DE60033353T2 - ELECTRONIC DEVICE AND MANUFACTURE - Google Patents

Description

TECHNICAL TERRITORY

The The present invention relates to a process for producing a electronic device.

STATE OF TECHNOLOGY

The Demand to speed up information processing is always more intensified, with a growing number of semiconductor chips with high frequency year for Year was developed. To speed up the operation of semiconductors, is not only achieving high density and high performance from integrated chips, but also improve the properties necessary from peripheral circuits. In particular, the warranty stability a transmission line and a power line one of the requirements for a stable high-speed operation. So you do not go too far, when one says that the main body of a Semiconductor chips strongly depends on the peripheral devices.

One Capacitor is one of the important devices that improve the stability of the transmission line and the power supply line guaranteed. To realize the high-speed operation, the capacitor should not only have a high-frequency power, but those there premier Wiring should be as well have a low impedance.

Around operate the semiconductor chip with high frequency, it is necessary the capacitor in the vicinity to arrange the semiconductor chip so as to reduce line losses. conventional Methods are those for forming a minute capacitor limited within the semiconductor, this being for another stable high-frequency operation becomes insufficient. additionally causes the arrangement of the capacitor in the vicinity of a semiconductor chip a problem in that a mounting plate becomes large.

US-A-5 538 433 discloses a. electrical connector with a laminated Base plate made by alternately laminating from first to fourth conductive layers and dielectric layers and a plurality of interconnecting Contact pins (signal pin and power source pin) is formed, which penetrate the laminated base plate. The power source contact pin is electrically connected to the first conductive layer, wherein the signal pin is isolated from the conductive layers. Furthermore, there are a plurality of connection openings between these connection pins formed in the base plate, wherein fifth conductive layers in these connection openings electrically connected to the first to fourth conductive layers are.

EPIPHANY THE INVENTION

It is an object of the present invention noted above to solve problems and to provide a method of manufacturing an electronic device, in which suppressing the Increase in the size of the mounting surface and arranging a capacitor in the vicinity of a semiconductor chip for same time can be realized.

Around the above mentioned To fulfill the task is a method of manufacturing the electronic device according to the present invention Invention defined in claim 1. With this configuration can a simple procedure desired thin metal foils with each other under the metal foils, which in the electronic device in layers are arranged. Therefore, discharge electrodes are on the thin metal foils formed in this way, allowing them to that several thin ones Metal foils which are connected as electrode layers with the same electric potential act.

at the method described above for the production of the electronic equipment In the present invention, the openings can be obtained by the dielectric thin Foil is applied, in which case a laser beam a predetermined Area irradiated to a portion of the dielectric thin film to remove. Thus, the dielectric thin film with the openings simple and effective at a desired Be formed in a precise way.

It It is preferable that the laser beam is a carbon dioxide gas laser is. Thus, only the dielectric thin film can be efficiently removed without causing deterioration of the thin metal foil.

alternative can be in the above-described method for producing the electronic device the present invention, the openings through an oil stencil receive. Thus, the dielectric thin film with the openings be formed easily and effectively at low cost.

It is preferable that an oil used for the oil stencil is a hydrocarbon-based oil, a mineral oil or a fluorohydrocarbon oil. Since these oils have excellent wetting ability for the thin metal foil and reliably prevent thin resin sheet material from adhering, the opening having a clear border can be reliably formed the.

Besides that is in the method of manufacturing the electronic device described above in accordance with the present invention, after the steps for Apply repeatedly were, part of the thin Me tallfolie to a surface of the layered product is exposed in the coating direction has received. With this configuration can be the exposed part of the thin Metal foil are processed in a discharge electrode.

It It is preferable that a conductive substance is applied to a surface of the exposed part of the thin Metal foil is applied. In other words, it is preferable that the conductive substance on the exposed part of the thin metal foil adheres so that they are easy to lead out of the electrode and the Connection with the wiring board and the other electronic devices is on the same level or projecting from the outer surface of the electronic device.

The Method for producing the electronic device with a plurality of dielectric thin films shows the application of a dielectric thin film with an opening in a predetermined part several times, so that one layered arranged Product receives, that the dielectric thin Includes film having a penetration hole in a coating direction penetrates through. With this configuration can be a simple procedure the penetration hole for forming the penetrating electrode that the electronic device in the coating direction penetrates.

In addition, will in the above-described method for producing the electronic equipment of the present invention after the dielectric thin films were applied several times, a conductive substance in the penetration hole filled the layered product that has been obtained. Thus, one can use a penetrating electrode, which is the electronic device in the Coating direction penetrates, obtained.

The A method of manufacturing the electronic device according to the present invention comprises forming a thin one Metal foil, which is structured in a stripe shape, forming a dielectric thin Foil with an opening in an area where the thin one Metal foil is not formed, forming a thin metal foil, the is structured in a strip shape, in an area without the opening on the dielectric thin film, and the filling a conductive substance in the opening on. With this configuration, a simple process can be a Penetration electrode forming the electronic device in the Coating direction penetrates and not with the thin metal foil in the electrical device connected is. additionally can be a desired Circuit configuration derived from such a penetrating electrode independently is for the same electronic device to be provided. Thus it is possible, for example, that electronic device, obtained by the process of the present invention has to mount on one wiring board and another electronic device (For example, a semiconductor chip) to arrange this electronic device with the wiring board over to connect the penetrating electrode. Because the electronic device that one obtained by the process of the present invention, the thin Metal foils and the dielectric thin film has, between the thin one Metal foils is arranged, it is also possible, for example, a Condenser to form in the electronic device. While the Increase the size of one mounting surface repressed As a result, the capacitor can be near the semiconductor chip be arranged, thereby a high-frequency drive of the semiconductor chip and a suppression To increase the size of the mounting surface to same time be realized.

at the method described above for the production of the electronic equipment According to the present invention, it is preferable that the conductive Substance of the thin ones Metal foils is electrically insulated. With this configuration will be for example, a printed circuit board and the other electronic device electrically over each other the penetrating electrode connected as if it were the electronic Device in between would not exist.

Besides, they are in the above-described method for producing the electronic equipment the present invention, the thin Metal foils formed so that they are substantially strip-shaped. With this configuration, the electronic device with the above configuration can be produced efficiently.

The essentially strip-shaped thin metal foil is designed so that one direction of the strip is underneath trained crosses (so that stripe directions of a thin metal foil and her neighbors thin Metal foil like weird Lines are formed). Because the thin metal foils over and under the dielectric thin Slide a predetermined overlapped Part in the coating direction can thus in this part a capacity forming area. The directions of the stripes of the thin Metal foil need do not cross at right angles and can cross at oblique angles.

Besides that is in the method of manufacturing the electronic device described above present invention that both thin metal foils, which are formed on both sides of the dielectric thin film, with a given size in one Overlap coating direction. Thus, optionally, a structural form of the thin metal foil may be provided be designed, at the same time forming the capacity Area can be formed.

Besides that is in the method of manufacturing the electronic device described above vorzuziehen that an electrode that with at least part of the thin one Metal foil is electrically connected, on a surface substantially perpendicular to a surface is formed on which the thin Metal foil is formed. With this configuration you can do that electronic device obtained with an external electrode on a surface other than the surface differs on which the penetrating electrode is formed (the outer surface of the electronic device, to which the penetrating electrode is exposed).

It It is preferable that a plurality of electrodes are formed, wherein a part or all electrodes are electrically isolated from each other. Thus, you can several independent Capacitors are formed in the electronic device. In addition, can the change the size and number the thin one Metal foils connected to an electrode, the capacity of each Change capacitor.

at the method described above for the production of the electronic equipment According to the present invention, it is preferable that the dielectric thin foil a second opening in a region where the thin metal foils are formed, and over the second opening both thin Metal foils electrically connecting, on both sides of the dielectric thin Foil are formed. With this configuration can be a simple Method desired thin metal foils under thin Metal foils interconnect, which in the electronic device in layers are arranged. Therefore, discharge electrodes are formed on the thin metal foils, which are connected in this way, which makes it several thin metal foils, which are connected, allow as electrode layers with the same electrical potential to act.

at the method described above for the production of the electronic equipment The present invention may provide the structured thin metal foil be formed by the thin Metal foil after applying a solid stencil or a Evaporation stencil is formed or by the thin metal foil followed by a laser etching is formed. With this configuration you can use the thin metal foil with a desired Keep shape light and efficient.

The openings need in the dielectric thin Foil are not formed while the layered arranged Product is produced, wherein holes can be formed after one has received the layered product, thereby the device for producing the layered product is simplified.

at the method described above for the production of the electronic equipment In the present invention, the hole may be a penetration hole that is designed so that it is not the thin metal foils penetrates. Thus, the penetrating electrode can be easily formed become.

In addition, will several layers of thin ones Formed metal foil, wherein the hole is formed so that a Part of the thin one Metal foil is exposed to an inner wall of the hole. Then can the filling the conductive substance, leaving it with the exposed thin metal foil is connected, easily form a discharge electrode. It is for the hole possible here, the electronic device to penetrate or not to penetrate.

at the method described above for the production of the electronic equipment According to the present invention, it is preferable that the hole through Injection of a laser beam is formed. With this configuration the hole can be formed efficiently. The laser beam source used here is preferably under consideration selected, whether they are the layers of the thin ones Penetrates metal foil at the same time or not.

An electronic device that can be manufactured by the method of claim 1 according to the present invention comprises electrode layers disposed opposite to each other, a dielectric disposed between the electrode layers, a connection electrode connected to at least one of the electrode layers, and penetrating electrodes that penetrate the electronic device without being connected to the electrode layers. For example, since the electronic device has the penetrating electrodes, it is possible to mount the electronic device on a wiring board and to arrange another electronic device (for example, a semiconductor chip) thereon to connect this electronic device to the wiring board via the penetrating electrode. In addition, since the electronic device has the electrode layers and the dielectric disposed between the electrode layers For example, it is possible to form a capacitor in the electronic device. As a result, while the increase in the size of a mounting surface is suppressed, the capacitor can be disposed in the vicinity of the semiconductor chip, thereby realizing high-frequency driving of the semiconductor chip and suppressing the increase in the size of the mounting surface at the same time.

It It is preferable that the above-mentioned penetrating electrodes the electronic device in penetrate a direction substantially parallel to the arrangement direction the electrode layer and the dielectric extends. The electronic device with a such configuration is easy to manufacture.

at The above-described electronic device is the penetrating electrodes arranged as grid points, wherein the electrode layers a have first electrode layer and a second electrode layer, which are arranged between the penetrating electrodes, and the first electrode layer and the second electrode layer so arranged are that they from a penetration direction of the penetration electrodes seen from how a grid are crossed with each other and so that the dielectric is interposed therebetween. Alternatively, the Electrode layers, a first electrode layer and a second Electrode layer, which are arranged so that they have a facing portion of a given size and so that the dielectric is arranged in between. With this configuration can be a capacitor with a desired capacity in the electronic device be easily formed.

at the electronic device For example, the connection electrode may be a deflection electrode which is in the same level as the penetrating electrode is formed. In other words, the discharge electrode and the penetrating electrode can be formed so that they are at the same surface of the electronic device exposed. With this configuration, the starting from Ableitelektrode with the wiring board that is used around the electrode layers in the electronic device to supply voltage on the same level as the penetrating electrode (for example, the lower surface or the upper surface of the electronic device) in a similar Be connected. As a result, the mounting surface can continue be reduced.

In addition, can another electronic device, that on the electronic device is arranged to be easily connected to the Ableitelektrode.

In addition, can in the electronic device the Connecting electrode be an external electrode, in another Level is formed as the penetrating electrode. For example For example, the penetrating electrode may be formed to be too the upper and the lower outer surface of the electronic device exposed, wherein the connection electrode (the external electrode) on the edge surface of the electronic device is trained. If with this configuration the electronic device on the Wiring plate is mounted, the external electrode can be easily soldered to the wiring board become.

at the electronic device It is preferable that multiple capacity forming areas between the first electrode layer and the second electrode layer is formed become. Thus, a capacitor within the electronic equipment be formed.

It It is preferable that the connecting electrodes are connected to the first Electrode layer and the second electrode layer are connected, the capacity form forming areas, are isolated from each other. With this Configuration can be several independent Capacitors are formed within the electronic device.

If furthermore the capacity forming areas with different capacities can be several Capacitors with different capacitance formed within the electronic device become.

BRIEF DESCRIPTION OF THE DRAWINGS

It demonstrate:

1 a schematic plan view showing an example of an electronic device according to the first embodiment of the present invention;

2 a perspective view showing an internal structure of a part of the electronic device of 1 shows;

3 a schematic perspective view showing an apparatus for producing the electronic device of 1 shows;

4 a schematic view showing an example, the electronic device of 1 used;

5 a schematic plan view showing an example of an electronic device according to the second embodiment of the present invention;

6 a perspective view showing an internal structure of a part of the electronic device of 5 shows;

7 a schematic cross-sectional view showing an apparatus for producing the electronic device of 5 shows;

8th a schematic view showing an example, the electronic device of 5 used;

9 a schematic plan view showing an example of an electronic device according to the third embodiment of the present invention;

10 a perspective view showing an internal structure of a part of the electronic device of 9 shows;

11 a schematic view showing an example, the electronic device of 9 used.

BEST VERSION THE INVENTION

The The following is a description of the embodiments of the present invention Invention as well as examples of electronic devices and methods for their production, useful are to understand the invention, with reference to the accompanying Drawings.

First Embodiment

1 is a schematic plan view showing an example of an electronic device 10 shows. 2 is a perspective view showing an internal structure of a part of the electronic device of 1 shows.

Several first electrode layers 1 are formed so that they are strip-shaped (band-shaped) on substantially the same plane, wherein a plurality of second electrode layers 2 are formed so that they are strip-shaped (band-shaped) on substantially the same plane. They are arranged in layers such that a dielectric layer 3 between the first electrode layers 1 and the second electrode layers 2 is arranged. By crossing the directions of the strips of the first electrode layers 1 and the second electrode layers 2 become capacity forming areas 9 formed at the intersections and act as capacitors.

A first discharge electrode 4 is with the first electrode layer 1 connected, wherein a second Ableitelektrode 5 with the second electrode layer 2 connected is. They can be used as connection terminals when the capacity-forming area 9 acts as a capacitor as mentioned above. The discharge electrodes 4 and 5 can be designed to be the electronic device 10 in the coating direction according to 1 and 2 penetrate, or so that they only appear on a surface of the electronic device. It is possible that one of the Ableitelekt roden 4 and 5 is designed so that it penetrates the electronic device, the other appears only on a surface thereof.

In addition to the discharge electrodes 4 and 5 are penetrating electrodes 6 in the electronic device 10 educated. These penetrating electrodes 6 The other electronic devices connect electrically above and below the electronic device 10 are arranged as if the electronic device would not exist between them.

A material for forming the electrode layers 1 and 2 may be a metal such as aluminum, copper or gold or a metal compound. A material for forming the dielectric layer 3 may be a resin material such as acrylic resin, epoxy resin or vinyl resin, a ceramic material such as a barium titanium oxide based ceramic material or a strontium titanium oxide based ceramic material, a metal oxide such as titanium oxide or aluminum oxide or a semi-metal oxide such as silicon oxide. In addition, a material for forming the drain electrodes 4 and 5 and the penetrating electrodes 6 a conductive paste or a conductive polymer in addition to a metal such as gold, silver, aluminum, copper or a solder material.

The electrode layers 1 and 2 may be formed by vacuum evaporation, sputtering or electroplating or the like. In addition, the electrode layers 1 and 2 be designed such that they are strip-shaped by using a solid template with a structuring, by using an evaporation template made of oil or the like or by appropriate laser etching. The material for the oil stencil may consist of various types of oil such as hydrocarbon based oil, mineral oil or fluorocarbon oil.

The dielectric layer 3 can be formed by the following methods. When a resin-based material is used, it is evaporated by heating, or atomized by ultrasonic wave or spraying, and then applied. When the ceramic material or the metal-based material is used, sputtering, evaporation or the like can be selected.

To the discharge electrodes 4 and 5 and the penetrating electrodes 6 form openings in the dielectric layer 3 formed by the following methods. After forming the dielectric layer, the dielectric is removed in a predetermined part by laser etching. Alternatively, the dielectric layer is formed after application of the evaporation stencil, such as oil. A dotted evaporation template can be effectively applied by an ink jet system in which microdrops are ejected from a template material of micropores.

If the oil stencil The oil can be applied such as hydrocarbon based oil, mineral oil or hydrofluorocarbon oil become.

If If the evaporation template is used, excess stencil material, the remaining after forming each layer, if necessary through an infrared dark jet heater or far infrared heater, an electron beam, an irradiation with an ultraviolet lamp or a plasma irradiation be removed.

3 FIG. 13 is a schematic perspective view of an apparatus to form part of an example of steps for manufacturing the electronic devices of FIG 1 and 2 to describe.

A carrier is from a chamber 11 for bringing in the carrier brought in, which is arranged on the right side of the device, leads ge by predetermined steps and then by a gate 22 taken out for removing the carrier, which is arranged on the left side. Several chambers, divided by each step, are between the gate valves 12a and 12b arranged and formed in a vacuum container in which a predetermined degree of negative pressure is maintained. A transport system 21 , which is arranged substantially in the center of the device, moves the carrier from one chamber to the other, so that a predetermined processing is performed. A substrate having, for example, a sheet-form or plate-shaped resin, ceramic or metal may be used as the carrier, with dielectric thin films and thin metal foils being applied thereon.

The carrier is in the chamber 11 brought in bringing the carrier and is then on the open gate valve 12a brought into the vacuum tank. First, make a source 13 for forming a lower insulating film, a lower insulating film on the carrier surface. By using a patterning template or by irradiating a laser beam, openings (holes) can be formed in which the penetrating electrodes and the drain electrodes are formed. It then forms a combination of a source 14 for forming a thin metal foil and a patterning template, a first patterned thin metal foil (a first electrode layer). After that forms a source 15 for forming a dielectric thin film, a first dielectric thin film (a dielectric layer). After forming the first dielectric thin film, a laser beam apparatus removes 16 the dielectric thin film where the drain electrodes and the penetrating electrodes are formed. Next is a combination of a source le 17 for forming a thin metal foil and a patterning template, a second structured thin metal foil (a second electrode layer). Thereupon forms a source 18 for forming a dielectric thin film, a second dielectric thin film (a dielectric layer). Even after forming the second dielectric thin film, a laser beam apparatus is removed 19 the dielectric thin film where the drain electrodes and the penetrating electrodes are formed. Subsequently, the carrier becomes the source again 14 for forming a thin metal foil, to the source 15 for forming a dielectric thin film, the laser beam apparatus 16 , to the source 17 for forming a thin metal foil, to the source 18 for forming a dielectric thin film and the laser beam apparatus 19 in this order to be processed as above for a predetermined number of times. After the slides have been formed the given times, forming a source 20 for forming an upper insulating film, an upper insulating film. By using a patterning template or by irradiating a laser beam, openings (holes) can be formed in which the penetrating electrodes and the lead-out electrodes are formed. Then the gate valve opens 12b so that the carrier out of the gate 22 is taken out for removing the carrier.

The Penetration electrode is formed as follows. A conductive paste is painted so that it has a through hole that is formed is, fills and then hardens.

The Ableitelektrode can in a similar manner be formed. A conductive paste is painted over so that she an opening crowded, in the upper insulation film and / or the lower insulation film is designed to be so with the thin Metal foil to be connected, which is exposed to Publ opening. The end the Ableitelektrode can lie in the same plane as a layered arranged product or can easily protrude from the surface.

In a suitable subsequent step is the layered arranged Cut product into specified sizes, where it is necessary.

The electronic device formed according to the present invention 10 is used by, for example, between a carrier 28 on which a semiconductor chip 27 is mounted, and a wiring board 30 is arranged as in 4 is shown schematically. A signal connection 29a on the lower surface of the carrier 28 comes with a wiring structure 31 on the wiring board 30 is formed, via the penetrating electrode 6 of the electronic device 10 connected, if necessary. There will also be an energy connection 29b on the lower surface of the carrier 28 with the wiring board 30 via the penetrating electrode 6 and continue with the first lead-off electrode 4 connected. The other energy connection 29b on the lower surface of the carrier 28 is with the wiring board 30 via the penetrating electrode 6 and further with the second discharge electrode 5 connected. The penetrating electrode 6 and the discharge electrodes 4 and 5 can with the wiring structure 31 on the surface of the wiring board 30 according to 4 or with another device such as a connection inside the wiring board 30 get connected.

As the first electrode layer 1 connected to the first lead-off electrode 4 is connected, and the second electrode layer 2 connected to the second lead-off electrode 5 is isolated by the dielectric layer interposed therebetween, when a power terminal is connected to the first lead-out electrode 4 is a Vcc terminal and a power terminal connected to the second Ableitelektrode 5 is connected, for example, a ground terminal, which is between the first Ableitelektrode 4 and the second discharge electrode 5 formed capacitor does not substantially increase the mounting area and acts as a pass-through capacitor for the power supply in the vicinity of the semiconductor chip. This is preferable in high-frequency driving and in reducing the size of the mounting surface.

[Example 1]

Aluminum was used as a material for the thin metal foil, alumina was used as a dielectric material, and a silver-based paste was used as a conductive paste. As a method of forming holes for electrodes in the dielectric layer, an ink-jet system has been adopted. The ink-jet system involves placing an oil stencil material on a predetermined portion before the dielectric layer is formed. As the oil stencil material, fluorohydrocarbon oil was used. In an area of 17 square millimeters, 484 0.25 mm diameter penetrating electrodes were formed at grid points 0.8 mm apart, with 462 lead electrodes 4 the electrode layer 1 and 462 lead-off electrodes 5 the electrode layer 2 each with a diameter of 0.25 mm were formed at grid points with a distance of 0.8 mm between the penetrating electrodes. The electrode layers 1 and 2 were both 0.65 mm wide multiple strips. The application of the electrode layer having a thickness of 30 nm and the dielectric layer having a thickness of 0.5 μm was repeated to obtain 80 dielectric layers. Insulation layers having a thickness of 4 μm were respectively formed on the upper and lower sides of the layered product to increase its strength. The upper and lower insulating layers were made of the same material as the dielectric layer for the sake of simplicity. The lower insulating layer was processed to form holes for the penetrating electrodes and the drain electrodes by stencils. The upper insulating layer was also processed to form holes for the penetrating electrodes through templates. A conductive paste was brushed so that the concave part (opening) formed by machining the hole for the penetrating electrodes and the drain electrodes was filled and then cured.

One LCR meter confirmed the result that a capacitor with a total capacity of 1 uF and tan δ 1.2 within the layered product with a thickness of about 50 microns formed has been. The same result was achieved when using a fine line of soldering material achieved in place of the conductive paste.

Second Embodiment

5 is a schematic plan view showing another example of the electronic device 10 shows. 6 is a perspective view showing an internal structure of a part of the electronic device of 5 shows.

Several first electrode layers 1 are formed so as to be strip-shaped on the substantially same plane, wherein a plurality of second electrode layers 2 are formed so that they lie strip-shaped on the substantially same plane. They are arranged in layers such that a dielectric layer 3 between the first electrode layers 1 and the second electrode layers 2 is arranged. By crossing the directions of the strips of the first electrode layers 1 and the second electrode layers 2 become capacity forming areas 9 to the Intersections formed and act as capacitors.

At the edge surfaces of the electronic device 10 are external electrodes 7 and 8th educated. A first external electrode 7 is with the first electrode layer 1 connected, wherein a second external electrode 8th with the second electrode layer 2 each connected in an electrical manner. They can be used as connection terminals when the capacity-forming area 9 acts as a capacitor, as mentioned above. The external electrodes 7 and 8th can according to 5 on both sides of the electronic device, facing each other, or formed on only one side thereof. It is possible to use one of the external electrodes 7 and 8th on both sides and the other form only on one side of the electronic device. In addition, the external electrodes 7 and 8th be formed so that they both surfaces in the coating direction of the electronic device 10 according to 6 (upper and lower surface) or just to a surface thereof. It is possible that one of the external electrodes 7 and 8th on both surfaces and the other only on one surface of the electronic device. In addition, several strips of the electrode layers 1 (or 2 ) with an external electrode 7 (or 8th ). Accordingly, the capacity of a formed capacitor can be changed.

In addition to the external electrodes 7 and 8th are penetrating electrodes 6 in the electronic device 10 educated. These penetrating electrodes 6 The other electronic devices connect electrically above and below the electronic device 10 are arranged as if the electronic device would not exist between them.

A material for forming the electrode layers 1 and 2 may be a metal such as aluminum, copper or gold or a metal compound. A material for forming the dielectric layer 3 may be a resin material such as acrylic resin, epoxy resin or vinyl resin, a ceramic material such as a barium titanium oxide based ceramic material or a strontium titanium oxide based ceramic material, a metal oxide such as titanium oxide or aluminum oxide or a semi-metal oxide such as silicon oxide. In addition, a material for forming the external electrodes 7 and 8th and the penetrating electrodes 6 a conductive paste or a conductive polymer in addition to a metal such as gold, silver, aluminum, copper or a solder material.

The electrode layers 1 and 2 can be formed by vacuum evaporation, sputtering or electroplating or the like. In addition, the electrode layers 1 and 2 be formed so that they are formed by using a solid stencil with structuring, by using an evaporation stencil of oil or the like or by appropriate laser etching strip-shaped. The material for the oil stencil may consist of various types of oil such as hydrocarbon based oil, mineral oil or fluorocarbon oil.

The dielectric layer 3 can be formed by the following methods. When a resin-based material is used, it is evaporated by heating, or atomized by ultrasonic wave or spraying, and then applied. When the ceramic material or the metal-based material is used, sputtering, evaporation or the like can be selected.

The external electrodes 7 and 8th can be formed by thermal spraying, electroplating or applying a conductive paste or the like.

Around the the penetration electrodes 6 are formed in the dielectric layer 3 Openings formed by the following methods. After forming the dielectric layer, the dielectric is removed in a predetermined part by laser etching. Alternatively, the dielectric layer is formed after application of the evaporation stencil, such as oil. A dotted evaporation template can be effectively applied by an ink jet system in which microdrops are ejected from a template material of micropores.

If the oil stencil The oil can be applied such as hydrocarbon based oil, mineral oil or hydrofluorocarbon oil become.

If If the evaporation template is used, excess stencil material, the remaining after forming each layer, if necessary through an infrared dark jet heater or far infrared heater, an electron beam, an irradiation with an ultraviolet lamp or a plasma irradiation be removed.

7 FIG. 12 is a schematic cross-sectional view showing a part of an example of a device for manufacturing the electronic device of FIG 5 and 6 shows.

A vacuum tank 24 has several chambers divided by each step. With the chambers of the sources 14 and 17 for training thin metal foils are suction systems 25 connected to a vacuum pump. In each chamber of the vacuum tank, a predetermined degree of negative pressure is maintained. As a conveying system, a carrier that rotates in a direction of the arrow (a cylindrical can roller in FIG 7 ), essentially in the middle of the vacuum tank 24 arranged.

First, a source for forming an insulating film (a source 15 or 18 for forming a dielectric thin film in 7 ) a lower insulation film on the can roller 23 , After forming the lower insulating film, the film where the penetrating electrodes are formed may be removed to openings (holes) through a laser beam apparatus 16 or 19 to build. closures 26 the sources 14 and 17 to form thin metal foils are closed here. Turning the can roller 23 for a predetermined number of times forms the lower insulating film with a predetermined thickness. Subsequently, the closure 26 opened, in which case a combination of a source 14 for forming a thin metal foil and a patterning template, forms a first patterned thin metal foil (a first electrode layer). Thereupon forms a source 15 for forming a dielectric thin film, a first dielectric thin film (a dielectric layer). After forming the first dielectric thin film, a laser beam apparatus removes 16 the dielectric thin film where the penetrating electrodes are formed. Next is a combination of a source 17 for forming a thin metal foil and a patterning template, a second structured thin metal foil (a second electrode layer). After that forms a source 18 for forming a dielectric thin film, a second dielectric thin film (a dielectric layer). Even after forming the second dielectric thin film, a laser beam apparatus is removed 19 the dielectric thin film where the penetrating electrodes are formed. Subsequently, the carrier becomes the source again 14 for forming a thin metal foil, to the source 15 for forming a dielectric thin film, the laser beam apparatus 16 , to the source 17 for forming a thin metal foil, to the source 18 for forming a dielectric thin film and laser beam apparatus 19 in this order to be processed for a predetermined number of times as above. After forming the films for a predetermined number of times, the shutter becomes 26 closed, then the source for forming the insulating film (the source 15 or 18 for forming the dielectric thin film in 7 ) forms an upper insulating film. After forming the upper insulating film, the film may be formed by the laser beam apparatus where the penetrating electrodes are formed 16 or 19 be removed to form openings (holes). Turning the can roller 23 for a predetermined number of times forms the upper insulating film with a predetermined thickness.

The Penetration electrode is formed as follows. A conductive paste is painted so that it has a through hole that is formed is, fills and then hardens.

In a later one suitable step is the layered product if necessary in given Sizes cut.

The external electrodes are placed on the sides of the layers Product formed in the specified sizes by thermal spraying or applying a paste is cut.

The separately forming the external electrodes by using a Stencil or a top coat can be the number of strip-shaped electrodes regulate, which are connected to the individual external electrodes.

The formed electronic device 10 is used by, for example, between a carrier 28 on which a semiconductor chip 27 is mounted, and a wiring board 30 is arranged as schematically in 8th will be shown. A signal connection 29a on the lower surface of the carrier 28 comes with a wiring structure 31 on the wiring board 30 is formed, via the penetrating electrode 6 of the electronic device 10 connected, if necessary. There will also be an energy connection 29b on the lower surface of the carrier 28 with the wiring board 30 via the penetrating electrode 6 and continue with the first external electrode 7 connected. The other energy connection 29b on the lower surface of the carrier 28 is with the wiring board 30 via the penetrating electrode 6 and continue with the second external electrode 8th connected. The penetrating electrode 6 and the external electrodes 7 and 8th can with the wiring structure 31 on the surface of the wiring board 30 according to 8th or with another device such as a connection inside the wiring board 30 or the upper surface of the electronic device of the present invention. The external electrodes 7 and 8th and the wiring board 30 can with a solder joint 32 or by other means.

As the first electrode layer 1 connected to the first external electrode 7 is connected, and the second electrode layer 2 connected to the second external electrode 8th is connected, through the intervening arranged dielectric layer is, if, for example, a power terminal connected to the first external electrode 7 is a Vcc terminal and a power terminal connected to the second external electrode 8th is connected, a ground connection is that between the first external electrode 7 and the second external electrode 8th formed capacitor does not substantially increase the mounting area and acts as a pass-through capacitor for the power supply in the vicinity of the semiconductor chip. This is preferable in high-frequency driving and in reducing the size of the mounting surface.

[Example 2]

Aluminum was used as a material for the thin metal foil, acrylate was used as a dielectric material, and a silver-based paste was used as a conductive paste. To form the holes for the penetrating electrodes in the dielectric layer, the following procedure was adopted. The method comprises removing the dielectric in a predetermined part by laser etching after forming the dielectric layer. As the laser, a carbon dioxide gas laser with an output of 10 W was used. In an area of 17 square millimeters, 484 0.25 mm diameter penetrating electrodes were formed at grid points spaced 0.8 mm apart. The electrode layers 1 and 2 were both 0.8 mm wide multiple strips. The application of the electrode layer having a thickness of 30 nm and the dielectric layer having a thickness of 0.25 μm was repeated to obtain 140 dielectric layers. Insulation layers with a thickness of 5 μm were respectively formed on the upper and lower sides of the layered product to increase its strength. The upper and lower insulating layers were made of the same material as the dielectric layer for the sake of simplicity. The upper and lower insulating layers were laser-processed to form the penetrating electrodes. Subsequently, the layered product was cut to form a brass layer having a thickness of 20 μm on the cut surface by thermal spraying followed by forming a soldering plate layer having a thickness of 60 μm to prepare an external electrode. A conductive paste was brushed so that the concave part (opening) formed by machining the hole for the piercing electrodes was filled and then cured.

One LCR meter confirmed the result that a capacitor with a total capacity of 1 uF and tan δ 0.8% within the layered product with a thickness of about 50 microns formed has been.

Third Embodiment

9 is a schematic plan view showing an example of another electronic device 10 shows. 10 is a perspective view showing an internal structure of a part of the electronic device of 9 shows.

Several first electrode layers 1 are formed with a predetermined structure in substantially the same plane, wherein a plurality of second electrode layers 2 are formed with a predetermined structure in substantially the same plane. They are arranged in layers such that a dielectric layer 3 between the first electrode layers 1 and the second electrode layers 2 is arranged. By forming the first electrode layers 1 and the second electrode layers 2 such that at least a part of them overlap each other (facing each other) become capacity-forming areas 9 formed on the overlapping parts (facing parts) and act as capacitors. The capacity can be adjusted by adjusting the size of each overlapping part (the capacitance forming area 9 ).

A first discharge electrode 4 is with the first electrode layer 1 connected, wherein a second Ableitelektrode 5 with the second electrode layer 2 connected is. They can be used as connection terminals when the capacity-forming area 9 acts as a capacitor, as mentioned above. The discharge electrodes 4 and 5 can be designed to be the electronic device 10 in the loading direction according to 9 and 10 penetrate or only appear on a surface of the electronic device. It is possible that one of the discharge electrodes 4 and 5 is designed so that it penetrates the electronic device, the other appears only on a surface thereof.

In addition to the discharge electrodes 4 and 5 are penetrating electrodes 6 formed in the electronic device. These penetrating electrodes 6 electrically connect the other electronic devices that are above and below the electronic device 10 are arranged as if the electronic device would not exist between them.

A material for forming the electrode layers 1 and 2 may be a metal such as aluminum, copper or gold or a metal compound. A material for forming the dielectric layer 3 For example, a resin material such as acrylic resin, epoxy resin or vinyl resin, a ceramic material such as a barium titanium oxide-based ceramic material or a strontium titanium oxide-based ceramic ceramic material, a metal oxide such as titanium oxide or aluminum oxide, or a semi-metal oxide such as silicon oxide. In addition, a material for forming the drain electrodes 4 and 5 and the penetrating electrodes 6 in addition to a metal such as gold, silver, aluminum, copper or a solder material, a conductive paste or a conductive polymer.

The electrode layers 1 and 2 can be formed by vacuum evaporation, sputtering or electroplating or the like. In addition, the electrode layers 1 and 2 be formed in the predetermined structure (shape) as a polygonal shape by using a solid stencil with structuring, by using an evaporation stencil made of oil or the like, or by corresponding laser etching. The material for the oil stencil may consist of various types of oil such as hydrocarbon based oil, mineral oil or fluorocarbon oil.

The dielectric layer 3 can be formed by the following methods. When a resin-based material is used, it is evaporated by heating, or atomized by ultrasonic wave or spraying, and then applied. When the ceramic material or the metal-based material is used, sputtering, evaporation or the like can be selected.

To the discharge electrodes 4 and 5 and the penetrating electrodes 6 form openings in the dielectric layer 3 formed by the following methods. After forming the dielectric layer, the dielectric is removed in a predetermined part by laser etching. Alternatively, the dielectric layer is formed after application of the evaporation stencil, such as oil. A dotted or linear evaporation template may also be effectively applied by an ink jet system in which microdrops are ejected from a template material of micropores.

If the oil stencil The oil can be applied such as hydrocarbon based oil, mineral oil or hydrofluorocarbon oil become.

If If the evaporation template is used, excess stencil material, the remaining after forming each layer, if necessary through an infrared dark jet heater or far infrared heater, an electron beam, an irradiation with an ultraviolet lamp or a plasma irradiation be removed.

The electronic device For example, by using the device in the first or Second Ausfüh insurance example was described in a similar Way specially made.

The formed electronic device 10 is used by, for example, between a carrier 28 on which a semiconductor chip 27 is mounted, and a wiring board 30 is arranged as schematically in 11 will be shown. A signal connection 29a on the lower surface of the carrier 28 comes with a wiring structure 31 on the wiring board 30 is formed, via the penetrating electrode 6 of the electronic device 10 connected to the present invention, if necessary. There will also be an energy connection 29b on the lower surface of the carrier 28 with the wiring board 30 via the penetrating electrode 6 and continue with the first lead-off electrode 4 connected. The other energy connection 29b on the lower surface of the carrier 28 is with the wiring board 30 via the penetrating electrode 6 and further with the second discharge electrode 5 connected. The penetrating electrode 6 and the discharge electrodes 4 and 5 can with the wiring structure 31 on the surface of the wiring board 30 according to 11 or with another device such as a connection inside the wiring board 30 get connected. Alternatively, the energy connection 29b on the lower side of the carrier 28 with the discharge electrodes 4 and 5 be connected to the lower side of the carrier, in which case the electronic device 10 of the present invention with the wiring board 30 on the surface of the wiring board 30 can be connected. The reference number 9 in 11 indicates a capacitance forming region formed at the overlapping part of the first and second thin metal foils.

As the first electrode layer 1 connected to the first lead-off electrode 4 connected, and the second electrode layer 2 connected to the second lead-off electrode 5 is insulated by the interposed dielectric layer, for example, when a power terminal connected to the first Ableitelektrode 4 is connected, a Vcc terminal and the other power terminal, which is connected to the second Ableitelektrode 5 is connected, a ground terminal is that between the first Ableitelektrode 4 and the second discharge electrode 5 formed capacitor does not substantially increase the mounting area and acts as a pass-through capacitor for the power supply in the vicinity of the semiconductor chip. This is preferable in high-frequency driving and in reducing the size of the mounting surface.

[Example 3]

Aluminum was used as a material for the thin metal foil, acrylate was used as a dielectric material, and a silver-based paste was used as a conductive paste. In forming an electrode layer, a solid stencil having through-holes was used, and when forming a dielectric layer, fluorohydrocarbon oil was used as a material for an oil stencil for application with an ink-jet system. In an area of 15 square millimeters, 20 × 10 rows, that is, a total of 200 penetrating electrodes having a diameter of 0.3 mm at a pitch of 0.7 mm, and rectangular electrode layers 1 and 2 1 to 2 mm wide in various lengths between the rows of penetrating electrodes to make capacitors of different sizes from the overlapping parts of both electrodes. A conductive paste was filled in parts defining a 0.25 mm x 1 mm hole to form two drain electrodes in each capacitor. The application of the electrode layer having a thickness of 30 nm and the dielectric layer having a thickness of 0.3 μm was repeated to obtain 130 dielectric layers. Insulation layers having a thickness of 8 μm were respectively formed on the upper and lower sides of the layered product to increase its strength. The upper and lower insulating layers were made of the same material as the dielectric layer for the sake of simplicity. The lower insulating layer was processed to form holes for the penetrating electrodes and the drain electrodes by stencils. The upper insulating layer was also processed to form holes for the penetrating electrodes through templates. A conductive paste was brushed so that the concave part (opening) formed by machining the hole for the penetrating electrodes and the drain electrodes was filled and then cured.

One LCR meter confirmed the result that nine capacitors, namely four capacitors with a capacity of 0.047 μF, two capacitors with a capacity of 0.068 μF, two capacitors with a capacity of 0.1 μF and a capacitor with a capacitance of 0.47 μF at tan δ 1.2% within the layered arranged product having a thickness of about 60 microns were formed.

One Material for forming the electrode layers is not on the the above-described first to third embodiments and the examples 1 to 3 limited, but can be a metal like aluminum, copper or gold or a Be metal compound. A material for forming the dielectric Layer may be a resin material such as acrylic resin, epoxy resin or vinyl resin, a ceramic material such as barium titanium oxide based ceramic material or a strontium titanium oxide based ceramic Material, a metal oxide such as titanium oxide or aluminum oxide or a semi-metal oxide such as silica. In addition, a material for Forming the penetrating electrodes and the diverting electrodes additionally to the conductive paste, a conductive polymer or a metal such as Gold, silver, aluminum, copper or a soldering material. Furthermore For example, a material for forming the external electrodes may be added to The conductive paste will be a single material that comes from a conductive polymer and a metal such as brass, zinc, solder, gold, Silver and copper selected becomes. Alternatively you can the external electrodes are formed of a combination thereof be. For example, after forming a brass layer a layer of conductive paste may be formed thereon.

In the for used the description of the first to third embodiments Drawings are the electrode layers arranged so that they in the coating direction viewed from above at right angles to each other are arranged so that they are rectangular, capacity-forming Forming areas. The capacity forming areas but not be right-angled. For example, the cruising of the stripe Electrodes diagonally to each other the capacity forming area formed at the intersection with the form other shapes like a parallelogram.

Furthermore are the shapes of the drain electrodes and the penetrating electrodes not limited to those shown schematically in the drawings are, but can changed to other forms become.

Furthermore, an electronic device may have a mixture of the structures described in the first to third embodiments. For example, after forming the electrodes to be strip-shaped, as described in the first and second embodiments, some of these electrodes may be connected to the drain electrodes of the first embodiment, and the others may be connected to the external electrodes of the second embodiment. Alternatively, after forming the electrodes to be strip-shaped as described in the first and second embodiments, and after forming the electrodes in the predetermined structure as described in the third embodiment, some of these electrodes may be connected to the drain electrodes of the first or second electrodes third embodiment, wherein the others with the external electrodes of the second Ausfüh example can be connected.

Even though the openings (Holes) for forming the penetrating electrodes and the diverting electrodes in the dielectric layer by laser etching or applying the evaporation oil each Then be formed when the dielectric layer is applied will have to Do not while of applying. For example, after application irradiating a laser beam in a predetermined part of the openings (Holes) form. In other words, the penetrating electrode may pass through Forming a penetration hole formed in a coating direction so that it does not come into contact with any electrode layer and a conductive material is filled in the penetration hole. In addition, can the Ableitelektrode by forming a hole with a predetermined Depth (or a penetration hole) are formed so that they only with a desired one Electrode layer comes into contact and a conductive material in it filled is to come into contact with the electrode layer, the too an inner wall (and a lower part) of this hole is exposed. Thus, this lead electrode is electrically connected to the desired electrode layer.

In addition, can the electronic device, although described with a capacitor function as an example, is, other functions (for example, a coil, a noise filter or a layered printed circuit board, etc.) other than have or together with the capacitor function.

The Invention may be embodied in other specific forms without departing from the same To deviate spirit or essential qualities. The in this Application disclosed embodiments are intended considered in all respects as illustrative and not restrictive the scope of the invention is indicated by the appended claims indicated by the preceding description and all changes, falling within the meaning and scope of the equivalence of the claims, should be included in it.

INDUSTRIAL APPLICABILITY

As is described above, the method for producing the electronic equipment a capacity forming area, a coil, a noise filter and a layerwise arranged printed circuit board, etc. in the vicinity of a semiconductor chip, thereby a high-frequency control of the Semiconductor chips and a suppression the increase in the size of one mounting surface is reached. Thus, the present invention may be more particularly for one electronic equipment used, which is the information processing to accelerate effectively.

Claims (7)

Method for producing an electronic device comprising: applying a plurality of strip-shaped first thin metal foils ( 1 ); Application of a first dielectric thin film ( 3 ) having a first opening on the plurality of first thin metal foils and a second and third openings both in a region where the plurality of first thin metal foils are not deposited; Applying a plurality of strip-shaped second thin metal foils ( 2 ) to a region of the dielectric thin film ( 3 ), wherein the region has the third opening and does not have the first and the second opening, wherein the directions of the strips of the plurality of first thin metal foils ( 1 ) and the plurality of second thin metal foils ( 2 ) are crossed; Depositing a second dielectric thin film having fourth, fifth and sixth openings at the same positions as the first, second and third openings with respect to a coating direction, respectively; and repeatedly performing the four deposition steps on a support in a vacuum, wherein the first and second thin metal foils are deposited by vacuum evaporation or sputtering; whereby the first thin metal foils separated by the first and second dielectric thin foils are electrically connected to each other via the first and fourth openings, the second thin metal foils separated by the first and second dielectric thin foils, are electrically connected to each other via the third and the sixth openings, and capacitance-forming areas ( 9 ) are formed at respective intersections of the plurality of strip-shaped first thin metal foils and the plurality of strip-shaped second thin metal foils, and the method further comprises filling a conductive substance into a penetration hole formed from the second and fifth openings connected in the coating direction and thus a penetrating electrode ( 6 ) form. Method for producing the electronic device according to Claim 1, wherein the first to sixth opening by applying the thin dielectric film and then by irradiation of a laser beam is obtained on a given part to a part of the dielectric thin To remove foil. Method of making the electronic Apparatus according to claim 2, wherein the laser beam is a carbon dioxide gas laser. Method for producing the electronic device according to Claim 1, wherein the first to sixth opening through an oil stencil is obtained. Method for producing the electronic device according to Claim 4, wherein a for the oil stencil used oil a hydrocarbon based oil, a mineral oil or a Fluorocarbon oil is. Method for producing the electronic device according to one of the claims 1 to 5, wherein after repeatedly performing the application steps a part of the thin one Metal foil to a surface of the layered product, in the coating direction is received, exposed. Method for producing the electronic device according to Claim 6, wherein a conductive substance is applied to a surface of the exposed part of the thin Metal foil is applied.