DE60104738D1 - Hochfrequenz-Kommunikationsgerät und Verfahren zu dessen Herstellung - Google Patents

Hochfrequenz-Kommunikationsgerät und Verfahren zu dessen Herstellung

Info

Publication number
DE60104738D1
DE60104738D1 DE60104738T DE60104738T DE60104738D1 DE 60104738 D1 DE60104738 D1 DE 60104738D1 DE 60104738 T DE60104738 T DE 60104738T DE 60104738 T DE60104738 T DE 60104738T DE 60104738 D1 DE60104738 D1 DE 60104738D1
Authority
DE
Germany
Prior art keywords
production
communication device
frequency communication
frequency
communication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60104738T
Other languages
English (en)
Other versions
DE60104738T2 (de
Inventor
Atsushi Koshizaka
Shirou Oouchi
Mizuho Yokoyama
Keiji Kawahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE60104738D1 publication Critical patent/DE60104738D1/de
Application granted granted Critical
Publication of DE60104738T2 publication Critical patent/DE60104738T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B15/00—Suppression or limitation of noise or interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/16—Auxiliary devices for mode selection, e.g. mode suppression or mode promotion; for mode conversion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H01P1/211—Waffle-iron filters; Corrugated structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Waveguides (AREA)
  • Structure Of Receivers (AREA)
  • Noise Elimination (AREA)
DE60104738T 2000-01-31 2001-01-29 Hochfrequenz-Kommunikationsgerät und Verfahren zu dessen Herstellung Expired - Lifetime DE60104738T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000027216 2000-01-31
JP2000027216A JP3589137B2 (ja) 2000-01-31 2000-01-31 高周波通信装置およびその製造方法

Publications (2)

Publication Number Publication Date
DE60104738D1 true DE60104738D1 (de) 2004-09-16
DE60104738T2 DE60104738T2 (de) 2005-08-25

Family

ID=18552814

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60104738T Expired - Lifetime DE60104738T2 (de) 2000-01-31 2001-01-29 Hochfrequenz-Kommunikationsgerät und Verfahren zu dessen Herstellung

Country Status (5)

Country Link
US (2) US6580395B2 (de)
EP (1) EP1122808B1 (de)
JP (1) JP3589137B2 (de)
KR (1) KR20010078160A (de)
DE (1) DE60104738T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10024852C1 (de) * 2000-05-19 2001-11-15 Siemens Ag Verfahren zur Innenraum-/Außenraumerkennung eines mit einer Basisstation drahtlos kommunizierenden Antwortgebers sowie Kommunikationssystem
EP1479128A1 (de) 2001-11-27 2004-11-24 Radiant Networks Plc Hohlleiter und herstellungsverfahren dafür
JP3906090B2 (ja) 2002-02-05 2007-04-18 シャープ株式会社 液晶表示装置
JP3764877B2 (ja) 2002-10-16 2006-04-12 株式会社日立製作所 レーダ装置
JP2006156609A (ja) * 2004-11-29 2006-06-15 Yokohama Rubber Co Ltd:The 電波吸収筐体及びその製造方法
JP4777295B2 (ja) 2007-04-27 2011-09-21 株式会社豊田中央研究所 半導体チップ実装基板
US8514036B2 (en) * 2007-08-14 2013-08-20 Wemtec, Inc. Apparatus and method for mode suppression in microwave and millimeterwave packages
US9000869B2 (en) 2007-08-14 2015-04-07 Wemtec, Inc. Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages
US8816798B2 (en) * 2007-08-14 2014-08-26 Wemtec, Inc. Apparatus and method for electromagnetic mode suppression in microwave and millimeterwave packages
US9553371B2 (en) 2010-11-12 2017-01-24 Nxp Usa, Inc. Radar module
US9386688B2 (en) 2010-11-12 2016-07-05 Freescale Semiconductor, Inc. Integrated antenna package
JP5566933B2 (ja) * 2011-03-23 2014-08-06 古河電気工業株式会社 高周波通信装置
DE102013221064A1 (de) * 2013-10-17 2015-04-23 Robert Bosch Gmbh Abdeckung für einen Radarsensor für Kraftfahrzeuge
US10581141B2 (en) * 2016-10-21 2020-03-03 DISH Technologies L.L.C. RF antenna arrangement configured to be a part of a lid to an apparatus
US10320055B2 (en) 2017-04-28 2019-06-11 DISH Technologies L.L.C. Radio frequency antenna for short range communications
KR102442131B1 (ko) * 2018-01-26 2022-09-13 삼성전자 주식회사 안테나 장치 및 안테나 장치를 포함하는 전자 장치
KR20210084039A (ko) 2019-12-27 2021-07-07 삼성전자주식회사 무선 통신 시스템에서 안테나의 최적 빔 구현을 위한 커버 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3777286A (en) * 1972-08-07 1973-12-04 Hughes Aircraft Co Die cast waveguide low pass filter
CH660934A5 (en) * 1983-02-28 1987-05-29 Feller Ag Screening casing and an electrical plug assembly equipped therewith, especially an apparatus plug with an interference-protection filter
JPH0719644Y2 (ja) * 1991-09-04 1995-05-10 アイダエンジニアリング株式会社 プレス金型におけるノックアウト装置
JP3413992B2 (ja) * 1994-10-20 2003-06-09 富士通株式会社 集積回路の遮蔽構造
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
JPH10166072A (ja) * 1996-12-09 1998-06-23 Kanto Auto Works Ltd プレス加工装置のダイクッション
JP3013812B2 (ja) 1997-07-15 2000-02-28 住友電気工業株式会社 半導体容器及び半導体モジュール
JPH1174716A (ja) * 1997-08-29 1999-03-16 Mitsumi Electric Co Ltd Ｇｐｓアンテナカバー
US6118978A (en) * 1998-04-28 2000-09-12 Hughes Electronics Corporation Transverse-electric mode filters and methods
JP3739230B2 (ja) 1999-04-26 2006-01-25 株式会社日立製作所 高周波通信装置

Also Published As

Publication number Publication date
JP3589137B2 (ja) 2004-11-17
US20030122727A1 (en) 2003-07-03
KR20010078160A (ko) 2001-08-20
US6710745B2 (en) 2004-03-23
JP2001217785A (ja) 2001-08-10
EP1122808A1 (de) 2001-08-08
EP1122808B1 (de) 2004-08-11
US20010050644A1 (en) 2001-12-13
DE60104738T2 (de) 2005-08-25
US6580395B2 (en) 2003-06-17

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