DE60018916D1 - Prüfsysteme mit zweidimensionaler bildgebung mit lichtstrichen - Google Patents

Prüfsysteme mit zweidimensionaler bildgebung mit lichtstrichen

Info

Publication number
DE60018916D1
DE60018916D1 DE60018916T DE60018916T DE60018916D1 DE 60018916 D1 DE60018916 D1 DE 60018916D1 DE 60018916 T DE60018916 T DE 60018916T DE 60018916 T DE60018916 T DE 60018916T DE 60018916 D1 DE60018916 D1 DE 60018916D1
Authority
DE
Germany
Prior art keywords
illuminators
dimensional imaging
test systems
test
systems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60018916T
Other languages
English (en)
Other versions
DE60018916T2 (de
Inventor
Silviu Reinhron
Gilad Almogy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE60018916D1 publication Critical patent/DE60018916D1/de
Publication of DE60018916T2 publication Critical patent/DE60018916T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE60018916T 1999-05-11 2000-05-11 Prüfsysteme mit zweidimensionaler bildgebung mit lichtstrichen Expired - Fee Related DE60018916T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/309,358 US6587193B1 (en) 1999-05-11 1999-05-11 Inspection systems performing two-dimensional imaging with line light spot
US309358 1999-05-11
PCT/US2000/013042 WO2000068673A1 (en) 1999-05-11 2000-05-11 Inspection systems performing two-dimensional imaging with line light spot

Publications (2)

Publication Number Publication Date
DE60018916D1 true DE60018916D1 (de) 2005-04-28
DE60018916T2 DE60018916T2 (de) 2006-03-16

Family

ID=23197893

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60018916T Expired - Fee Related DE60018916T2 (de) 1999-05-11 2000-05-11 Prüfsysteme mit zweidimensionaler bildgebung mit lichtstrichen

Country Status (6)

Country Link
US (1) US6587193B1 (de)
EP (1) EP1177428B1 (de)
JP (1) JP5197899B2 (de)
KR (1) KR100898963B1 (de)
DE (1) DE60018916T2 (de)
WO (1) WO2000068673A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
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US6774991B1 (en) * 1999-05-27 2004-08-10 Inspex Incorporated Method and apparatus for inspecting a patterned semiconductor wafer
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
DE10019486A1 (de) * 2000-04-19 2001-10-31 Siemens Ag Anordnung zur Inspektion von Objektoberflächen
EP1220596A1 (de) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente
IL144806A (en) * 2001-08-08 2005-11-20 Nova Measuring Instr Ltd Method and apparatus for process control in semiconductor manufacturing
JP4157037B2 (ja) * 2001-09-21 2008-09-24 オリンパス株式会社 欠陥検査装置
US20040032581A1 (en) * 2002-01-15 2004-02-19 Mehrdad Nikoonahad Systems and methods for inspection of specimen surfaces
US7236847B2 (en) 2002-01-16 2007-06-26 Kla-Tencor Technologies Corp. Systems and methods for closed loop defect reduction
US6809808B2 (en) * 2002-03-22 2004-10-26 Applied Materials, Inc. Wafer defect detection system with traveling lens multi-beam scanner
US20050122509A1 (en) * 2002-07-18 2005-06-09 Leica Microsystems Semiconductor Gmbh Apparatus for wafer inspection
JP4183492B2 (ja) * 2002-11-27 2008-11-19 株式会社日立製作所 欠陥検査装置および欠陥検査方法
US6990385B1 (en) 2003-02-03 2006-01-24 Kla-Tencor Technologies Corporation Defect detection using multiple sensors and parallel processing
US7365834B2 (en) * 2003-06-24 2008-04-29 Kla-Tencor Technologies Corporation Optical system for detecting anomalies and/or features of surfaces
DE102004015326A1 (de) 2004-03-30 2005-10-20 Leica Microsystems Vorrichtung und Verfahren zur Inspektion eines Halbleiterbauteils
DE102004029212B4 (de) * 2004-06-16 2006-07-13 Leica Microsystems Semiconductor Gmbh Vorrichtung und Verfahren zur optischen Auf- und/oder Durchlichtinspektion von Mikrostrukturen im IR
DE102005014593A1 (de) * 2005-03-31 2006-10-05 Leica Microsystems Semiconductor Gmbh Vorrichtung zur Inspektion eines scheibenförmigen Objekts
NL1029285C2 (nl) * 2005-06-17 2006-12-19 Ccm Beheer Bv Detectiesysteem.
JP2007263569A (ja) * 2006-03-27 2007-10-11 Toppan Printing Co Ltd 周期構造欠陥測定装置
JP2008191066A (ja) * 2007-02-07 2008-08-21 Topcon Corp 表面検査方法および表面検査装置
DE102008028869A1 (de) 2008-06-19 2009-12-24 Vistec Semiconductor Systems Gmbh Verfahren und Vorrichtung zur Inspektion eines scheibenförmigen Gegenstandes
KR101127563B1 (ko) 2010-08-18 2012-06-12 주식회사 에프에스티 대면적 고속 검출모듈이 구비된 검사장치
US9279774B2 (en) 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
TWI470210B (zh) * 2012-12-17 2015-01-21 Taiwan Power Testing Technology Co Ltd 顯示裝置之光學層件之缺陷檢測方法
JP6330211B2 (ja) * 2013-10-06 2018-05-30 株式会社山梨技術工房 平板基板の表面状態検査方法及びそれを用いた平板基板の表面状態検査装置
US9846122B2 (en) 2013-11-26 2017-12-19 Nanometrics Incorporated Optical metrology system for spectral imaging of a sample
US9182351B2 (en) 2013-11-26 2015-11-10 Nanometrics Incorporated Optical metrology system for spectral imaging of a sample
US9395309B2 (en) 2014-10-15 2016-07-19 Exnodes Inc. Multiple angle computational wafer inspection
JP6410618B2 (ja) * 2015-01-19 2018-10-24 株式会社ニューフレアテクノロジー 欠陥検査装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115945A (en) * 1980-02-18 1981-09-11 Hitachi Electronics Eng Co Ltd Detecting device for defect of panel plate
US5274434A (en) 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
JPH046448A (ja) * 1990-04-25 1992-01-10 Sumitomo Bakelite Co Ltd 積層板の検査方法
US5798831A (en) * 1991-12-19 1998-08-25 Nikon Corporation Defect inspecting apparatus and defect inspecting method
US5486919A (en) * 1992-04-27 1996-01-23 Canon Kabushiki Kaisha Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern
US5883710A (en) * 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
JP2723471B2 (ja) * 1994-07-11 1998-03-09 テルモ株式会社 採血装置
US5631733A (en) 1995-01-20 1997-05-20 Photon Dynamics, Inc. Large area defect monitor tool for manufacture of clean surfaces
JP3140664B2 (ja) * 1995-06-30 2001-03-05 松下電器産業株式会社 異物検査方法及び装置
KR980010412A (ko) 1996-07-09 1998-04-30 고노 시게오 이물질 검사 장치
US5940175A (en) * 1996-11-01 1999-08-17 Msp Corporation Method and apparatus for surface inspection in a chamber
US5917588A (en) 1996-11-04 1999-06-29 Kla-Tencor Corporation Automated specimen inspection system for and method of distinguishing features or anomalies under either bright field or dark field illumination
JPH10197812A (ja) * 1997-01-06 1998-07-31 Asahi Optical Co Ltd カスケード走査光学系の書き出し位置調整装置
JPH10221265A (ja) * 1997-01-31 1998-08-21 Advantest Corp 異物検出装置および異物観察分析装置
US5889593A (en) 1997-02-26 1999-03-30 Kla Instruments Corporation Optical system and method for angle-dependent reflection or transmission measurement
US6608676B1 (en) 1997-08-01 2003-08-19 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
US6201601B1 (en) 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
US6175645B1 (en) 1998-01-22 2001-01-16 Applied Materials, Inc. Optical inspection method and apparatus
US6256093B1 (en) * 1998-06-25 2001-07-03 Applied Materials, Inc. On-the-fly automatic defect classification for substrates using signal attributes

Also Published As

Publication number Publication date
KR20020011411A (ko) 2002-02-08
DE60018916T2 (de) 2006-03-16
KR100898963B1 (ko) 2009-05-25
JP5197899B2 (ja) 2013-05-15
EP1177428B1 (de) 2005-03-23
US6587193B1 (en) 2003-07-01
EP1177428A1 (de) 2002-02-06
JP2002544477A (ja) 2002-12-24
WO2000068673A1 (en) 2000-11-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee