DE60110149D1 - Testkopf für Mikrostrukturen - Google Patents

Testkopf für Mikrostrukturen

Info

Publication number
DE60110149D1
DE60110149D1 DE60110149T DE60110149T DE60110149D1 DE 60110149 D1 DE60110149 D1 DE 60110149D1 DE 60110149 T DE60110149 T DE 60110149T DE 60110149 T DE60110149 T DE 60110149T DE 60110149 D1 DE60110149 D1 DE 60110149D1
Authority
DE
Germany
Prior art keywords
microstructures
test head
test
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60110149T
Other languages
English (en)
Inventor
Giuseppe Crippa
Stefano Felici
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technoprobe SpA
Original Assignee
Technoprobe SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe SRL filed Critical Technoprobe SRL
Application granted granted Critical
Publication of DE60110149D1 publication Critical patent/DE60110149D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
DE60110149T 2000-05-11 2001-05-10 Testkopf für Mikrostrukturen Expired - Fee Related DE60110149D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2000MI001045A IT1317517B1 (it) 2000-05-11 2000-05-11 Testa di misura per microstrutture

Publications (1)

Publication Number Publication Date
DE60110149D1 true DE60110149D1 (de) 2005-05-25

Family

ID=11445027

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60110149T Expired - Fee Related DE60110149D1 (de) 2000-05-11 2001-05-10 Testkopf für Mikrostrukturen

Country Status (4)

Country Link
US (1) US6515496B2 (de)
EP (1) EP1154276B8 (de)
DE (1) DE60110149D1 (de)
IT (1) IT1317517B1 (de)

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* Cited by examiner, † Cited by third party
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ITMI20010567A1 (it) * 2001-03-19 2002-09-19 Technoprobe S R L Testa di misura a sonde verticali per dispositivi elettronici integrati su semiconduttore
JP2005050738A (ja) * 2003-07-31 2005-02-24 Jst Mfg Co Ltd 電気コネクタ
US7649372B2 (en) * 2003-11-14 2010-01-19 Wentworth Laboratories, Inc. Die design with integrated assembly aid
JP3791689B2 (ja) * 2004-01-09 2006-06-28 日本電子材料株式会社 プローブカード
WO2006054329A1 (ja) * 2004-11-16 2006-05-26 Fujitsu Limited コンタクタ及びコンタクタを用いた試験方法
CA2592901C (en) * 2007-07-13 2012-03-27 Martin Blouin Semi-generic in-circuit test fixture
EP2060922A1 (de) * 2007-11-16 2009-05-20 Technoprobe S.p.A Mikrostrukturprüfkopf
JP5064205B2 (ja) * 2007-12-27 2012-10-31 タイコエレクトロニクスジャパン合同会社 コンタクトおよびインタポーザ
US8808625B2 (en) * 2008-01-11 2014-08-19 National Institute Of Advanced Industrial Science And Technology Dispensing apparatus and a dispensing method
ATE519123T1 (de) * 2008-02-08 2011-08-15 Technoprobe Spa Kontaktstift für einen prüfkopf mit vertikalen prüfnadeln mit verbesserter schrubb-bewegung
DE102008023761B9 (de) * 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
US8324919B2 (en) * 2009-03-27 2012-12-04 Delaware Capital Formation, Inc. Scrub inducing compliant electrical contact
JP5514619B2 (ja) * 2009-12-24 2014-06-04 ガーディアンジャパン株式会社 配線検査治具
ITMI20110352A1 (it) * 2011-03-07 2012-09-08 Technoprobe Spa Testa di misura per un' apparecchiatura di test di dispositivi elettronici
US10006938B2 (en) * 2012-01-04 2018-06-26 Formfactor, Inc. Probes with programmable motion
US9470715B2 (en) * 2013-01-11 2016-10-18 Mpi Corporation Probe head
CN107250808A (zh) * 2014-12-04 2017-10-13 泰克诺探头公司 包括垂直探针的测试头
KR101656047B1 (ko) * 2016-03-23 2016-09-09 주식회사 나노시스 기판 검사용 지그
KR101869044B1 (ko) * 2016-11-10 2018-07-19 윌테크놀러지(주) 스크럽 현상이 저감된 수직형 프로브 카드용 니들유닛 및 이를 이용한 프로브 카드
US11262384B2 (en) * 2016-12-23 2022-03-01 Intel Corporation Fine pitch probe card methods and systems
JP6872960B2 (ja) * 2017-04-21 2021-05-19 株式会社日本マイクロニクス 電気的接続装置
DE102017209510A1 (de) * 2017-06-06 2018-12-06 Feinmetall Gmbh Kontaktelementsystem
US11268983B2 (en) 2017-06-30 2022-03-08 Intel Corporation Chevron interconnect for very fine pitch probing
US10775414B2 (en) 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
US10866264B2 (en) 2018-01-05 2020-12-15 Intel Corporation Interconnect structure with varying modulus of elasticity
DE102018204106A1 (de) * 2018-03-16 2019-09-19 Feinmetall Gmbh Prüfkarte zum elektrischen Verbinden eines Prüflings mit einer elektrischen Prüfeinrichtung
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects
IT201800021253A1 (it) * 2018-12-27 2020-06-27 Technoprobe Spa Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
CN112198346A (zh) * 2019-07-08 2021-01-08 技鼎股份有限公司 探针头及探针头的导电探针
US20220236304A1 (en) * 2021-01-28 2022-07-28 Formfactor, Inc. Probe Head Including a Guide Plate with Angled Holes to Determine Probe Flexure Direction

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3217283A (en) * 1962-12-26 1965-11-09 Amp Inc Miniature printed circuit pinboard
CH661129A5 (de) * 1982-10-21 1987-06-30 Feinmetall Gmbh Kontaktiervorrichtung.
US4686467A (en) * 1984-03-21 1987-08-11 Dit-Mco International Corp. Circuit board testing system
US4774462A (en) * 1984-06-11 1988-09-27 Black Thomas J Automatic test system
JPH0675415B2 (ja) * 1991-03-15 1994-09-21 山一電機株式会社 リードレス形ｉｃパッケージ用接続器
JPH11142433A (ja) * 1997-11-10 1999-05-28 Mitsubishi Electric Corp 垂直針型プローブカード用のプローブ針とその製造方法
JPH11145215A (ja) * 1997-11-11 1999-05-28 Mitsubishi Electric Corp 半導体検査装置およびその制御方法
US5952843A (en) * 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
KR20000040104A (ko) * 1998-12-17 2000-07-05 김영환 실리콘 온 인슐레이터 웨이퍼의 제조방법

Also Published As

Publication number Publication date
US6515496B2 (en) 2003-02-04
EP1154276B8 (de) 2005-06-15
IT1317517B1 (it) 2003-07-09
EP1154276A2 (de) 2001-11-14
EP1154276B1 (de) 2005-04-20
ITMI20001045A0 (it) 2000-05-11
EP1154276A3 (de) 2003-01-08
US20020024347A1 (en) 2002-02-28
ITMI20001045A1 (it) 2001-11-11

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: TECHNOPROBE S.P.A, CERNUSCO LOMBARDONE, IT

8339 Ceased/non-payment of the annual fee