DE60006139D1 - Verfahren und vorrichtung zum chemisch-mechanischen polieren mit einer zylinderförmigen polierscheibe - Google Patents

Verfahren und vorrichtung zum chemisch-mechanischen polieren mit einer zylinderförmigen polierscheibe

Info

Publication number
DE60006139D1
DE60006139D1 DE60006139T DE60006139T DE60006139D1 DE 60006139 D1 DE60006139 D1 DE 60006139D1 DE 60006139 T DE60006139 T DE 60006139T DE 60006139 T DE60006139 T DE 60006139T DE 60006139 D1 DE60006139 D1 DE 60006139D1
Authority
DE
Germany
Prior art keywords
chemical
cylinder
polishing
shaped
mechanical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60006139T
Other languages
English (en)
Other versions
DE60006139T2 (de
Inventor
T Frost
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60006139D1 publication Critical patent/DE60006139D1/de
Publication of DE60006139T2 publication Critical patent/DE60006139T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE60006139T 1999-09-13 2000-08-17 Verfahren und vorrichtung zum chemisch-mechanischen polieren mit einer zylinderförmigen polierscheibe Expired - Fee Related DE60006139T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15374899P 1999-09-13 1999-09-13
US153748P 1999-09-13
US514416 2000-02-28
US09/514,416 US6347977B1 (en) 1999-09-13 2000-02-28 Method and system for chemical mechanical polishing
PCT/US2000/022786 WO2001019567A1 (en) 1999-09-13 2000-08-17 Method and system for chemical mechanical polishing with a cylindrical polishing pad

Publications (2)

Publication Number Publication Date
DE60006139D1 true DE60006139D1 (de) 2003-11-27
DE60006139T2 DE60006139T2 (de) 2004-06-17

Family

ID=26850824

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60006139T Expired - Fee Related DE60006139T2 (de) 1999-09-13 2000-08-17 Verfahren und vorrichtung zum chemisch-mechanischen polieren mit einer zylinderförmigen polierscheibe

Country Status (8)

Country Link
US (1) US6347977B1 (de)
EP (1) EP1212170B1 (de)
JP (1) JP2003509852A (de)
KR (2) KR20020029948A (de)
AU (1) AU6918500A (de)
DE (1) DE60006139T2 (de)
TW (1) TW474853B (de)
WO (1) WO2001019567A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624642B1 (en) * 2001-12-10 2003-09-23 Advanced Micro Devices, Inc. Metal bridging monitor for etch and CMP endpoint detection
US6620029B2 (en) * 2002-01-30 2003-09-16 International Business Machines Corporation Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces
US6800494B1 (en) * 2002-05-17 2004-10-05 Advanced Micro Devices, Inc. Method and apparatus for controlling copper barrier/seed deposition processes
US6916233B2 (en) * 2002-11-28 2005-07-12 Tsc Corporation Polishing and cleaning compound device
US7050880B2 (en) * 2003-12-30 2006-05-23 Sc Solutions Chemical-mechanical planarization controller
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194866A (en) 1981-05-21 1982-11-30 Shin Etsu Chem Co Ltd Lapping device
JPH0637025B2 (ja) * 1987-09-14 1994-05-18 スピードファム株式会社 ウエハの鏡面加工装置
US5083401A (en) * 1988-08-08 1992-01-28 Mitsubishi Denki Kabushiki Kaisha Method of polishing
US4934102A (en) 1988-10-04 1990-06-19 International Business Machines Corporation System for mechanical planarization
JPH0766160A (ja) 1993-08-24 1995-03-10 Sony Corp 半導体基板の研磨方法及び研磨装置
US5700180A (en) 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
JP3566417B2 (ja) * 1994-10-31 2004-09-15 株式会社荏原製作所 ポリッシング装置
US5643044A (en) * 1994-11-01 1997-07-01 Lund; Douglas E. Automatic chemical and mechanical polishing system for semiconductor wafers
JP3601910B2 (ja) * 1995-07-20 2004-12-15 株式会社荏原製作所 ポリッシング装置及び方法
JPH10554A (ja) * 1996-06-12 1998-01-06 Nippon Steel Corp 局所研磨装置

Also Published As

Publication number Publication date
TW474853B (en) 2002-02-01
EP1212170B1 (de) 2003-10-22
DE60006139T2 (de) 2004-06-17
JP2003509852A (ja) 2003-03-11
WO2001019567A1 (en) 2001-03-22
AU6918500A (en) 2001-04-17
KR20070087169A (ko) 2007-08-27
US6347977B1 (en) 2002-02-19
EP1212170A1 (de) 2002-06-12
KR20020029948A (ko) 2002-04-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee