DE60110225D1 - Eine schleif- und/oder polierscheibe mit mehreren zonen - Google Patents

Eine schleif- und/oder polierscheibe mit mehreren zonen

Info

Publication number
DE60110225D1
DE60110225D1 DE60110225T DE60110225T DE60110225D1 DE 60110225 D1 DE60110225 D1 DE 60110225D1 DE 60110225 T DE60110225 T DE 60110225T DE 60110225 T DE60110225 T DE 60110225T DE 60110225 D1 DE60110225 D1 DE 60110225D1
Authority
DE
Germany
Prior art keywords
grinding
polishing
zones
polishing disk
multiple zones
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60110225T
Other languages
English (en)
Other versions
DE60110225T2 (de
Inventor
Klaus Kisboll
J Damgaard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Struers ApS
Original Assignee
Struers ApS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Struers ApS filed Critical Struers ApS
Application granted granted Critical
Publication of DE60110225D1 publication Critical patent/DE60110225D1/de
Publication of DE60110225T2 publication Critical patent/DE60110225T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE60110225T 2000-06-19 2001-04-30 Eine schleif- und/oder polierscheibe mit mehreren zonen Expired - Lifetime DE60110225T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DKPA200000950 2000-06-19
DK200000950 2000-06-19
PCT/DK2001/000291 WO2001098027A1 (en) 2000-06-19 2001-04-30 A multi-zone grinding and/or polishing sheet

Publications (2)

Publication Number Publication Date
DE60110225D1 true DE60110225D1 (de) 2005-05-25
DE60110225T2 DE60110225T2 (de) 2006-03-09

Family

ID=8159564

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60110225T Expired - Lifetime DE60110225T2 (de) 2000-06-19 2001-04-30 Eine schleif- und/oder polierscheibe mit mehreren zonen

Country Status (6)

Country Link
US (1) US7004823B2 (de)
EP (1) EP1292428B1 (de)
JP (1) JP2003535707A (de)
AT (1) ATE293515T1 (de)
DE (1) DE60110225T2 (de)
WO (1) WO2001098027A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112338820A (zh) * 2020-10-27 2021-02-09 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、应用

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US7377840B2 (en) * 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
JP2005238413A (ja) * 2004-02-27 2005-09-08 Yachiyo Microscience Inc ラップ盤用回転定盤
JP2007081322A (ja) * 2005-09-16 2007-03-29 Jsr Corp 化学機械研磨パッドの製造方法
US7329174B2 (en) * 2004-05-20 2008-02-12 Jsr Corporation Method of manufacturing chemical mechanical polishing pad
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
KR100693251B1 (ko) * 2005-03-07 2007-03-13 삼성전자주식회사 연마 속도와 연마 패드의 조도를 향상시킬 수 있는 패드 컨디셔너 및 이를 이용하는 화학기계적 연마 장치
JP2006324416A (ja) * 2005-05-18 2006-11-30 Sumco Corp ウェーハ研磨装置及びウェーハ研磨方法
JP5034262B2 (ja) * 2006-02-24 2012-09-26 富士通セミコンダクター株式会社 研磨装置および研磨方法
ITMC20070237A1 (it) * 2007-12-12 2009-06-13 Ghines Srl Utensile abrasivo perfezionato.
ITRM20080565A1 (it) * 2008-10-22 2010-04-23 Quintilio Lupi Platorello plurilubrificato mediante circuito d'acqua e multifori in uscita superficie diamantata miscelata con resina epossidica per la lucidatura di lapidei in genere
DE102009025116A1 (de) 2009-06-11 2010-12-16 Dronco Ag Schleif-und/oder Polierwerkzeug und Herstellverfahren
US8206511B2 (en) 2009-10-06 2012-06-26 Ecolab Usa Inc. Daily cleaner with slip-resistant and gloss-enhancing properties
US9920281B2 (en) 2009-11-12 2018-03-20 Ecolab Usa Inc. Soil resistant surface treatment
US9011211B2 (en) * 2010-03-29 2015-04-21 Christian T. Zyniecki Sandpaper and method of use thereof
US8360823B2 (en) * 2010-06-15 2013-01-29 3M Innovative Properties Company Splicing technique for fixed abrasives used in chemical mechanical planarization
MX2013006549A (es) 2010-12-13 2013-07-17 Ecolab Usa Inc Limpiador para pisos resistente a la suciedad.
US8968058B2 (en) * 2011-05-05 2015-03-03 Nexplanar Corporation Polishing pad with alignment feature
ITMI20110850A1 (it) 2011-05-16 2012-11-17 Nicola Fiore Utensile multi-abrasivo
JP6239354B2 (ja) * 2012-12-04 2017-11-29 不二越機械工業株式会社 ウェーハ研磨装置
JP2014113657A (ja) * 2012-12-07 2014-06-26 Misumi Kagaku Co Ltd 研削紙円板
WO2014183091A1 (en) * 2013-05-09 2014-11-13 Lawrence Baker Blade sharpening system for a log saw machine
US9914199B2 (en) * 2013-12-09 2018-03-13 Saint-Gobain Abrasives, Inc. Abrasive disc
US9914197B2 (en) 2013-12-09 2018-03-13 Saint-Gobain Abrasives, Inc. Abrasive assembly having alignment elements
CN104070471B (zh) * 2014-06-24 2017-08-29 郑州磨料磨具磨削研究所有限公司 超硬材料磨盘及其制造方法
KR102213468B1 (ko) * 2014-08-26 2021-02-08 가부시키가이샤 에바라 세이사꾸쇼 버프 처리 장치 및 기판 처리 장치
JP2016124043A (ja) * 2014-12-26 2016-07-11 東洋ゴム工業株式会社 研磨パッド
CN106272010B (zh) * 2015-05-25 2019-03-08 蓝思科技股份有限公司 一种蓝宝石镜面基片内凹平台面的研磨抛光方法
CN104827386B (zh) * 2015-05-25 2018-10-12 蓝思科技股份有限公司 一种用于蓝宝石镜面抛光用磨头
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
ES2639374B1 (es) * 2016-04-26 2018-09-12 Abel Fernando PEREIRA DE OLIVEIRA Disco abrasivo multiangular para máquinas lijadoras
US11697182B2 (en) * 2016-04-27 2023-07-11 Dynamic Concrete, Llc Method and apparatus for removing stock material from a surface
US10471567B2 (en) 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
CN107053026B (zh) * 2017-01-06 2023-06-27 浙江工业大学 一种制备梯度功能研抛盘的方法及其制备装置
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
CN108346737B (zh) * 2018-02-08 2021-08-06 嘉兴晶控电子有限公司 压电石英基片生产工艺
KR102059647B1 (ko) * 2018-06-21 2019-12-26 에스케이씨 주식회사 슬러리 유동성이 향상된 연마패드 및 이의 제조방법
IT201900013485A1 (it) * 2019-07-31 2021-01-31 Premier S R L Gruppo abrasivo migliorato
JPWO2023013576A1 (de) * 2021-08-04 2023-02-09
CN113681474A (zh) * 2021-09-08 2021-11-23 江苏锋泰工具有限公司 一种减震轻型橡胶金刚石磨轮的制备方法
CN115635415A (zh) * 2022-09-30 2023-01-24 西安奕斯伟材料科技有限公司 研磨轮、研磨装置、研磨方法及硅片

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US959054A (en) * 1909-03-08 1910-05-24 Charles Glover Grinding and polishing disk.
US2451295A (en) * 1944-11-08 1948-10-12 Super Cut Abrasive wheel
US3026655A (en) * 1957-06-04 1962-03-27 Bisterfeld & Stolting Face grinding wheel
AU8515875A (en) * 1974-10-03 1977-03-31 Robert Campbell Murray Improvements in brushware
FR2523892A1 (fr) * 1982-03-26 1983-09-30 Procedes Equip Sciences Ind Perfectionnements aux machines de polissage a plateau tournant
JPS5914469A (ja) 1982-07-08 1984-01-25 Disco Abrasive Sys Ltd ポリツシング装置
USH244H (en) * 1986-03-16 1987-04-07 The United States Of America As Represented By The Secretary Of The Army Metallographic preparation of e-glass-epoxy composite material
USH361H (en) * 1987-03-23 1987-11-03 The United States Of America As Represented By The Secretary Of The Army Metallographic preparation of pressed and sintered powder metallurgy material (tungsten, columbium, lead and copper)
US5247765A (en) * 1991-07-23 1993-09-28 Abrasive Technology Europe, S.A. Abrasive product comprising a plurality of discrete composite abrasive pellets in a resilient resin matrix
US5527215A (en) * 1992-01-10 1996-06-18 Schlegel Corporation Foam buffing pad having a finishing surface with a splash reducing configuration
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
JPH09510405A (ja) * 1994-09-08 1997-10-21 ストルエルス アクチェ セルスカプ 回転可能な研削／研磨ディスクの上に置くための研削／研磨用カバーシート
WO1998028108A1 (en) * 1996-12-20 1998-07-02 Unique Technology International Private Limited Manufacture of porous polishing pad
KR100210840B1 (ko) * 1996-12-24 1999-07-15 구본준 기계 화학적 연마 방법 및 그 장치
JPH10230451A (ja) 1997-02-20 1998-09-02 Speedfam Co Ltd 研磨装置及びワーク測定方法
US6062958A (en) * 1997-04-04 2000-05-16 Micron Technology, Inc. Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
WO1999028083A1 (en) 1997-12-03 1999-06-10 Speedfam-Ipec Corporation Segmented polishing pad
US6083085A (en) * 1997-12-22 2000-07-04 Micron Technology, Inc. Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media
JP2000040215A (ja) * 1998-07-23 2000-02-08 Alps Electric Co Ltd スライダの製造方法
US6461226B1 (en) * 1998-11-25 2002-10-08 Promos Technologies, Inc. Chemical mechanical polishing of a metal layer using a composite polishing pad
US6290589B1 (en) 1998-12-09 2001-09-18 Applied Materials, Inc. Polishing pad with a partial adhesive coating
JP2000176829A (ja) * 1998-12-18 2000-06-27 Tdk Corp 研磨装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112338820A (zh) * 2020-10-27 2021-02-09 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、应用
CN112338820B (zh) * 2020-10-27 2021-10-29 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、应用

Also Published As

Publication number Publication date
JP2003535707A (ja) 2003-12-02
US20040048552A1 (en) 2004-03-11
US7004823B2 (en) 2006-02-28
DE60110225T2 (de) 2006-03-09
ATE293515T1 (de) 2005-05-15
EP1292428B1 (de) 2005-04-20
WO2001098027A1 (en) 2001-12-27
EP1292428A1 (de) 2003-03-19

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Legal Events

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8364 No opposition during term of opposition