JPS57194866A - Lapping device - Google Patents

Lapping device

Info

Publication number
JPS57194866A
JPS57194866A JP56077002A JP7700281A JPS57194866A JP S57194866 A JPS57194866 A JP S57194866A JP 56077002 A JP56077002 A JP 56077002A JP 7700281 A JP7700281 A JP 7700281A JP S57194866 A JPS57194866 A JP S57194866A
Authority
JP
Japan
Prior art keywords
holding table
work holding
axis
rotary roller
rotary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56077002A
Other languages
Japanese (ja)
Inventor
Haruo Okamoto
Shohei Sekikawa
Akira Shimoma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP56077002A priority Critical patent/JPS57194866A/en
Publication of JPS57194866A publication Critical patent/JPS57194866A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

PURPOSE:To enable to lap the surface other than plane surface by a method wherein a mechanism, by which a work holding table is tree-dimensionally moved relative to a rotary lapping roller, is provided for lapping non-plane surface of semiconductor and the like. CONSTITUTION:The rotary roller 2 is rotatingly driven by means of a drive motor 6. The work holding table 3 arranged at the lower surface of the rotary roller 2 is supported by a supporting frame 8, on the lower surface of which a gear 8a is formed. A worm screw 10 and the gear 8a are engaged with each other so as to move the work holding table back and forth toward the direction of X-axis by means of a drive motor 9. A similar mechanism is provided for moving the work holding table 3 back and forth toward the direction of Z-axis. The work holding table 3 is moved in the supporting frame 8 toward the direction of X-axis by means of an oil-hydraulic or pneumatic cylinder 11 provided on the lower surface of the work holding table 3. An arbitrarily curved surface is lapped by moving the work holding table 3 toward the directions of X- and Z-axes while the work holding table 3 is pressed against the rotary roller 2 by means of the pneumatic cylinder 11.
JP56077002A 1981-05-21 1981-05-21 Lapping device Pending JPS57194866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56077002A JPS57194866A (en) 1981-05-21 1981-05-21 Lapping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56077002A JPS57194866A (en) 1981-05-21 1981-05-21 Lapping device

Publications (1)

Publication Number Publication Date
JPS57194866A true JPS57194866A (en) 1982-11-30

Family

ID=13621558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56077002A Pending JPS57194866A (en) 1981-05-21 1981-05-21 Lapping device

Country Status (1)

Country Link
JP (1) JPS57194866A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS631179A (en) * 1986-06-19 1988-01-06 Sony Corp Still picture transmission equipment
JPS6350650U (en) * 1986-09-19 1988-04-06
JPH0283154A (en) * 1988-09-17 1990-03-23 Shinwa Sokutei Kk Grinding device for square
EP0724932A1 (en) * 1995-01-20 1996-08-07 Seiko Instruments Inc. A semiconductor substrate, devices having the same and a method of manufacturing the same
WO1998053952A1 (en) * 1997-05-29 1998-12-03 Tucker Thomas N Chemical mechanical planarization tool having a linear polishing roller
WO2001019567A1 (en) * 1999-09-13 2001-03-22 Lam Research Corporation Method and system for chemical mechanical polishing with a cylindrical polishing pad
CN108857832A (en) * 2018-05-29 2018-11-23 滁州南钢盛达实业有限公司 A kind of steel plate burnishing device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5554175A (en) * 1978-10-06 1980-04-21 Hitachi Seiko Ltd Numerically controlled surface grinder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5554175A (en) * 1978-10-06 1980-04-21 Hitachi Seiko Ltd Numerically controlled surface grinder

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS631179A (en) * 1986-06-19 1988-01-06 Sony Corp Still picture transmission equipment
JPS6350650U (en) * 1986-09-19 1988-04-06
JPH0453893Y2 (en) * 1986-09-19 1992-12-17
JPH0283154A (en) * 1988-09-17 1990-03-23 Shinwa Sokutei Kk Grinding device for square
JPH0698566B2 (en) * 1988-09-17 1994-12-07 シンワ測定株式会社 Curve measuring machine
EP0724932A1 (en) * 1995-01-20 1996-08-07 Seiko Instruments Inc. A semiconductor substrate, devices having the same and a method of manufacturing the same
WO1998053952A1 (en) * 1997-05-29 1998-12-03 Tucker Thomas N Chemical mechanical planarization tool having a linear polishing roller
WO2001019567A1 (en) * 1999-09-13 2001-03-22 Lam Research Corporation Method and system for chemical mechanical polishing with a cylindrical polishing pad
US6347977B1 (en) 1999-09-13 2002-02-19 Lam Research Corporation Method and system for chemical mechanical polishing
CN108857832A (en) * 2018-05-29 2018-11-23 滁州南钢盛达实业有限公司 A kind of steel plate burnishing device

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