DE60112003D1 - Verbindung von mikromechanischen Bauelementen - Google Patents

Verbindung von mikromechanischen Bauelementen

Info

Publication number
DE60112003D1
DE60112003D1 DE60112003T DE60112003T DE60112003D1 DE 60112003 D1 DE60112003 D1 DE 60112003D1 DE 60112003 T DE60112003 T DE 60112003T DE 60112003 T DE60112003 T DE 60112003T DE 60112003 D1 DE60112003 D1 DE 60112003D1
Authority
DE
Germany
Prior art keywords
connection
micromechanical components
micromechanical
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60112003T
Other languages
English (en)
Other versions
DE60112003T2 (de
Inventor
Yinon Degani
Thomas Dixon Dudderar
King Lien Tai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agere Systems LLC
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Agere Systems Optoelectronics Guardian Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc, Agere Systems Optoelectronics Guardian Corp filed Critical Lucent Technologies Inc
Publication of DE60112003D1 publication Critical patent/DE60112003D1/de
Application granted granted Critical
Publication of DE60112003T2 publication Critical patent/DE60112003T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
DE60112003T 2000-06-06 2001-05-31 Verbindung von mikromechanischen Bauelementen Expired - Lifetime DE60112003T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US588336 2000-06-06
US09/588,336 US6396711B1 (en) 2000-06-06 2000-06-06 Interconnecting micromechanical devices

Publications (2)

Publication Number Publication Date
DE60112003D1 true DE60112003D1 (de) 2005-08-25
DE60112003T2 DE60112003T2 (de) 2006-06-01

Family

ID=24353426

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60112003T Expired - Lifetime DE60112003T2 (de) 2000-06-06 2001-05-31 Verbindung von mikromechanischen Bauelementen

Country Status (4)

Country Link
US (1) US6396711B1 (de)
EP (1) EP1162169B1 (de)
JP (1) JP5605599B2 (de)
DE (1) DE60112003T2 (de)

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US6430330B1 (en) * 2000-04-14 2002-08-06 C Speed Corporation Modular approach to substrate population in a fiber optic cross connect
US6621137B1 (en) * 2000-10-12 2003-09-16 Intel Corporation MEMS device integrated chip package, and method of making same
US6788981B2 (en) * 2001-02-07 2004-09-07 Movaz Networks, Inc. Multiplexed analog control system for electrostatic actuator array
US6781208B2 (en) * 2001-08-17 2004-08-24 Nec Corporation Functional device, method of manufacturing therefor and driver circuit
WO2003024169A1 (en) * 2001-09-10 2003-03-20 Memlink Ltd. A stacked multi-layer module and methods of side connection thereto and of manufacturing
WO2003042094A2 (en) * 2001-11-09 2003-05-22 Movaz Networks, Inc. Multi-chip module integrating mems mirror array with electronics
US6603182B1 (en) * 2002-03-12 2003-08-05 Lucent Technologies Inc. Packaging micromechanical devices
US20040163717A1 (en) * 2003-02-21 2004-08-26 Cookson Electronics, Inc. MEMS device assembly
US7514283B2 (en) 2003-03-20 2009-04-07 Robert Bosch Gmbh Method of fabricating electromechanical device having a controlled atmosphere
US8912174B2 (en) * 2003-04-16 2014-12-16 Mylan Pharmaceuticals Inc. Formulations and methods for treating rhinosinusitis
US7075160B2 (en) * 2003-06-04 2006-07-11 Robert Bosch Gmbh Microelectromechanical systems and devices having thin film encapsulated mechanical structures
US7170155B2 (en) * 2003-06-25 2007-01-30 Intel Corporation MEMS RF switch module including a vertical via
US7096568B1 (en) 2003-07-10 2006-08-29 Zyvex Corporation Method of manufacturing a microcomponent assembly
US20050012212A1 (en) * 2003-07-17 2005-01-20 Cookson Electronics, Inc. Reconnectable chip interface and chip package
US6952041B2 (en) * 2003-07-25 2005-10-04 Robert Bosch Gmbh Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
JP2005124018A (ja) * 2003-10-20 2005-05-12 Tdk Corp 電子部品およびその製造方法
US7303645B2 (en) * 2003-10-24 2007-12-04 Miradia Inc. Method and system for hermetically sealing packages for optics
US7025619B2 (en) * 2004-02-13 2006-04-11 Zyvex Corporation Sockets for microassembly
US7068125B2 (en) * 2004-03-04 2006-06-27 Robert Bosch Gmbh Temperature controlled MEMS resonator and method for controlling resonator frequency
US7081630B2 (en) * 2004-03-12 2006-07-25 Zyvex Corporation Compact microcolumn for automated assembly
US6956219B2 (en) * 2004-03-12 2005-10-18 Zyvex Corporation MEMS based charged particle deflector design
US7102467B2 (en) * 2004-04-28 2006-09-05 Robert Bosch Gmbh Method for adjusting the frequency of a MEMS resonator
US7102240B2 (en) * 2004-06-11 2006-09-05 Samsung Electro-Mechanics Co., Ltd. Embedded integrated circuit packaging structure
US7141870B2 (en) * 2004-07-28 2006-11-28 Miradia Inc. Apparatus for micro-electro mechanical system package
ATE416398T1 (de) 2004-11-09 2008-12-15 Koninkl Philips Electronics Nv Array von räumlichen lichtmodulatoren und verfahren zur herstellung einer räumlichen lichtmodulationsvorrichtung
US7344956B2 (en) * 2004-12-08 2008-03-18 Miradia Inc. Method and device for wafer scale packaging of optical devices using a scribe and break process
JP2006186136A (ja) * 2004-12-28 2006-07-13 Toshiba Corp 両面部品実装回路基板及びその製造方法
US7642628B2 (en) * 2005-01-11 2010-01-05 Rosemount Inc. MEMS packaging with improved reaction to temperature changes
US7314382B2 (en) 2005-05-18 2008-01-01 Zyvex Labs, Llc Apparatus and methods of manufacturing and assembling microscale and nanoscale components and assemblies
US7349140B2 (en) * 2005-05-31 2008-03-25 Miradia Inc. Triple alignment substrate method and structure for packaging devices
US20070170528A1 (en) 2006-01-20 2007-07-26 Aaron Partridge Wafer encapsulated microelectromechanical structure and method of manufacturing same
JP4703424B2 (ja) * 2006-02-10 2011-06-15 大日本印刷株式会社 複合センサーパッケージ
US7859277B2 (en) * 2006-04-24 2010-12-28 Verigy (Singapore) Pte. Ltd. Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array
DE102006046292B9 (de) * 2006-09-29 2014-04-30 Epcos Ag Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung
US7605377B2 (en) * 2006-10-17 2009-10-20 Zyvex Corporation On-chip reflectron and ion optics
US7755206B2 (en) * 2007-11-29 2010-07-13 International Business Machines Corporation Pad structure to provide improved stress relief
US8582312B2 (en) * 2008-03-24 2013-11-12 Panasonic Corporation Electronic circuit board and power line communication apparatus using it
CN103180940B (zh) * 2010-11-09 2016-06-15 三菱电机株式会社 封装
US8779578B2 (en) * 2012-06-29 2014-07-15 Hewlett-Packard Development Company, L.P. Multi-chip socket
US10025033B2 (en) 2016-03-01 2018-07-17 Advanced Semiconductor Engineering, Inc. Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same
US10241264B2 (en) 2016-07-01 2019-03-26 Advanced Semiconductor Engineering, Inc. Semiconductor device packages
CN114040307A (zh) * 2021-11-25 2022-02-11 荣成歌尔微电子有限公司 Mems麦克风和电子设备

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JP3237968B2 (ja) * 1993-08-18 2001-12-10 富士通株式会社 半導体素子モジュール
JP2847019B2 (ja) * 1993-11-18 1999-01-13 株式会社日立製作所 マルチディザー方式補償光学装置
FI945124A0 (fi) * 1994-10-31 1994-10-31 Valtion Teknillinen Spektrometer
US5926378A (en) * 1995-09-29 1999-07-20 International Business Machines Corporation Low profile riser card assembly using paired back-to-back peripheral card connectors mounted on universal footprints supporting different bus form factors
JPH09101468A (ja) * 1995-10-04 1997-04-15 Matsushita Electric Ind Co Ltd カラー式変形可能ミラーデバイス及び投射型画像表示装置
JPH09186424A (ja) * 1995-12-27 1997-07-15 Toshiba Corp プリント回路基板
US6002177A (en) * 1995-12-27 1999-12-14 International Business Machines Corporation High density integrated circuit packaging with chip stacking and via interconnections
JPH09264784A (ja) * 1996-03-28 1997-10-07 Terumo Corp 熱形赤外線センサ
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US6202110B1 (en) * 1997-03-31 2001-03-13 International Business Machines Corporation Memory cards with symmetrical pinout for back-to-back mounting in computer system
JPH1117058A (ja) * 1997-06-26 1999-01-22 Nec Corp Ｂｇａパッケージ、その試験用ソケットおよびｂｇａパッケージの試験方法
JPH11145393A (ja) * 1997-11-05 1999-05-28 Matsushita Electron Corp 半導体装置及びその製造方法
JP3718039B2 (ja) * 1997-12-17 2005-11-16 株式会社日立製作所 半導体装置およびそれを用いた電子装置
JPH11317486A (ja) * 1998-05-06 1999-11-16 Sony Corp 多足部品、及びその実装体

Also Published As

Publication number Publication date
EP1162169A3 (de) 2003-01-02
EP1162169B1 (de) 2005-07-20
DE60112003T2 (de) 2006-06-01
US6396711B1 (en) 2002-05-28
EP1162169A2 (de) 2001-12-12
JP5605599B2 (ja) 2014-10-15
JP2002036200A (ja) 2002-02-05

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Legal Events

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