DE60016896D1 - Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahren - Google Patents

Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahren

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Publication number
DE60016896D1
DE60016896D1 DE60016896T DE60016896T DE60016896D1 DE 60016896 D1 DE60016896 D1 DE 60016896D1 DE 60016896 T DE60016896 T DE 60016896T DE 60016896 T DE60016896 T DE 60016896T DE 60016896 D1 DE60016896 D1 DE 60016896D1
Authority
DE
Germany
Prior art keywords
sensor
stud
interchange
related manufacturing
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60016896T
Other languages
English (en)
Inventor
Alan Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Defence Science and Technology Agency
Original Assignee
Defence Science and Technology Agency
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Defence Science and Technology Agency filed Critical Defence Science and Technology Agency
Application granted granted Critical
Publication of DE60016896D1 publication Critical patent/DE60016896D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
    • G01N17/02—Electrochemical measuring systems for weathering, corrosion or corrosion-protection measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/44—Resins; Plastics; Rubber; Leather
    • G01N33/442—Resins; Plastics

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Environmental Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Ecology (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE60016896T 1999-02-08 2000-02-08 Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahren Expired - Lifetime DE60016896D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11916699P 1999-02-08 1999-02-08
PCT/US2000/003308 WO2000046593A2 (en) 1999-02-08 2000-02-08 A micro-electronic bond degradation sensor and method of manufacture

Publications (1)

Publication Number Publication Date
DE60016896D1 true DE60016896D1 (de) 2005-01-27

Family

ID=22382891

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60016896T Expired - Lifetime DE60016896D1 (de) 1999-02-08 2000-02-08 Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahren

Country Status (6)

Country Link
US (2) US6384610B1 (de)
EP (1) EP1151286B1 (de)
AT (1) ATE285578T1 (de)
AU (2) AU770057B2 (de)
DE (1) DE60016896D1 (de)
WO (1) WO2000046593A2 (de)

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ATE285578T1 (de) 1999-02-08 2005-01-15 Defence Science & Tech Org Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahren
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AU2009212091B2 (en) 2008-02-05 2014-08-07 The Commonwealth Of Australia Degradation sensor
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DE102009056894B4 (de) * 2009-12-10 2011-11-10 Eads Deutschland Gmbh Verfahren zur Herstellung eines Bauteils mit mindestens einem Mikrosensor
FR2953812B1 (fr) * 2009-12-11 2012-09-07 Airbus Operations Sas Procede de reparation d'un fuselage d'aeronef
US9816978B2 (en) * 2010-07-15 2017-11-14 Brigham Young University Apparatus for analysis of concrete including a reinforcing bar
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US8928339B2 (en) * 2010-10-29 2015-01-06 The Boeing Company Methods and systems for automated measurement of electrical bonds
US9567104B2 (en) 2011-04-12 2017-02-14 The Boeing Company Utilization of aircraft bondline embedded current sensors in the determination of a lightning damage index
US8812251B2 (en) 2011-04-12 2014-08-19 The Boeing Company System and method for monitoring bonding integrity
US9267906B2 (en) 2011-04-12 2016-02-23 The Boeing Company Bondline embedded current sensor
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JP2014163900A (ja) * 2013-02-27 2014-09-08 Dainippon Printing Co Ltd 濃度測定センサ、濃度測定センサ用シート及びその製造方法
US9123701B2 (en) * 2013-07-11 2015-09-01 Infineon Technologies Austria Ag Semiconductor die and package with source down and sensing configuration
US9261444B1 (en) * 2013-07-30 2016-02-16 The Boeing Company Apparatus, system, and method for in situ strength testing of a bonded joint
WO2016014134A2 (en) 2014-04-28 2016-01-28 Brigham Young University Data acquisition system with rotating probe members and ground reference electrode
US10031066B1 (en) 2014-06-26 2018-07-24 Analatom Incorporated Linear polarization resistance flex sensors and methods that involve structure as working electrode(s)
WO2016205207A1 (en) 2015-06-14 2016-12-22 Brigham Young University Flexible elements for probes and guard rings
EP3141893B1 (de) * 2015-09-08 2019-12-11 Mitsubishi Electric R&D Centre Europe B.V. System zur bestimmung, ob in einer schnittstelle eines halbleiterchips eine verschlechterung stattfindet
US9818655B2 (en) 2015-12-08 2017-11-14 International Business Machines Corporation Method and structure for flip-chip package reliability monitoring using capacitive sensors groups
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US11255820B2 (en) * 2019-01-16 2022-02-22 The Boeing Company Patch for in-situ monitoring of structures
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ATE285578T1 (de) 1999-02-08 2005-01-15 Defence Science & Tech Org Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahren

Also Published As

Publication number Publication date
EP1151286B1 (de) 2004-12-22
EP1151286A2 (de) 2001-11-07
US20020190729A1 (en) 2002-12-19
US6384610B1 (en) 2002-05-07
WO2000046593A2 (en) 2000-08-10
AU2004201996A1 (en) 2004-06-10
AU3593100A (en) 2000-08-25
ATE285578T1 (de) 2005-01-15
US6693417B2 (en) 2004-02-17
AU770057B2 (en) 2004-02-12
WO2000046593A3 (en) 2000-12-14

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