DE60038970D1 - Akustische oberflächenwellenanordnung - Google Patents

Akustische oberflächenwellenanordnung

Info

Publication number
DE60038970D1
DE60038970D1 DE60038970T DE60038970T DE60038970D1 DE 60038970 D1 DE60038970 D1 DE 60038970D1 DE 60038970 T DE60038970 T DE 60038970T DE 60038970 T DE60038970 T DE 60038970T DE 60038970 D1 DE60038970 D1 DE 60038970D1
Authority
DE
Germany
Prior art keywords
surface wave
acoustic surface
wave assembly
assembly
acoustic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60038970T
Other languages
English (en)
Inventor
Akihiro Hachigo
Katsuhiro Itakura
Satoshi Fujii
Hideaki Nakahata
Shinichi Shikata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of DE60038970D1 publication Critical patent/DE60038970D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02582—Characteristics of substrate, e.g. cutting angles of diamond substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE60038970T 1999-10-15 2000-10-04 Akustische oberflächenwellenanordnung Expired - Lifetime DE60038970D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29363199 1999-10-15
PCT/JP2000/006944 WO2001028089A1 (fr) 1999-10-15 2000-10-04 Dispositif saw

Publications (1)

Publication Number Publication Date
DE60038970D1 true DE60038970D1 (de) 2008-07-03

Family

ID=17797219

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60038970T Expired - Lifetime DE60038970D1 (de) 1999-10-15 2000-10-04 Akustische oberflächenwellenanordnung

Country Status (4)

Country Link
US (1) US6984918B1 (de)
EP (1) EP1225693B1 (de)
DE (1) DE60038970D1 (de)
WO (1) WO2001028089A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602004023868D1 (de) * 2003-05-15 2009-12-10 Nat Inst Of Advanced Ind Scien Laminat mit wurtzritkristallschicht und herstellungsverfahren dafür
US8035277B2 (en) * 2007-08-14 2011-10-11 Avago Technologies Wireless Ip (Singapore) Pte.Ltd. Method for forming a multi-layer electrode underlying a piezoelectric layer and related structure
US9608589B2 (en) 2010-10-26 2017-03-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Method of forming acoustic resonator using intervening seed layer
US10658564B2 (en) 2016-11-24 2020-05-19 Huawei Technologies Co., Ltd. Surface acoustic wave device
CN113114158A (zh) * 2021-05-11 2021-07-13 中国科学院上海微系统与信息技术研究所 一种兰姆波谐振器及弹性波装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6462911A (en) 1987-09-03 1989-03-09 Sumitomo Electric Industries Surface acoustic wave element
JP2885349B2 (ja) * 1989-12-26 1999-04-19 住友電気工業株式会社 表面弾性波素子
JP3132078B2 (ja) 1991-09-19 2001-02-05 住友電気工業株式会社 弾性表面波素子及びその製造方法
JP3205976B2 (ja) * 1992-09-14 2001-09-04 住友電気工業株式会社 表面弾性波素子
EP0635938B1 (de) * 1993-07-20 1998-04-15 AVL List GmbH Piezoelektrisches Kristallelement
EP0648015B1 (de) * 1993-10-08 2000-05-31 Matsushita Electric Industrial Co., Ltd. Akustisches Oberflächenwellenfilter
JP3204290B2 (ja) * 1995-02-09 2001-09-04 住友電気工業株式会社 表面弾性波素子
JP3205978B2 (ja) 1995-08-08 2001-09-04 住友電気工業株式会社 表面弾性波素子
US6072263A (en) * 1996-08-09 2000-06-06 Toda; Kohji Surface acoustic wave transducing device
JP3233413B2 (ja) * 1996-10-18 2001-11-26 ティーディーケイ株式会社 弾性表面波装置
JP3275297B2 (ja) 1996-11-07 2002-04-15 住友電気工業株式会社 表面弾性波素子及び製造方法

Also Published As

Publication number Publication date
EP1225693A1 (de) 2002-07-24
US6984918B1 (en) 2006-01-10
WO2001028089A1 (fr) 2001-04-19
EP1225693A4 (de) 2005-08-17
EP1225693B1 (de) 2008-05-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition