DE60039847D1 - Wärmeverwaltung für EUV-Retikel - Google Patents
Wärmeverwaltung für EUV-RetikelInfo
- Publication number
- DE60039847D1 DE60039847D1 DE60039847T DE60039847T DE60039847D1 DE 60039847 D1 DE60039847 D1 DE 60039847D1 DE 60039847 T DE60039847 T DE 60039847T DE 60039847 T DE60039847 T DE 60039847T DE 60039847 D1 DE60039847 D1 DE 60039847D1
- Authority
- DE
- Germany
- Prior art keywords
- heat management
- euv reticles
- reticles
- euv
- management
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/473,259 US6445439B1 (en) | 1999-12-27 | 1999-12-27 | EUV reticle thermal management |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60039847D1 true DE60039847D1 (de) | 2008-09-25 |
Family
ID=23878824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60039847T Expired - Fee Related DE60039847D1 (de) | 1999-12-27 | 2000-12-20 | Wärmeverwaltung für EUV-Retikel |
Country Status (6)
Country | Link |
---|---|
US (1) | US6445439B1 (de) |
EP (1) | EP1120690B1 (de) |
JP (1) | JP2001237181A (de) |
KR (1) | KR100627251B1 (de) |
CA (1) | CA2328017A1 (de) |
DE (1) | DE60039847D1 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6781673B2 (en) * | 2000-08-25 | 2004-08-24 | Asml Netherlands B.V. | Mask handling apparatus, lithographic projection apparatus, device manufacturing method and device manufactured thereby |
US6834158B1 (en) * | 2000-09-22 | 2004-12-21 | Advanced Micro Devices, Inc. | Pinhole defect repair by resist flow |
US6573480B1 (en) * | 2000-10-24 | 2003-06-03 | Advanced Micro Devices, Inc. | Use of thermal flow to remove side lobes |
US20040051984A1 (en) * | 2002-06-25 | 2004-03-18 | Nikon Corporation | Devices and methods for cooling optical elements in optical systems, including optical systems used in vacuum environments |
US7105836B2 (en) * | 2002-10-18 | 2006-09-12 | Asml Holding N.V. | Method and apparatus for cooling a reticle during lithographic exposure |
KR101006435B1 (ko) * | 2003-09-01 | 2011-01-06 | 삼성전자주식회사 | 노광 마스크, 이를 포함하는 노광 장치 및 이를 이용한표시 장치용 표시판의 제조 방법 |
US20070211232A1 (en) * | 2003-11-10 | 2007-09-13 | Phillips Alton H | Thermophoretic Techniques for Protecting Reticles from Contaminants |
US6977713B2 (en) * | 2003-12-08 | 2005-12-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2005083759A1 (ja) * | 2004-02-27 | 2005-09-09 | Nikon Corporation | 露光装置、及び微細パターンを有するデバイスの製造方法 |
US7375794B2 (en) | 2004-08-04 | 2008-05-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7323698B2 (en) * | 2004-10-19 | 2008-01-29 | Nikon Corporation | Thermally insulated thermophoretic plate |
US7362413B2 (en) * | 2004-12-09 | 2008-04-22 | Asml Netherlands B.V. | Uniformity correction for lithographic apparatus |
US7423721B2 (en) * | 2004-12-15 | 2008-09-09 | Asml Netherlands B.V. | Lithographic apparatus |
US7462841B2 (en) | 2005-10-19 | 2008-12-09 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, and use of a radiation collector |
US7359029B2 (en) | 2006-05-25 | 2008-04-15 | Asml Netherlands B.V. | Lithographic apparatus and method of reducing thermal distortion |
US20100053575A1 (en) * | 2008-09-04 | 2010-03-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal Control For EUV Lithography |
US20100186942A1 (en) * | 2009-01-23 | 2010-07-29 | Phillips Alton H | Reticle error reduction by cooling |
US8794011B2 (en) | 2010-10-15 | 2014-08-05 | Nikon Corporation | Method and apparatus for utilizing in-situ measurements techniques in conjunction with thermoelectric chips (TECs) |
DE102011086513A1 (de) * | 2011-11-16 | 2013-05-16 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsverfahren und Projektionsbelichtungsanlage für die Mikrolithographie |
US9164388B2 (en) * | 2012-04-10 | 2015-10-20 | Kla-Tencor Corporation | Temperature control in EUV reticle inspection tool |
DE102012213794A1 (de) * | 2012-08-03 | 2014-02-06 | Carl Zeiss Smt Gmbh | Maskeninspektionsverfahren und Maskeninspektionssystem für EUV-Masken |
WO2014048651A1 (en) * | 2012-09-25 | 2014-04-03 | Asml Netherlands B.V. | Reticle heater to keep reticle heating uniform |
US9244368B2 (en) * | 2012-09-26 | 2016-01-26 | Kla-Tencor Corporation | Particle control near reticle and optics using showerhead |
JP2014165460A (ja) * | 2013-02-27 | 2014-09-08 | Toshiba Corp | 半導体製造装置および半導体装置の製造方法 |
NL2015892A (en) | 2014-12-31 | 2016-09-22 | Asml Holding Nv | Reticle cooling by non-uniform gas flow. |
NL2018383A (en) | 2016-03-24 | 2017-10-02 | Asml Netherlands Bv | Patterning device cooling system and method of thermally conditioning a patterning device |
KR102458061B1 (ko) | 2016-09-02 | 2022-10-24 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 |
CN112805625B (zh) * | 2018-10-05 | 2024-05-07 | Asml荷兰有限公司 | 用于对冷却罩的快速温度控制的气体混合 |
KR20210016142A (ko) | 2019-07-31 | 2021-02-15 | 삼성전자주식회사 | Euv 레티클 검사 방법, 레티클 제조 방법 및 그를 포함하는 반도체 소자의 제조 방법 |
US11822256B2 (en) * | 2021-05-06 | 2023-11-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor processing tool and methods of operation |
WO2022263148A1 (en) | 2021-06-14 | 2022-12-22 | Asml Netherlands B.V. | Cooling hood for reticle |
WO2024138529A1 (zh) * | 2022-12-29 | 2024-07-04 | 中国科学院光电技术研究所 | 一种图案形成装置的热控方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4202623A (en) * | 1979-01-08 | 1980-05-13 | The Perkin-Elmer Corporation | Temperature compensated alignment system |
JPS60158626A (ja) * | 1984-01-30 | 1985-08-20 | Canon Inc | 半導体露光装置 |
JPS63194332A (ja) * | 1987-02-09 | 1988-08-11 | Canon Inc | リソグラフイ−用マスク構造体およびリソグラフイ−法 |
DE68921687T2 (de) * | 1988-09-02 | 1995-08-03 | Canon K.K., Tokio/Tokyo | Belichtungseinrichtung. |
DE68922945T2 (de) * | 1988-09-09 | 1995-11-16 | Canon K.K., Tokio/Tokyo | Belichtungsvorrichtung. |
JPH0276212A (ja) * | 1988-09-13 | 1990-03-15 | Canon Inc | 多重露光方法 |
DE68922061T2 (de) * | 1988-10-03 | 1995-08-31 | Canon Kk | Vorrichtung zum Regeln der Temperatur. |
EP0484179B1 (de) * | 1990-11-01 | 1996-03-27 | Canon Kabushiki Kaisha | Waferhaltebefestigung für Belichtungsgerät |
EP0532236B1 (de) * | 1991-09-07 | 1997-07-16 | Canon Kabushiki Kaisha | System zur Stabilisierung der Formen von optischen Elementen, Belichtungsvorrichtung unter Verwendung dieses Systems und Verfahren zur Herstellung von Halbleitervorrichtungen |
JPH05291117A (ja) * | 1992-04-14 | 1993-11-05 | Hitachi Ltd | 投影露光方法およびその装置 |
JPH06177003A (ja) * | 1992-12-07 | 1994-06-24 | Hitachi Ltd | 投影露光方法および投影露光装置 |
JPH1131647A (ja) * | 1997-07-11 | 1999-02-02 | Oki Electric Ind Co Ltd | 投影露光装置 |
-
1999
- 1999-12-27 US US09/473,259 patent/US6445439B1/en not_active Expired - Lifetime
-
2000
- 2000-12-12 CA CA002328017A patent/CA2328017A1/en not_active Abandoned
- 2000-12-20 DE DE60039847T patent/DE60039847D1/de not_active Expired - Fee Related
- 2000-12-20 KR KR1020000078947A patent/KR100627251B1/ko not_active IP Right Cessation
- 2000-12-20 EP EP00128004A patent/EP1120690B1/de not_active Expired - Lifetime
- 2000-12-26 JP JP2000395889A patent/JP2001237181A/ja not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
EP1120690A2 (de) | 2001-08-01 |
EP1120690A3 (de) | 2004-12-15 |
KR20010067473A (ko) | 2001-07-12 |
EP1120690B1 (de) | 2008-08-13 |
US6445439B1 (en) | 2002-09-03 |
JP2001237181A (ja) | 2001-08-31 |
CA2328017A1 (en) | 2001-06-27 |
KR100627251B1 (ko) | 2006-09-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |