de) 2009-11-25
US20020051684A1 (en) 2002-05-02
KR20020018984A (ko) 2002-03-09
KR100832918B1 (ko) 2008-05-28
EP1187516B1 (de) 2010-07-14
EP2124513A3 (de) 2010-01-20
SG115399A1 (en) 2005-10-28
MY136615A (en) 2008-10-31
EP1187516A2 (de) 2002-03-13
EP1187516A3 (de) 2003-12-10
EP2124513A2 (de) 2009-11-25
EP2124512B1 (de) 2011-06-29
EP2124513B1 (de) 2011-05-25

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