DE60039847D1 - Wärmeverwaltung für EUV-Retikel - Google Patents

Wärmeverwaltung für EUV-Retikel

Info

Publication number
DE60039847D1
DE60039847D1 DE60039847T DE60039847T DE60039847D1 DE 60039847 D1 DE60039847 D1 DE 60039847D1 DE 60039847 T DE60039847 T DE 60039847T DE 60039847 T DE60039847 T DE 60039847T DE 60039847 D1 DE60039847 D1 DE 60039847D1
Authority
DE
Germany
Prior art keywords
heat management
euv reticles
reticles
euv
management
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60039847T
Other languages
English (en)
Inventor
Andrew W Mccullough
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
Original Assignee
ASML Holding NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Holding NV filed Critical ASML Holding NV
Application granted granted Critical
Publication of DE60039847D1 publication Critical patent/DE60039847D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
DE60039847T 1999-12-27 2000-12-20 Wärmeverwaltung für EUV-Retikel Expired - Fee Related DE60039847D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/473,259 US6445439B1 (en) 1999-12-27 1999-12-27 EUV reticle thermal management

Publications (1)

Publication Number Publication Date
DE60039847D1 true DE60039847D1 (de) 2008-09-25

Family

ID=23878824

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60039847T Expired - Fee Related DE60039847D1 (de) 1999-12-27 2000-12-20 Wärmeverwaltung für EUV-Retikel

Country Status (6)

Country Link
US (1) US6445439B1 (de)
EP (1) EP1120690B1 (de)
JP (1) JP2001237181A (de)
KR (1) KR100627251B1 (de)
CA (1) CA2328017A1 (de)
DE (1) DE60039847D1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6781673B2 (en) * 2000-08-25 2004-08-24 Asml Netherlands B.V. Mask handling apparatus, lithographic projection apparatus, device manufacturing method and device manufactured thereby
US6834158B1 (en) * 2000-09-22 2004-12-21 Advanced Micro Devices, Inc. Pinhole defect repair by resist flow
US6573480B1 (en) * 2000-10-24 2003-06-03 Advanced Micro Devices, Inc. Use of thermal flow to remove side lobes
US20040051984A1 (en) * 2002-06-25 2004-03-18 Nikon Corporation Devices and methods for cooling optical elements in optical systems, including optical systems used in vacuum environments
US7105836B2 (en) 2002-10-18 2006-09-12 Asml Holding N.V. Method and apparatus for cooling a reticle during lithographic exposure
KR101006435B1 (ko) * 2003-09-01 2011-01-06 삼성전자주식회사 노광 마스크, 이를 포함하는 노광 장치 및 이를 이용한표시 장치용 표시판의 제조 방법
US20070211232A1 (en) * 2003-11-10 2007-09-13 Phillips Alton H Thermophoretic Techniques for Protecting Reticles from Contaminants
US6977713B2 (en) * 2003-12-08 2005-12-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JPWO2005083759A1 (ja) * 2004-02-27 2007-08-09 株式会社ニコン 露光装置、及び微細パターンを有するデバイスの製造方法
US7375794B2 (en) * 2004-08-04 2008-05-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7323698B2 (en) * 2004-10-19 2008-01-29 Nikon Corporation Thermally insulated thermophoretic plate
US7362413B2 (en) * 2004-12-09 2008-04-22 Asml Netherlands B.V. Uniformity correction for lithographic apparatus
US7423721B2 (en) * 2004-12-15 2008-09-09 Asml Netherlands B.V. Lithographic apparatus
US7462841B2 (en) 2005-10-19 2008-12-09 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and use of a radiation collector
US7359029B2 (en) 2006-05-25 2008-04-15 Asml Netherlands B.V. Lithographic apparatus and method of reducing thermal distortion
US20100053575A1 (en) * 2008-09-04 2010-03-04 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal Control For EUV Lithography
US20100186942A1 (en) * 2009-01-23 2010-07-29 Phillips Alton H Reticle error reduction by cooling
US8794011B2 (en) 2010-10-15 2014-08-05 Nikon Corporation Method and apparatus for utilizing in-situ measurements techniques in conjunction with thermoelectric chips (TECs)
DE102011086513A1 (de) * 2011-11-16 2013-05-16 Carl Zeiss Smt Gmbh Projektionsbelichtungsverfahren und Projektionsbelichtungsanlage für die Mikrolithographie
US9164388B2 (en) * 2012-04-10 2015-10-20 Kla-Tencor Corporation Temperature control in EUV reticle inspection tool
DE102012213794A1 (de) * 2012-08-03 2014-02-06 Carl Zeiss Smt Gmbh Maskeninspektionsverfahren und Maskeninspektionssystem für EUV-Masken
US20150212432A1 (en) * 2012-09-25 2015-07-30 Asml Netherlands B.V. Reticle Heater to Keep Reticle Heating Uniform
US9244368B2 (en) 2012-09-26 2016-01-26 Kla-Tencor Corporation Particle control near reticle and optics using showerhead
JP2014165460A (ja) * 2013-02-27 2014-09-08 Toshiba Corp 半導体製造装置および半導体装置の製造方法
NL2015892A (en) 2014-12-31 2016-09-22 Asml Holding Nv Reticle cooling by non-uniform gas flow.
CN108885406B (zh) * 2016-03-24 2020-09-11 Asml荷兰有限公司 图案化设备冷却系统以及热调节图案化设备的方法
NL2019362A (en) 2016-09-02 2018-03-06 Asml Netherlands Bv Lithographic Apparatus
NL2023907A (en) * 2018-10-05 2020-05-06 Asml Netherlands Bv Gas Mixing For Fast Temperature Control On the Cooling Hood
KR20210016142A (ko) 2019-07-31 2021-02-15 삼성전자주식회사 Euv 레티클 검사 방법, 레티클 제조 방법 및 그를 포함하는 반도체 소자의 제조 방법
US11822256B2 (en) * 2021-05-06 2023-11-21 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
KR20240021180A (ko) 2021-06-14 2024-02-16 에이에스엠엘 네델란즈 비.브이. 레티클용 냉각 후드

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4202623A (en) * 1979-01-08 1980-05-13 The Perkin-Elmer Corporation Temperature compensated alignment system
JPS60158626A (ja) * 1984-01-30 1985-08-20 Canon Inc 半導体露光装置
JPS63194332A (ja) * 1987-02-09 1988-08-11 Canon Inc リソグラフイ−用マスク構造体およびリソグラフイ−法
EP0357423B1 (de) * 1988-09-02 1995-03-15 Canon Kabushiki Kaisha Belichtungseinrichtung
DE68922945T2 (de) * 1988-09-09 1995-11-16 Canon Kk Belichtungsvorrichtung.
JPH0276212A (ja) * 1988-09-13 1990-03-15 Canon Inc 多重露光方法
DE68922061T2 (de) * 1988-10-03 1995-08-31 Canon Kk Vorrichtung zum Regeln der Temperatur.
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
DE69220868T2 (de) * 1991-09-07 1997-11-06 Canon Kk System zur Stabilisierung der Formen von optischen Elementen, Belichtungsvorrichtung unter Verwendung dieses Systems und Verfahren zur Herstellung von Halbleitervorrichtungen
JPH05291117A (ja) * 1992-04-14 1993-11-05 Hitachi Ltd 投影露光方法およびその装置
JPH06177003A (ja) * 1992-12-07 1994-06-24 Hitachi Ltd 投影露光方法および投影露光装置
JPH1131647A (ja) * 1997-07-11 1999-02-02 Oki Electric Ind Co Ltd 投影露光装置

Also Published As

Publication number Publication date
KR20010067473A (ko) 2001-07-12
JP2001237181A (ja) 2001-08-31
EP1120690A3 (de) 2004-12-15
US6445439B1 (en) 2002-09-03
KR100627251B1 (ko) 2006-09-22
CA2328017A1 (en) 2001-06-27
EP1120690B1 (de) 2008-08-13
EP1120690A2 (de) 2001-08-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee