DE60012896D1 - Kapazitiver hochspannungsteiler mit hochspannungs soi-kondensator - Google Patents

Kapazitiver hochspannungsteiler mit hochspannungs soi-kondensator

Info

Publication number
DE60012896D1
DE60012896D1 DE60012896T DE60012896T DE60012896D1 DE 60012896 D1 DE60012896 D1 DE 60012896D1 DE 60012896 T DE60012896 T DE 60012896T DE 60012896 T DE60012896 T DE 60012896T DE 60012896 D1 DE60012896 D1 DE 60012896D1
Authority
DE
Germany
Prior art keywords
high voltage
capacitive
voltage divider
soi capacitor
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60012896T
Other languages
English (en)
Other versions
DE60012896T2 (de
Inventor
Naveed Majid
Theodore Letavic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE60012896D1 publication Critical patent/DE60012896D1/de
Application granted granted Critical
Publication of DE60012896T2 publication Critical patent/DE60012896T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0805Capacitors only
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1203Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K5/00Manipulating of pulses not covered by one of the other main groups of this subclass
    • H03K5/01Shaping pulses
    • H03K5/12Shaping pulses by steepening leading or trailing edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/04Voltage dividers
    • G01R15/06Voltage dividers having reactive components, e.g. capacitive transformer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE60012896T 1999-12-28 2000-12-11 Kapazitiver hochspannungsteiler mit hochspannungs soi-kondensator Expired - Fee Related DE60012896T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/473,530 US6518814B1 (en) 1999-12-28 1999-12-28 High-voltage capacitor voltage divider circuit having a high-voltage silicon-on-insulation (SOI) capacitor
US473530 1999-12-28
PCT/EP2000/012538 WO2001048824A1 (en) 1999-12-28 2000-12-11 High-voltage capacitor voltage divider circuit having a high-voltage silicon-on-insulator (soi) capacitor

Publications (2)

Publication Number Publication Date
DE60012896D1 true DE60012896D1 (de) 2004-09-16
DE60012896T2 DE60012896T2 (de) 2005-07-28

Family

ID=23879915

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60012896T Expired - Fee Related DE60012896T2 (de) 1999-12-28 2000-12-11 Kapazitiver hochspannungsteiler mit hochspannungs soi-kondensator

Country Status (6)

Country Link
US (1) US6518814B1 (de)
EP (1) EP1159759B1 (de)
JP (1) JP2003518774A (de)
KR (1) KR20010102412A (de)
DE (1) DE60012896T2 (de)
WO (1) WO2001048824A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI278987B (en) * 2001-12-04 2007-04-11 Em Microelectronic Marin Sa Complementary electronic system for lowering electric power consumption
JP2005038882A (ja) * 2003-07-15 2005-02-10 Sanyo Electric Co Ltd 半導体装置、及び分圧回路
JP2005038883A (ja) * 2003-07-15 2005-02-10 Sanyo Electric Co Ltd 半導体装置、及び分圧回路
JP2005038881A (ja) * 2003-07-15 2005-02-10 Sanyo Electric Co Ltd 半導体装置、及び分圧回路
US7307467B2 (en) * 2006-04-28 2007-12-11 International Business Machines Corporation Structure and method for implementing oxide leakage based voltage divider network for integrated circuit devices
US7061308B2 (en) * 2003-10-01 2006-06-13 International Business Machines Corporation Voltage divider for integrated circuits
WO2006052233A1 (en) * 2004-11-04 2006-05-18 International Business Machines Corporation Voltage divider for integrated circuits
US20060170487A1 (en) * 2005-01-31 2006-08-03 International Business Machines Corporation A voltage reference circuit for ultra-thin oxide technology and low voltage applications
US7579897B2 (en) * 2006-04-28 2009-08-25 International Business Machines Corporation Design structure for implementing oxide leakage based voltage divider network for integrated circuit devices
US20090237312A1 (en) * 2008-03-24 2009-09-24 Schober Edward A Antenna
US7994729B2 (en) * 2008-07-21 2011-08-09 Simplexgrinnell Lp Optical element driving circuit
FR2940457B1 (fr) 2008-12-18 2011-02-18 Schneider Electric Ind Sas Dispositif diviseur capacitif, capteur de tension, module de declencheur et appareil de protection electrique pourvus d'un tel dispositif
US8513723B2 (en) * 2010-01-19 2013-08-20 International Business Machines Corporation Method and structure for forming high performance MOS capacitor along with fully depleted semiconductor on insulator devices on the same chip
US9081038B2 (en) * 2011-10-04 2015-07-14 Analog Devices, Inc. Voltage monitor
CN102809677B (zh) * 2012-07-17 2015-02-04 西北核技术研究所 一种标定薄膜电容分压器的方法
WO2020198707A1 (en) * 2019-03-27 2020-10-01 Prippell Technologies, Llc Polyphase switching regulator
EP4142133A1 (de) 2021-08-30 2023-03-01 Murata Manufacturing Co., Ltd. Elektrische vorrichtung mit einem wechselspannungsteiler und in integrierten komponenten angeordneten kondensatoren

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL158054B (nl) * 1968-11-20 1978-09-15 Auco Nv Van twee aansluitorganen voorziene hulpinrichting voor het ontsteken van een gasontladingsbuis.
DE2215928B2 (de) * 1972-03-29 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Spannungs-Meßeinrichtung für eine vollisolierte, metallgekapselte Hochspannungs-Schaltanlage
FR2493527A1 (fr) * 1980-11-06 1982-05-07 Alsthom Atlantique Dispositif pour l'elimination rapide des charges piegees dans un pont diviseur capacitif utilise pour la surveillance des tensions alternatives elevees
JPS60179998A (ja) 1984-02-28 1985-09-13 Fujitsu Ltd 電圧検出回路
US4709320A (en) * 1986-10-23 1987-11-24 Zenith Electronics Corporation Low voltage shutdown circuit
JPH02142319A (ja) 1988-11-21 1990-05-31 Toshiba Corp 変圧器用接地線の断線検出装置
EP0631144A1 (de) 1993-06-24 1994-12-28 Koninklijke Philips Electronics N.V. Hochspannungdifferentialsensor mit kapazitiver Abschwächung
KR950010763B1 (ko) * 1993-12-03 1995-09-22 재단법인한국전자통신연구소 커패시터형 전압분배기 회로
EP0661749A1 (de) 1993-12-28 1995-07-05 Seiko Instruments Inc. Integrierte Halbleiterschaltung für einen Spannungshöher und elektronische Anordnung für eine solche integrierte Halbleiterschaltung
US5910738A (en) * 1995-04-07 1999-06-08 Kabushiki Kaisha Toshiba Driving circuit for driving a semiconductor device at high speed and method of operating the same
JP3311205B2 (ja) * 1995-07-13 2002-08-05 株式会社東芝 半導体記憶装置及びその製造方法
US5796296A (en) * 1996-10-07 1998-08-18 Texas Instruments Incorporated Combined resistance-capacitance ladder voltage divider circuit
US5952695A (en) * 1997-03-05 1999-09-14 International Business Machines Corporation Silicon-on-insulator and CMOS-on-SOI double film structures

Also Published As

Publication number Publication date
EP1159759B1 (de) 2004-08-11
US6518814B1 (en) 2003-02-11
DE60012896T2 (de) 2005-07-28
KR20010102412A (ko) 2001-11-15
EP1159759A1 (de) 2001-12-05
JP2003518774A (ja) 2003-06-10
WO2001048824A1 (en) 2001-07-05

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee