DE60141873D1 - Verfahren zur Herstellung von Akustischen Oberflächenwellenanordnungen - Google Patents

Verfahren zur Herstellung von Akustischen Oberflächenwellenanordnungen

Info

Publication number
DE60141873D1
DE60141873D1 DE60141873T DE60141873T DE60141873D1 DE 60141873 D1 DE60141873 D1 DE 60141873D1 DE 60141873 T DE60141873 T DE 60141873T DE 60141873 T DE60141873 T DE 60141873T DE 60141873 D1 DE60141873 D1 DE 60141873D1
Authority
DE
Germany
Prior art keywords
acoustic wave
surface acoustic
producing surface
wave assemblies
assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60141873T
Other languages
English (en)
Inventor
Masatoshi Nakagawa
Makoto Tose
Yoshihiro Koshido
Koji Fujimoto
Takeshi Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of DE60141873D1 publication Critical patent/DE60141873D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/42Piezoelectric device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128Assembling formed circuit to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49156Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE60141873T 2000-07-05 2001-06-27 Verfahren zur Herstellung von Akustischen Oberflächenwellenanordnungen Expired - Lifetime DE60141873D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000204270A JP3402313B2 (ja) 2000-07-05 2000-07-05 弾性表面波装置の製造方法

Publications (1)

Publication Number Publication Date
DE60141873D1 true DE60141873D1 (de) 2010-06-02

Family

ID=18701557

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60141873T Expired - Lifetime DE60141873D1 (de) 2000-07-05 2001-06-27 Verfahren zur Herstellung von Akustischen Oberflächenwellenanordnungen

Country Status (4)

Country Link
US (1) US6725513B2 (de)
EP (1) EP1170861B1 (de)
JP (1) JP3402313B2 (de)
DE (1) DE60141873D1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5278004B2 (ja) * 2009-01-30 2013-09-04 セイコーエプソン株式会社 弾性表面波素子および圧電デバイス
JP6410117B2 (ja) * 2017-02-21 2018-10-24 エスアイアイ・クリスタルテクノロジー株式会社 水晶振動片の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US521449A (en) 1894-06-19 Sand mold
DE2215151C3 (de) * 1972-03-28 1979-05-23 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen von dünnen Schichten aus Tantal
US4410867A (en) * 1978-12-28 1983-10-18 Western Electric Company, Inc. Alpha tantalum thin film circuit device
JPS62297892A (ja) 1986-06-18 1987-12-25 株式会社東芝 表示装置用駆動回路基板
US5221449A (en) * 1990-10-26 1993-06-22 International Business Machines Corporation Method of making Alpha-Ta thin films
JPH0897096A (ja) * 1994-09-28 1996-04-12 Sutaruku Buitetsuku Kk タンタル粉末及びそれを用いた電解コンデンサ
JP3173300B2 (ja) 1994-10-19 2001-06-04 株式会社村田製作所 ラブ波デバイス
US5815900A (en) * 1995-03-06 1998-10-06 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a surface acoustic wave module
JPH09125231A (ja) * 1995-10-30 1997-05-13 Fujitsu Ltd 導電膜とその形成方法及び磁気抵抗効果ヘッド
JPH10247835A (ja) * 1997-03-03 1998-09-14 Kokusai Electric Co Ltd ラブ波型弾性表面波デバイス
KR100713966B1 (ko) * 1997-07-28 2007-05-02 가부시끼가이샤 도시바 탄성표면파 장치 및 그의 제조방법
JP3317273B2 (ja) * 1998-08-25 2002-08-26 株式会社村田製作所 表面波共振子、フィルタ、共用器、通信機装置
JP3376969B2 (ja) * 1999-09-02 2003-02-17 株式会社村田製作所 弾性表面波装置及びその製造方法

Also Published As

Publication number Publication date
US6725513B2 (en) 2004-04-27
EP1170861A3 (de) 2008-03-26
JP3402313B2 (ja) 2003-05-06
EP1170861A2 (de) 2002-01-09
EP1170861B1 (de) 2010-04-21
JP2002026676A (ja) 2002-01-25
US20020157224A1 (en) 2002-10-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition