DE60026547D1 - Lötverfahren und lötstelle - Google Patents

Lötverfahren und lötstelle

Info

Publication number
DE60026547D1
DE60026547D1 DE60026547T DE60026547T DE60026547D1 DE 60026547 D1 DE60026547 D1 DE 60026547D1 DE 60026547 T DE60026547 T DE 60026547T DE 60026547 T DE60026547 T DE 60026547T DE 60026547 D1 DE60026547 D1 DE 60026547D1
Authority
DE
Germany
Prior art keywords
soldering
point
soldering process
soldering point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60026547T
Other languages
English (en)
Other versions
DE60026547T2 (de
Inventor
Masayuki Kitajima
Masakazu Takesue
Tadaaki Shono
Motoko Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2000/002491 external-priority patent/WO2001078931A1/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE60026547D1 publication Critical patent/DE60026547D1/de
Publication of DE60026547T2 publication Critical patent/DE60026547T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60026547T 2000-04-17 2000-09-19 Lötverfahren und lötstelle Expired - Lifetime DE60026547T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2000/002491 WO2001078931A1 (fr) 2000-04-17 2000-04-17 Assemblage par brasure
WOPCT/JP00/02491 2000-04-17
PCT/JP2000/006389 WO2001080611A1 (fr) 2000-04-17 2000-09-19 Procede de brasage et joint soude

Publications (2)

Publication Number Publication Date
DE60026547D1 true DE60026547D1 (de) 2006-05-04
DE60026547T2 DE60026547T2 (de) 2006-08-10

Family

ID=36202150

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60026547T Expired - Lifetime DE60026547T2 (de) 2000-04-17 2000-09-19 Lötverfahren und lötstelle

Country Status (2)

Country Link
KR (1) KR100660582B1 (de)
DE (1) DE60026547T2 (de)

Also Published As

Publication number Publication date
DE60026547T2 (de) 2006-08-10
KR20020031098A (ko) 2002-04-26
KR100660582B1 (ko) 2006-12-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE