DE60043323D1 - Verfahren zur Herstellung von Kupfer sowie Kupferlegierungen - Google Patents

Verfahren zur Herstellung von Kupfer sowie Kupferlegierungen

Info

Publication number
DE60043323D1
DE60043323D1 DE60043323T DE60043323T DE60043323D1 DE 60043323 D1 DE60043323 D1 DE 60043323D1 DE 60043323 T DE60043323 T DE 60043323T DE 60043323 T DE60043323 T DE 60043323T DE 60043323 D1 DE60043323 D1 DE 60043323D1
Authority
DE
Germany
Prior art keywords
copper
production
alloys
copper alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60043323T
Other languages
English (en)
Inventor
Akira Sugawara
Yoshitake Hana
Takayoshi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Metaltech Co Ltd
Original Assignee
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Application granted granted Critical
Publication of DE60043323D1 publication Critical patent/DE60043323D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/325—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with layers graded in composition or in physical properties
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
DE60043323T 1999-02-03 2000-02-02 Verfahren zur Herstellung von Kupfer sowie Kupferlegierungen Expired - Lifetime DE60043323D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06376099A JP4218042B2 (ja) 1999-02-03 1999-02-03 銅または銅基合金の製造方法

Publications (1)

Publication Number Publication Date
DE60043323D1 true DE60043323D1 (de) 2009-12-31

Family

ID=13238678

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60043323T Expired - Lifetime DE60043323D1 (de) 1999-02-03 2000-02-02 Verfahren zur Herstellung von Kupfer sowie Kupferlegierungen

Country Status (4)

Country Link
US (1) US6312762B1 (de)
EP (1) EP1026287B1 (de)
JP (1) JP4218042B2 (de)
DE (1) DE60043323D1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002078144A (ja) * 2000-08-24 2002-03-15 Sumitomo Wiring Syst Ltd 電気接続箱
EP1352993B1 (de) * 2001-01-19 2011-05-11 The Furukawa Electric Co., Ltd. Herstellung eines metallplattierten materials
US20050037229A1 (en) * 2001-01-19 2005-02-17 Hitoshi Tanaka Plated material, method of producing same, and electrical / electronic part using same
JP2002226982A (ja) * 2001-01-31 2002-08-14 Dowa Mining Co Ltd 耐熱性皮膜、その製造方法および電気電子部品
JP2004006065A (ja) * 2002-03-25 2004-01-08 Mitsubishi Shindoh Co Ltd 電気接続用嵌合型接続端子
US7867625B2 (en) 2002-06-13 2011-01-11 Nihon New Chrome Co., Ltd. Copper-tin-oxygen alloy plating
CN100460570C (zh) * 2002-06-13 2009-02-11 日本新铬电镀株式会社 铜-锡-氧系合金镀层
JP4228234B2 (ja) 2004-07-08 2009-02-25 株式会社フジクラ フレキシブルプリント配線基板端子部或いはフレキシブルフラットケーブル端子部
KR100870334B1 (ko) * 2004-09-10 2008-11-25 가부시키가이샤 고베 세이코쇼 접속 부품용 도전 재료 및 그의 제조방법
JP4934456B2 (ja) 2006-02-20 2012-05-16 古河電気工業株式会社 めっき材料および前記めっき材料が用いられた電気電子部品
JP2008161246A (ja) * 2006-12-27 2008-07-17 Ykk Corp ばね性を備えた部材及びこれを使用した製品
CN101682135B (zh) 2007-04-09 2013-10-02 古河电气工业株式会社 连接器和连接器用金属材料
JP5355935B2 (ja) 2007-05-29 2013-11-27 古河電気工業株式会社 電気電子部品用金属材料
US20110036621A1 (en) 2007-06-29 2011-02-17 The Furukawa Electric Co., Ltd. Metal material, method for producing the same, and electrical/electronic component using the same
US8907226B2 (en) * 2008-03-11 2014-12-09 Hitachi Metals, Ltd. Conductor for flexible substrate and fabrication method of same, and flexible substrate using same
JP2009231065A (ja) * 2008-03-24 2009-10-08 Fujikura Ltd 錫系めっき平角導体およびフレキシブルフラットケーブル
JP5436391B2 (ja) * 2010-10-22 2014-03-05 Ｄｏｗａメタルテック株式会社 皮膜および電気電子部品
DE102010054539A1 (de) * 2010-12-15 2012-06-21 OTB Oberflächentechnik in Berlin GmbH & Co. KG Verfahren zur Herstellung eines Werkstücks aus Kupfer oder einer Kupferlegierung mit einer Beschichtung
CN102347581B (zh) * 2011-09-16 2013-06-05 贵州航天电子科技有限公司 一种电连接器插孔热处理工艺
JP5765323B2 (ja) * 2012-12-07 2015-08-19 日立金属株式会社 銅ボンディングワイヤ及びその製造方法
JP5668814B1 (ja) * 2013-08-12 2015-02-12 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子およびバスバー
CN108551015B (zh) * 2018-03-31 2021-02-19 温州市力博电子有限公司 一种连接器端子
JP7176372B2 (ja) * 2018-11-27 2022-11-22 Ｉ－Ｐｅｘ株式会社 端子
CN113990692B (zh) * 2021-10-28 2023-08-01 清研特材科技(洛阳)有限公司 一种高强度耐磨耐腐蚀型触头的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2519201A1 (fr) 1981-12-28 1983-07-01 Labinal Procede de traitement de surfaces d'organes de liaison electrique
US4511410A (en) * 1984-04-02 1985-04-16 Olin Corporation Copper-tin alloys having improved wear properties
JPH02173294A (ja) 1988-12-26 1990-07-04 Nippon Mining Co Ltd 錫または錫合金めっき材のリフロー処理方法
US5262022A (en) * 1991-05-28 1993-11-16 Rockwell International Corporation Method of assessing solderability
US5166607A (en) * 1991-05-31 1992-11-24 Vlsi Technology, Inc. Method and apparatus to heat the surface of a semiconductor die in a device during burn-in while withdrawing heat from device leads
JP3903326B2 (ja) 1993-11-05 2007-04-11 Ｄｏｗａホールディングス株式会社 銅基合金およびその製造法
EP0834602A1 (de) 1996-09-26 1998-04-08 The Whitaker Corporation Verfahren zum Schützen einer Silberoberfläche und elektrischer Kontakt mit einer Silberoberfläche

Also Published As

Publication number Publication date
US6312762B1 (en) 2001-11-06
JP4218042B2 (ja) 2009-02-04
EP1026287B1 (de) 2009-11-18
EP1026287A1 (de) 2000-08-09
JP2000226645A (ja) 2000-08-15

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