DE60036407D1 - Hohlspindel und schleuder-, spül- und trockenvorrichtung mit einer derartigen spindel - Google Patents

Hohlspindel und schleuder-, spül- und trockenvorrichtung mit einer derartigen spindel

Info

Publication number
DE60036407D1
DE60036407D1 DE60036407T DE60036407T DE60036407D1 DE 60036407 D1 DE60036407 D1 DE 60036407D1 DE 60036407 T DE60036407 T DE 60036407T DE 60036407 T DE60036407 T DE 60036407T DE 60036407 D1 DE60036407 D1 DE 60036407D1
Authority
DE
Germany
Prior art keywords
spindle
rinsing
spinning
drying device
hollow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60036407T
Other languages
English (en)
Other versions
DE60036407T2 (de
Inventor
Roy Winston Pascal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE60036407D1 publication Critical patent/DE60036407D1/de
Application granted granted Critical
Publication of DE60036407T2 publication Critical patent/DE60036407T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE60036407T 1999-12-23 2000-12-19 Hohlspindel und schleuder-, spül- und trockenvorrichtung mit einer derartigen spindel Expired - Lifetime DE60036407T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/470,690 US6497241B1 (en) 1999-12-23 1999-12-23 Hollow core spindle and spin, rinse, and dry module including the same
US470690 1999-12-23
PCT/US2000/034753 WO2001046997A1 (en) 1999-12-23 2000-12-19 Hollow core spindle and spin, rinse, and dry module including the same

Publications (2)

Publication Number Publication Date
DE60036407D1 true DE60036407D1 (de) 2007-10-25
DE60036407T2 DE60036407T2 (de) 2008-06-12

Family

ID=23868624

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60036407T Expired - Lifetime DE60036407T2 (de) 1999-12-23 2000-12-19 Hohlspindel und schleuder-, spül- und trockenvorrichtung mit einer derartigen spindel

Country Status (8)

Country Link
US (1) US6497241B1 (de)
EP (1) EP1240661B1 (de)
JP (1) JP4712268B2 (de)
KR (1) KR100740471B1 (de)
AU (1) AU2445701A (de)
DE (1) DE60036407T2 (de)
TW (1) TW533453B (de)
WO (1) WO2001046997A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6827092B1 (en) * 2000-12-22 2004-12-07 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
US7171973B2 (en) * 2001-07-16 2007-02-06 Tokyo Electron Limited Substrate processing apparatus
JP6143572B2 (ja) * 2013-06-18 2017-06-07 株式会社Ｓｃｒｅｅｎホールディングス 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法
KR20210024794A (ko) 2019-08-26 2021-03-08 주식회사 에이케이테크 기판 세정장치
GB202018030D0 (en) 2020-11-17 2020-12-30 Spts Technologies Ltd Spin rinse dryer with improved drying characteristics

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US4021278A (en) * 1975-12-12 1977-05-03 International Business Machines Corporation Reduced meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US4339297A (en) * 1981-04-14 1982-07-13 Seiichiro Aigo Apparatus for etching of oxide film on semiconductor wafer
US4544446A (en) * 1984-07-24 1985-10-01 J. T. Baker Chemical Co. VLSI chemical reactor
JPH0828342B2 (ja) * 1986-04-18 1996-03-21 富士通株式会社 洗浄方法
JPS63153839A (ja) * 1986-08-13 1988-06-27 Dainippon Screen Mfg Co Ltd 基板の回転保持装置
JPS6425539A (en) * 1987-07-22 1989-01-27 Hitachi Ltd Wet treating apparatus
AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
JPH02130922A (ja) * 1988-11-11 1990-05-18 Toshiba Corp 半導体基板エッチング装置
US4969676A (en) * 1989-06-23 1990-11-13 At&T Bell Laboratories Air pressure pick-up tool
DE59407361D1 (de) 1993-02-08 1999-01-14 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige Gegenstände
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
JP2862754B2 (ja) 1993-04-19 1999-03-03 東京エレクトロン株式会社 処理装置及び回転部材
US5518542A (en) 1993-11-05 1996-05-21 Tokyo Electron Limited Double-sided substrate cleaning apparatus
JP3388628B2 (ja) * 1994-03-24 2003-03-24 東京応化工業株式会社 回転式薬液処理装置
US5718763A (en) * 1994-04-04 1998-02-17 Tokyo Electron Limited Resist processing apparatus for a rectangular substrate
JP3099054B2 (ja) * 1994-09-09 2000-10-16 東京エレクトロン株式会社 塗布装置及びその方法
TW494714B (en) * 1995-04-19 2002-07-11 Tokyo Electron Ltd Method of processing substrate and apparatus for processing substrate
JPH08316190A (ja) 1995-05-18 1996-11-29 Dainippon Screen Mfg Co Ltd 基板処理装置
DE19536848A1 (de) * 1995-10-02 1997-04-03 Bosch Gmbh Robert Baugruppenträger für ein elektronisches Steuergerät mit signalverarbeitenden Bauelementen und schnell arbeitenden digitalen Bauelementen
JP3380126B2 (ja) * 1996-10-31 2003-02-24 大日本スクリーン製造株式会社 基板処理装置
JPH10189530A (ja) * 1996-12-20 1998-07-21 Dainippon Screen Mfg Co Ltd 回転式基板乾燥装置
JPH10209102A (ja) * 1997-01-17 1998-08-07 Dainippon Screen Mfg Co Ltd 基板処理装置
AT407586B (de) * 1997-05-23 2001-04-25 Sez Semiconduct Equip Zubehoer Anordnung zum behandeln scheibenförmiger gegenstände, insbesondere von siliziumwafern
EP0898301B1 (de) * 1997-08-18 2006-09-27 Tokyo Electron Limited Doppelseitenreinigungsmaschine für ein Substrat
JPH11102883A (ja) * 1997-09-29 1999-04-13 Shibaura Mechatronics Corp スピン処理装置

Also Published As

Publication number Publication date
TW533453B (en) 2003-05-21
AU2445701A (en) 2001-07-03
US6497241B1 (en) 2002-12-24
EP1240661A1 (de) 2002-09-18
WO2001046997A1 (en) 2001-06-28
KR20020077670A (ko) 2002-10-12
EP1240661B1 (de) 2007-09-12
DE60036407T2 (de) 2008-06-12
JP2003518334A (ja) 2003-06-03
JP4712268B2 (ja) 2011-06-29
KR100740471B1 (ko) 2007-07-19

Similar Documents

Publication Publication Date Title
DE50204234D1 (de) Anspinnvorrichtung in einer Offenend-Rotorspinnmaschine
DE60037356D1 (de) Mantellose Hohlfasermembranvorrichtung
DE60120082D1 (de) Spinnvorrichtung
DE60009402D1 (de) Spinnvorrichtung und Spinnverfahren
DE60135122D1 (de) Spinnvorrichtung enthaltend Spinndüse mit Dampfverteilungsring
DE69917517D1 (de) Textilmaschine mit Einzelspindelantrieb
DE60126241D1 (de) Pulsatorwaschmaschine mit Trocknungsvorrichtung
DE60036407D1 (de) Hohlspindel und schleuder-, spül- und trockenvorrichtung mit einer derartigen spindel
DE59905725D1 (de) Spinnvorrichtung
DE59904597D1 (de) Offenend-Spinnvorrichtung
DE59700010D1 (de) Offenend-Spinnvorrichtung
DE69914283D1 (de) Ringspinnmaschine mit Individuellen Spindelantrieben
ID30113A (id) Pemintalan leleh serat dengan kecepatan tinggi
DE59903702D1 (de) Offenend-Rotorspinnvorrichtung
DE59702591D1 (de) Offenend-Spinnvorrichtung
DE50000578D1 (de) Lagerung eines Spinnrotors einer Offenend-Spinnvorrichtung
DE69713455D1 (de) Waschmaschine mit einer sofortwirkenden Türverriegelungsvorrichtung
DE59701205D1 (de) Offenend-Spinnvorrichtung
DE59909216D1 (de) Offenend-Spinnvorrichtung
DE50101113D1 (de) Fadenbremse und mit einer solchen Fadenbremse ausgerüstete Spindeln, Doppeldraht-Zwirnspindeln und Doppeldraht-Zwirnmaschinen
DE60102412D1 (de) Garndrallauffangelement in einer Offenend-Spinnmaschine
DE69901077D1 (de) Traversiervorrichtung mit rotierenden Flügeln
DE60012943D1 (de) Wascheinrichtung
ITMI20000420A0 (it) Filatoio con dispositivo condensatore
DE59503480D1 (de) Offenend-Spinnvorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition