DE60034498D1 - Verfahren zur automatisierten Inspektion von Fotomasken - Google Patents

Verfahren zur automatisierten Inspektion von Fotomasken

Info

Publication number
DE60034498D1
DE60034498D1 DE60034498T DE60034498T DE60034498D1 DE 60034498 D1 DE60034498 D1 DE 60034498D1 DE 60034498 T DE60034498 T DE 60034498T DE 60034498 T DE60034498 T DE 60034498T DE 60034498 D1 DE60034498 D1 DE 60034498D1
Authority
DE
Germany
Prior art keywords
photomasks
automated inspection
automated
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60034498T
Other languages
English (en)
Other versions
DE60034498T2 (de
Inventor
Steffen Schulze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qimonda AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of DE60034498D1 publication Critical patent/DE60034498D1/de
Application granted granted Critical
Publication of DE60034498T2 publication Critical patent/DE60034498T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
DE60034498T 1999-02-24 2000-02-07 Verfahren zur automatisierten Inspektion von Fotomasken Expired - Lifetime DE60034498T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US256930 1999-02-24
US09/256,930 US6363296B1 (en) 1999-02-24 1999-02-24 System and method for automated defect inspection of photomasks

Publications (2)

Publication Number Publication Date
DE60034498D1 true DE60034498D1 (de) 2007-06-06
DE60034498T2 DE60034498T2 (de) 2008-01-17

Family

ID=22974183

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60034498T Expired - Lifetime DE60034498T2 (de) 1999-02-24 2000-02-07 Verfahren zur automatisierten Inspektion von Fotomasken

Country Status (7)

Country Link
US (1) US6363296B1 (de)
EP (1) EP1031876B1 (de)
JP (1) JP2000250198A (de)
KR (1) KR20000058182A (de)
CN (1) CN1214456C (de)
DE (1) DE60034498T2 (de)
TW (1) TW461000B (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002122978A (ja) * 2000-10-18 2002-04-26 Sony Corp マスクデータの検証方法および検証プログラムを記録したコンピュータ読み取り可能な記録媒体
CN100447774C (zh) * 2001-11-08 2008-12-31 联华电子股份有限公司 多重供应链的网络光掩膜制作出单系统及其方法
US7050878B2 (en) * 2001-11-22 2006-05-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductror fabricating apparatus
KR100967824B1 (ko) * 2001-11-30 2010-07-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치의 제작방법
US7133737B2 (en) * 2001-11-30 2006-11-07 Semiconductor Energy Laboratory Co., Ltd. Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer
US7214573B2 (en) * 2001-12-11 2007-05-08 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device that includes patterning sub-islands
US7249342B2 (en) 2002-07-12 2007-07-24 Cadence Design Systems, Inc. Method and system for context-specific mask writing
WO2004008245A2 (en) 2002-07-12 2004-01-22 Cadence Design Systems, Inc. Method and system for context-specific mask inspection
US7302672B2 (en) 2002-07-12 2007-11-27 Cadence Design Systems, Inc. Method and system for context-specific mask writing
US6746879B1 (en) * 2002-10-02 2004-06-08 Taiwan Semiconductor Manufacturing Company Guard filter methodology and automation system to avoid scrap due to reticle errors
US7221788B2 (en) * 2003-07-01 2007-05-22 Infineon Technologies Ag Method of inspecting a mask or reticle for detecting a defect, and mask or reticle inspection system
US7450748B2 (en) * 2003-12-02 2008-11-11 International Business Machines Corporation Mask inspection process accounting for mask writer proximity correction
US8818072B2 (en) * 2010-08-25 2014-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Rendered database image-to-inspection image optimization for inspection
WO2012148854A1 (en) * 2011-04-26 2012-11-01 Kla-Tencor Corporation Database-driven cell-to-cell reticle inspection
CN102519968A (zh) * 2011-11-28 2012-06-27 上海华力微电子有限公司 掩膜板缺陷检测装置
EP2828646B1 (de) 2012-03-20 2022-05-04 KLA-Tencor Corporation Verwendung von reflexions- und übertragungskarten zur detektion von retikelabbau
CN104332422A (zh) * 2014-09-01 2015-02-04 上海华力微电子有限公司 一种不同方向集成电路版图的缺陷检测方法
US11209728B2 (en) * 2018-06-27 2021-12-28 Taiwan Semiconductor Manufacturing Company Ltd. Mask and method for fabricating the same
CN112946997A (zh) * 2019-11-26 2021-06-11 长鑫存储技术有限公司 一种光罩修正方法及系统
CN114280067B (zh) * 2021-12-28 2024-05-28 信利(仁寿)高端显示科技有限公司 一种识别mask破片及裂纹的检测装置及检测方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4247203A (en) * 1978-04-03 1981-01-27 Kla Instrument Corporation Automatic photomask inspection system and apparatus
JPS55110904A (en) * 1979-02-20 1980-08-27 Hajime Sangyo Kk Defect detecting device
US4926489A (en) * 1983-03-11 1990-05-15 Kla Instruments Corporation Reticle inspection system
US4659220A (en) * 1984-10-22 1987-04-21 International Business Machines Corporation Optical inspection system for semiconductor wafers
US5298365A (en) * 1990-03-20 1994-03-29 Hitachi, Ltd. Process for fabricating semiconductor integrated circuit device, and exposing system and mask inspecting method to be used in the process
JP3187859B2 (ja) * 1991-05-22 2001-07-16 株式会社日立製作所 マスクのパターンデータ作成方法および製造方法
JPH08234413A (ja) * 1995-02-24 1996-09-13 Mitsubishi Electric Corp フォトマスクパターン欠陥検査装置及びフォトマスクパターン欠陥検査方法
US6048649A (en) * 1998-04-30 2000-04-11 International Business Machines Corporation Programmed defect mask with defects smaller than 0.1 μm

Also Published As

Publication number Publication date
US6363296B1 (en) 2002-03-26
TW461000B (en) 2001-10-21
EP1031876B1 (de) 2007-04-25
KR20000058182A (ko) 2000-09-25
JP2000250198A (ja) 2000-09-14
EP1031876A2 (de) 2000-08-30
DE60034498T2 (de) 2008-01-17
CN1214456C (zh) 2005-08-10
CN1266281A (zh) 2000-09-13
EP1031876A3 (de) 2004-06-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: QIMONDA AG, 81739 MUENCHEN, DE