DE60141250D1 - Korrosionsbeständiges bauteil für anlage zur behandlung von halbleitern und verfahren zu seiner herstellung - Google Patents
Korrosionsbeständiges bauteil für anlage zur behandlung von halbleitern und verfahren zu seiner herstellungInfo
- Publication number
- DE60141250D1 DE60141250D1 DE60141250T DE60141250T DE60141250D1 DE 60141250 D1 DE60141250 D1 DE 60141250D1 DE 60141250 T DE60141250 T DE 60141250T DE 60141250 T DE60141250 T DE 60141250T DE 60141250 D1 DE60141250 D1 DE 60141250D1
- Authority
- DE
- Germany
- Prior art keywords
- liquid crystalline
- crystalline polymer
- component
- corrosion
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 229920000106 Liquid crystal polymer Polymers 0.000 abstract 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- 239000012764 mineral filler Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 238000007750 plasma spraying Methods 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000012763 reinforcing filler Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32467—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32559—Protection means, e.g. coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating By Spraying Or Casting (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/749,921 US7128804B2 (en) | 2000-12-29 | 2000-12-29 | Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof |
PCT/US2001/043152 WO2002068129A1 (en) | 2000-12-29 | 2001-11-21 | Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60141250D1 true DE60141250D1 (de) | 2010-03-25 |
Family
ID=25015771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60141250T Expired - Lifetime DE60141250D1 (de) | 2000-12-29 | 2001-11-21 | Korrosionsbeständiges bauteil für anlage zur behandlung von halbleitern und verfahren zu seiner herstellung |
Country Status (9)
Country | Link |
---|---|
US (3) | US7128804B2 (de) |
EP (1) | EP1345703B1 (de) |
JP (1) | JP2004523350A (de) |
KR (2) | KR100849866B1 (de) |
CN (1) | CN100434196C (de) |
AT (1) | ATE456985T1 (de) |
DE (1) | DE60141250D1 (de) |
TW (1) | TWI313304B (de) |
WO (1) | WO2002068129A1 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW514996B (en) | 1999-12-10 | 2002-12-21 | Tokyo Electron Ltd | Processing apparatus with a chamber having therein a high-corrosion-resistant sprayed film |
JP4602532B2 (ja) * | 2000-11-10 | 2010-12-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US20040055709A1 (en) * | 2002-09-19 | 2004-03-25 | Applied Materials, Inc. | Electrostatic chuck having a low level of particle generation and method of fabricating same |
US7137353B2 (en) | 2002-09-30 | 2006-11-21 | Tokyo Electron Limited | Method and apparatus for an improved deposition shield in a plasma processing system |
US7147749B2 (en) * | 2002-09-30 | 2006-12-12 | Tokyo Electron Limited | Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system |
US6798519B2 (en) | 2002-09-30 | 2004-09-28 | Tokyo Electron Limited | Method and apparatus for an improved optical window deposition shield in a plasma processing system |
US7166166B2 (en) | 2002-09-30 | 2007-01-23 | Tokyo Electron Limited | Method and apparatus for an improved baffle plate in a plasma processing system |
US7204912B2 (en) | 2002-09-30 | 2007-04-17 | Tokyo Electron Limited | Method and apparatus for an improved bellows shield in a plasma processing system |
US6837966B2 (en) | 2002-09-30 | 2005-01-04 | Tokyo Electron Limeted | Method and apparatus for an improved baffle plate in a plasma processing system |
US7166200B2 (en) * | 2002-09-30 | 2007-01-23 | Tokyo Electron Limited | Method and apparatus for an improved upper electrode plate in a plasma processing system |
TW200423195A (en) | 2002-11-28 | 2004-11-01 | Tokyo Electron Ltd | Internal member of a plasma processing vessel |
US20040134427A1 (en) * | 2003-01-09 | 2004-07-15 | Derderian Garo J. | Deposition chamber surface enhancement and resulting deposition chambers |
CN102460649B (zh) * | 2009-05-13 | 2015-03-11 | 应用材料公司 | 经阳极处理的喷头 |
WO2011031521A2 (en) * | 2009-08-27 | 2011-03-17 | Applied Materials, Inc. | Method of decontamination of process chamber after in-situ chamber clean |
US20110086462A1 (en) * | 2009-10-08 | 2011-04-14 | Ovshinsky Stanford R | Process for Manufacturing Solar Cells including Ambient Pressure Plasma Torch Step |
US9129795B2 (en) * | 2011-04-11 | 2015-09-08 | Quadrant Epp Ag | Process for plasma treatment employing ceramic-filled polyamideimide composite parts |
EP2525387A1 (de) * | 2011-05-17 | 2012-11-21 | Quadrant Epp Ag | Verfahren zur Plasmabehandlung mit keramikgefüllten Polyamid-Imid-Verbundstoffteilen |
US20130156530A1 (en) * | 2011-12-14 | 2013-06-20 | Intermolecular, Inc. | Method and apparatus for reducing contamination of substrate |
CN103681201B (zh) * | 2012-08-30 | 2016-03-09 | 宁波江丰电子材料股份有限公司 | 溅射环及其制造方法 |
KR101419515B1 (ko) * | 2012-09-24 | 2014-07-15 | 피에스케이 주식회사 | 배플 및 배플의 표면처리장치, 그리고 기판 처리 장치 및 표면 처리 방법 |
CN104968713B (zh) * | 2013-01-09 | 2019-05-03 | 株式会社村田制作所 | 处理完的液晶聚合物粉末的制造方法 |
US8970114B2 (en) | 2013-02-01 | 2015-03-03 | Lam Research Corporation | Temperature controlled window of a plasma processing chamber component |
KR20150129660A (ko) | 2013-03-14 | 2015-11-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 상의 고순도 알루미늄 탑 코트 |
US9123651B2 (en) | 2013-03-27 | 2015-09-01 | Lam Research Corporation | Dense oxide coated component of a plasma processing chamber and method of manufacture thereof |
US9449797B2 (en) * | 2013-05-07 | 2016-09-20 | Lam Research Corporation | Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface |
US9624593B2 (en) | 2013-08-29 | 2017-04-18 | Applied Materials, Inc. | Anodization architecture for electro-plate adhesion |
US20150099069A1 (en) * | 2013-10-07 | 2015-04-09 | AeonClad Coatings, LLC Technologies, Inc. | Low-cost plasma reactor |
US9663870B2 (en) | 2013-11-13 | 2017-05-30 | Applied Materials, Inc. | High purity metallic top coat for semiconductor manufacturing components |
US10524611B2 (en) * | 2014-07-03 | 2020-01-07 | B/E Aerospace, Inc. | Multi-phase circuit flow-through heater for aerospace beverage maker |
US11083329B2 (en) | 2014-07-03 | 2021-08-10 | B/E Aerospace, Inc. | Multi-phase circuit flow-through heater for aerospace beverage maker |
KR101909479B1 (ko) * | 2016-10-06 | 2018-10-19 | 세메스 주식회사 | 기판 지지 유닛, 그를 포함하는 기판 처리 장치, 그리고 그 제어 방법 |
CN112017932B (zh) * | 2019-05-31 | 2022-11-29 | 中微半导体设备(上海)股份有限公司 | 等离子体处理装置中气体输送系统的耐腐蚀结构 |
FI129719B (en) * | 2019-06-25 | 2022-07-29 | Picosun Oy | PLASMA IN SUBSTRATE PROCESSING EQUIPMENT |
CN114068273B (zh) * | 2020-07-31 | 2024-04-05 | 中微半导体设备(上海)股份有限公司 | 一种零部件及其制备方法和等离子体反应装置 |
US20230295789A1 (en) * | 2022-03-15 | 2023-09-21 | Applied Materials, Inc. | Dense vertically segmented silicon coating for low defectivity in high-temperature rapid thermal processing |
WO2024097506A1 (en) * | 2022-10-31 | 2024-05-10 | Lam Research Corporation | Refractory components for a semiconductor processing chamber |
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US4340462A (en) * | 1981-02-13 | 1982-07-20 | Lam Research Corporation | Adjustable electrode plasma processing chamber |
FR2538987A1 (fr) * | 1983-01-05 | 1984-07-06 | Commissariat Energie Atomique | Enceinte pour le traitement et notamment la gravure de substrats par la methode du plasma reactif |
JPS62103379A (ja) | 1985-10-29 | 1987-05-13 | Showa Alum Corp | Cvd装置およびドライ・エツチング装置における真空チヤンバの製造方法 |
US4736087A (en) * | 1987-01-12 | 1988-04-05 | Olin Corporation | Plasma stripper with multiple contact point cathode |
US5262029A (en) * | 1988-05-23 | 1993-11-16 | Lam Research | Method and system for clamping semiconductor wafers |
US5296542A (en) * | 1988-10-11 | 1994-03-22 | Amoco Corporation | Heat resistant polymers and blends of hydroquinone poly (isoterephthalates) containing residues of p-hydroxybenzoic acid |
US5216092A (en) * | 1988-10-11 | 1993-06-01 | Amoco Corporation | Blends of liquid crystalline polymers of hydroquinone poly(isoterephthalates) p-hydroxybenzoic acid polymers and another LCP containing oxybisbenzene and naphthalene derivatives |
WO1990011617A1 (en) | 1989-03-28 | 1990-10-04 | Nippon Steel Corporation | Resin-coated bonding wire, method of producing the same and semiconductor device |
US4948458A (en) * | 1989-08-14 | 1990-08-14 | Lam Research Corporation | Method and apparatus for producing magnetically-coupled planar plasma |
DE3941862A1 (de) * | 1989-12-19 | 1991-06-20 | Bayer Ag | Thermisch gespritzte schichten aus bestimmten, gegebenenfalls gefuellten hochtemperaturbestaendigen kunststoffmassen |
US5113159A (en) | 1990-02-22 | 1992-05-12 | At&T Bell Laboratories | Communications transmission system including facilities for suppressing electromagnetic interference |
US20020004309A1 (en) * | 1990-07-31 | 2002-01-10 | Kenneth S. Collins | Processes used in an inductively coupled plasma reactor |
US5196471A (en) * | 1990-11-19 | 1993-03-23 | Sulzer Plasma Technik, Inc. | Thermal spray powders for abradable coatings, abradable coatings containing solid lubricants and methods of fabricating abradable coatings |
US5200232A (en) * | 1990-12-11 | 1993-04-06 | Lam Research Corporation | Reaction chamber design and method to minimize particle generation in chemical vapor deposition reactors |
US5248530A (en) | 1991-11-27 | 1993-09-28 | Hoechst Celanese Corp. | Heat sealable coextruded lcp film |
US5413058A (en) | 1992-12-09 | 1995-05-09 | Hirose Manufacturing Co., Ltd. | Inner bobbin case holder of a fully rotating hook |
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US5397502A (en) * | 1993-06-10 | 1995-03-14 | E. I. Du Pont De Nemours And Company | Heat resistant liquid crsytalline polymers |
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EP0760526A4 (de) * | 1994-05-17 | 2001-01-10 | Hitachi Ltd | Einrichtung und verfahren zur plasma-behandlung |
US5606485A (en) * | 1994-07-18 | 1997-02-25 | Applied Materials, Inc. | Electrostatic chuck having improved erosion resistance |
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JP3972347B2 (ja) | 1997-03-28 | 2007-09-05 | Jsr株式会社 | 液状硬化性樹脂組成物 |
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US5939153A (en) | 1997-11-13 | 1999-08-17 | The Elizabeth And Sandor Valyi Foundation, Inc. | Multilayered plastic container |
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JP3748712B2 (ja) | 1998-05-29 | 2006-02-22 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | ライナー用樹脂成形体 |
US6703092B1 (en) | 1998-05-29 | 2004-03-09 | E.I. Du Pont De Nemours And Company | Resin molded article for chamber liner |
JP3190886B2 (ja) * | 1998-06-17 | 2001-07-23 | 日本電気株式会社 | 高分子膜の成長方法 |
JP2000100781A (ja) | 1998-09-18 | 2000-04-07 | Miyazaki Oki Electric Co Ltd | エッチング装置および半導体デバイスの製造方法 |
US6468665B1 (en) * | 1998-12-16 | 2002-10-22 | Sumitomo Chemical Company, Limited | Process for melt-bonding molded article of liquid crystalline polyester with metal |
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US6120854A (en) * | 1999-02-19 | 2000-09-19 | Northrop Grumman | Liquid crystal polymer coating process |
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US6326597B1 (en) * | 1999-04-15 | 2001-12-04 | Applied Materials, Inc. | Temperature control system for process chamber |
US20020036881A1 (en) * | 1999-05-07 | 2002-03-28 | Shamouil Shamouilian | Electrostatic chuck having composite base and method |
US6508911B1 (en) * | 1999-08-16 | 2003-01-21 | Applied Materials Inc. | Diamond coated parts in a plasma reactor |
US6372299B1 (en) | 1999-09-28 | 2002-04-16 | General Electric Company | Method for improving the oxidation-resistance of metal substrates coated with thermal barrier coatings |
US6294261B1 (en) | 1999-10-01 | 2001-09-25 | General Electric Company | Method for smoothing the surface of a protective coating |
TW514996B (en) | 1999-12-10 | 2002-12-21 | Tokyo Electron Ltd | Processing apparatus with a chamber having therein a high-corrosion-resistant sprayed film |
US6403491B1 (en) * | 2000-11-01 | 2002-06-11 | Applied Materials, Inc. | Etch method using a dielectric etch chamber with expanded process window |
-
2000
- 2000-12-29 US US09/749,921 patent/US7128804B2/en not_active Expired - Lifetime
-
2001
- 2001-11-21 EP EP01270109A patent/EP1345703B1/de not_active Expired - Lifetime
- 2001-11-21 WO PCT/US2001/043152 patent/WO2002068129A1/en active Application Filing
- 2001-11-21 KR KR1020037008853A patent/KR100849866B1/ko active IP Right Grant
- 2001-11-21 AT AT01270109T patent/ATE456985T1/de not_active IP Right Cessation
- 2001-11-21 CN CNB018224520A patent/CN100434196C/zh not_active Expired - Lifetime
- 2001-11-21 DE DE60141250T patent/DE60141250D1/de not_active Expired - Lifetime
- 2001-11-21 KR KR1020087010408A patent/KR20080052687A/ko not_active Application Discontinuation
- 2001-11-21 JP JP2002567476A patent/JP2004523350A/ja active Pending
- 2001-12-04 TW TW090130000A patent/TWI313304B/zh not_active IP Right Cessation
-
2006
- 2006-09-22 US US11/525,102 patent/US7605086B2/en not_active Expired - Fee Related
-
2009
- 2009-09-14 US US12/559,177 patent/US8486841B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US8486841B2 (en) | 2013-07-16 |
US20020086545A1 (en) | 2002-07-04 |
TWI313304B (en) | 2009-08-11 |
ATE456985T1 (de) | 2010-02-15 |
JP2004523350A (ja) | 2004-08-05 |
WO2002068129A1 (en) | 2002-09-06 |
CN100434196C (zh) | 2008-11-19 |
EP1345703A1 (de) | 2003-09-24 |
KR100849866B1 (ko) | 2008-08-01 |
US7605086B2 (en) | 2009-10-20 |
US20100003826A1 (en) | 2010-01-07 |
US20070012657A1 (en) | 2007-01-18 |
EP1345703B1 (de) | 2010-02-03 |
KR20080052687A (ko) | 2008-06-11 |
US7128804B2 (en) | 2006-10-31 |
CN1487858A (zh) | 2004-04-07 |
KR20030066785A (ko) | 2003-08-09 |
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