DE60028717D1 - Elektronisches Modul mit Leistungsbauteilen und Verfahren zur Herstellung - Google Patents

Elektronisches Modul mit Leistungsbauteilen und Verfahren zur Herstellung

Info

Publication number
DE60028717D1
DE60028717D1 DE60028717T DE60028717T DE60028717D1 DE 60028717 D1 DE60028717 D1 DE 60028717D1 DE 60028717 T DE60028717 T DE 60028717T DE 60028717 T DE60028717 T DE 60028717T DE 60028717 D1 DE60028717 D1 DE 60028717D1
Authority
DE
Germany
Prior art keywords
manufacture
electronic module
power components
components
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60028717T
Other languages
English (en)
Other versions
DE60028717T2 (de
Inventor
Jean Hoche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Publication of DE60028717D1 publication Critical patent/DE60028717D1/de
Application granted granted Critical
Publication of DE60028717T2 publication Critical patent/DE60028717T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/08—Short-circuiting members for bridging contacts in a counterpart
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE60028717T 2000-01-11 2000-12-27 Elektronisches Modul mit Leistungsbauteilen und Verfahren zur Herstellung Expired - Lifetime DE60028717T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0000282 2000-01-11
FR0000282A FR2803716B1 (fr) 2000-01-11 2000-01-11 Module electronique a composants de puissance et procede de fabrication

Publications (2)

Publication Number Publication Date
DE60028717D1 true DE60028717D1 (de) 2006-07-27
DE60028717T2 DE60028717T2 (de) 2007-06-14

Family

ID=8845774

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60028717T Expired - Lifetime DE60028717T2 (de) 2000-01-11 2000-12-27 Elektronisches Modul mit Leistungsbauteilen und Verfahren zur Herstellung

Country Status (6)

Country Link
US (1) US6452808B2 (de)
EP (1) EP1117282B1 (de)
JP (1) JP2001237570A (de)
DE (1) DE60028717T2 (de)
ES (1) ES2265328T3 (de)
FR (1) FR2803716B1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2835389B1 (fr) * 2002-01-30 2005-10-21 Dispositif comprenant un support metallique isole et un circuit electrique
JP2003309338A (ja) * 2002-04-15 2003-10-31 Fujitsu Ltd 基板、接続構造及び電子装置
JP4735270B2 (ja) * 2005-01-21 2011-07-27 株式会社日立製作所 電源装置およびこれを用いた電源システム、電子装置
US8570190B2 (en) * 2007-09-07 2013-10-29 Led Roadway Lighting Ltd. Centralized route calculation for a multi-hop streetlight network
EP2200408B1 (de) 2008-12-17 2013-05-08 Autoliv Development AB Platinenvorrichtung, insbesondere für eine stromverbrauchende Vorrichtung in einem Kraftfahrzeug
EP2677035A1 (de) 2012-06-22 2013-12-25 BASF Plant Science Company GmbH Pflanzen mit verbesserten Ertragseigenschaften und Verfahren zu ihrer Herstellung
DE202018102765U1 (de) 2018-03-28 2018-06-12 DEHN + SÖHNE GmbH + Co. KG. Oberflächenmontierbares elektronisches Bauelement mit mindestens zwei elektrischen Anschlusselementen
CN111415909B (zh) 2019-01-07 2022-08-05 台达电子企业管理（上海）有限公司 多芯片封装功率模块
US11676756B2 (en) 2019-01-07 2023-06-13 Delta Electronics (Shanghai) Co., Ltd. Coupled inductor and power supply module
US11063525B2 (en) 2019-01-07 2021-07-13 Delta Electronics (Shanghai) Co., Ltd. Power supply module and manufacture method for same
CN111415908B (zh) 2019-01-07 2022-02-22 台达电子企业管理（上海）有限公司 电源模块、芯片嵌入式封装模块及制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2560437B1 (fr) * 1984-02-28 1987-05-29 Citroen Sa Procede de report a plat d'elements de puissance sur un reseau conducteur par brasage de leurs connexions
JPS6185070A (ja) * 1984-09-28 1986-04-30 Toshiba Corp 多出力倍電圧整流回路
US4838475A (en) * 1987-08-28 1989-06-13 Motorola, Inc. Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
DE3826999A1 (de) * 1987-11-25 1989-06-08 Mitsubishi Electric Corp Leitungsbruecke und verfahren zu ihrer herstellung
DE4425803A1 (de) * 1993-08-11 1995-02-16 Siemens Ag Oesterreich Leiterplatte
US5637922A (en) * 1994-02-07 1997-06-10 General Electric Company Wireless radio frequency power semiconductor devices using high density interconnect
FR2719183B1 (fr) * 1994-04-25 1996-07-12 Peugeot Procédé de fabrication d'un circuit électronique de puissance et circuit électronique obtenu par ce procédé.
JPH0846317A (ja) * 1994-07-26 1996-02-16 Honda Motor Co Ltd 制御基板
JPH11288755A (ja) * 1998-03-31 1999-10-19 Aiwa Co Ltd ジャンパ素子およびその製造方法
US5973923A (en) * 1998-05-28 1999-10-26 Jitaru; Ionel Packaging power converters

Also Published As

Publication number Publication date
EP1117282A1 (de) 2001-07-18
JP2001237570A (ja) 2001-08-31
US6452808B2 (en) 2002-09-17
EP1117282B1 (de) 2006-06-14
US20010007287A1 (en) 2001-07-12
FR2803716A1 (fr) 2001-07-13
ES2265328T3 (es) 2007-02-16
DE60028717T2 (de) 2007-06-14
FR2803716B1 (fr) 2002-04-05

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