DE60005816T2 - Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtung - Google Patents

Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtung Download PDF

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Publication number
DE60005816T2
DE60005816T2 DE60005816T DE60005816T DE60005816T2 DE 60005816 T2 DE60005816 T2 DE 60005816T2 DE 60005816 T DE60005816 T DE 60005816T DE 60005816 T DE60005816 T DE 60005816T DE 60005816 T2 DE60005816 T2 DE 60005816T2
Authority
DE
Germany
Prior art keywords
polishing pad
groove
polishing
groove pattern
sections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60005816T
Other languages
German (de)
English (en)
Other versions
DE60005816D1 (de
Inventor
J. Alan JENSEN
S. Brian THORNTON
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60005816D1 publication Critical patent/DE60005816D1/de
Publication of DE60005816T2 publication Critical patent/DE60005816T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60005816T 1999-05-21 2000-05-15 Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtung Expired - Fee Related DE60005816T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US316166 1994-09-30
US09/316,166 US6261168B1 (en) 1999-05-21 1999-05-21 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
PCT/US2000/013328 WO2000071297A1 (en) 1999-05-21 2000-05-15 Chemical mechanical planarization or polishing pad with sections having varied groove patterns

Publications (2)

Publication Number Publication Date
DE60005816D1 DE60005816D1 (de) 2003-11-13
DE60005816T2 true DE60005816T2 (de) 2004-05-19

Family

ID=23227799

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60005816T Expired - Fee Related DE60005816T2 (de) 1999-05-21 2000-05-15 Polierkissen mit rillenmuster zur verwendung in einer chemisch-mechanischen poliervorrichtung

Country Status (9)

Country Link
US (3) US6261168B1 (US20040097461A1-20040520-C00002.png)
EP (2) EP1329290A3 (US20040097461A1-20040520-C00002.png)
JP (1) JP2003500843A (US20040097461A1-20040520-C00002.png)
KR (1) KR100706148B1 (US20040097461A1-20040520-C00002.png)
AT (1) ATE251524T1 (US20040097461A1-20040520-C00002.png)
DE (1) DE60005816T2 (US20040097461A1-20040520-C00002.png)
SG (1) SG152899A1 (US20040097461A1-20040520-C00002.png)
TW (1) TW462906B (US20040097461A1-20040520-C00002.png)
WO (1) WO2000071297A1 (US20040097461A1-20040520-C00002.png)

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US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US6585679B1 (en) * 1999-10-21 2003-07-01 Retinalabs.Com System and method for enhancing oxygen content of infusion/irrigation fluid for ophthalmic surgery
US20020068516A1 (en) * 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US6884153B2 (en) * 2000-02-17 2005-04-26 Applied Materials, Inc. Apparatus for electrochemical processing
US7077721B2 (en) * 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US20030213703A1 (en) * 2002-05-16 2003-11-20 Applied Materials, Inc. Method and apparatus for substrate polishing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US6422929B1 (en) * 2000-03-31 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad for a linear polisher and method for forming
US6733373B1 (en) * 2000-03-31 2004-05-11 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing assembly for a linear chemical mechanical polishing apparatus and method for forming
US6500054B1 (en) * 2000-06-08 2002-12-31 International Business Machines Corporation Chemical-mechanical polishing pad conditioner
US6475332B1 (en) * 2000-10-05 2002-11-05 Lam Research Corporation Interlocking chemical mechanical polishing system
US6896776B2 (en) 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
JP2002200555A (ja) * 2000-12-28 2002-07-16 Ebara Corp 研磨工具および該研磨工具を具備したポリッシング装置
US6620031B2 (en) 2001-04-04 2003-09-16 Lam Research Corporation Method for optimizing the planarizing length of a polishing pad
US6857941B2 (en) * 2001-06-01 2005-02-22 Applied Materials, Inc. Multi-phase polishing pad
KR100646702B1 (ko) * 2001-08-16 2006-11-17 에스케이씨 주식회사 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드
KR20030015567A (ko) * 2001-08-16 2003-02-25 에스케이에버텍 주식회사 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드
US6648743B1 (en) * 2001-09-05 2003-11-18 Lsi Logic Corporation Chemical mechanical polishing pad
US7070480B2 (en) 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US20030072639A1 (en) * 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
JP3843933B2 (ja) * 2002-02-07 2006-11-08 ソニー株式会社 研磨パッド、研磨装置および研磨方法
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US20030194959A1 (en) * 2002-04-15 2003-10-16 Cabot Microelectronics Corporation Sintered polishing pad with regions of contrasting density
DE20221899U1 (de) * 2002-05-24 2008-12-11 FIP Forschungsinstitut für Produktionstechnik GmbH Braunschweig Feinschleifmaschine
US8602851B2 (en) * 2003-06-09 2013-12-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled penetration subpad
US6602123B1 (en) * 2002-09-13 2003-08-05 Infineon Technologies Ag Finishing pad design for multidirectional use
JP2005538571A (ja) * 2002-09-25 2005-12-15 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 平坦化するための窓を有する研磨パッド
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
JP2004172296A (ja) * 2002-11-19 2004-06-17 Matsushita Electric Ind Co Ltd 半導体ウェーハの研磨方法及びその研磨パッド
EP1594656B1 (en) * 2003-02-18 2007-09-12 Parker-Hannifin Corporation Polishing article for electro-chemical mechanical polishing
US7121937B2 (en) 2003-03-17 2006-10-17 3M Innovative Properties Company Abrasive brush elements and segments
TWI238100B (en) * 2003-09-29 2005-08-21 Iv Technologies Co Ltd Polishing pad and fabricating method thereof
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
KR100578133B1 (ko) * 2003-11-04 2006-05-10 삼성전자주식회사 화학적 기계적 연마 장치 및 이에 사용되는 연마 패드
JP4641781B2 (ja) * 2003-11-04 2011-03-02 三星電子株式会社 不均一強度を有する研磨面を使用した化学的機械的研磨装置および方法
US7186164B2 (en) * 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7086936B1 (en) * 2003-12-22 2006-08-08 Lam Research Corporation Linear chemical mechanical planarization (CMP) system and method for planarizing a wafer in a single CMP module
US6951510B1 (en) * 2004-03-12 2005-10-04 Agere Systems, Inc. Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
US6935938B1 (en) 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
TWI293266B (en) * 2004-05-05 2008-02-11 Iv Technologies Co Ltd A single-layer polishing pad and a method of producing the same
TWI254354B (en) * 2004-06-29 2006-05-01 Iv Technologies Co Ltd An inlaid polishing pad and a method of producing the same
US20060079159A1 (en) * 2004-10-08 2006-04-13 Markus Naujok Chemical mechanical polish with multi-zone abrasive-containing matrix
US20070197132A1 (en) * 2006-02-15 2007-08-23 Applied Materials, Inc. Dechuck using subpad with recess
TWI321503B (en) 2007-06-15 2010-03-11 Univ Nat Taiwan Science Tech The analytical method of the effective polishing frequency and number of times towards the polishing pads having different grooves and profiles
TWI409868B (zh) * 2008-01-30 2013-09-21 Iv Technologies Co Ltd 研磨方法、研磨墊及研磨系統
US9180570B2 (en) * 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US8360823B2 (en) * 2010-06-15 2013-01-29 3M Innovative Properties Company Splicing technique for fixed abrasives used in chemical mechanical planarization
CN103109355B (zh) * 2010-09-15 2016-07-06 株式会社Lg化学 用于cmp的研磨垫
CN102615571A (zh) * 2011-01-28 2012-08-01 中芯国际集成电路制造(上海)有限公司 抛光装置及方法
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
MX2020009155A (es) * 2018-03-14 2020-12-03 Mirka Ltd Método y aparato para erosionar y los productos y usos de éste.
CN113579990B (zh) * 2021-07-30 2022-07-26 上海积塔半导体有限公司 固定研磨粒抛光装置及抛光方法

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Also Published As

Publication number Publication date
TW462906B (en) 2001-11-11
SG152899A1 (en) 2009-06-29
WO2000071297A1 (en) 2000-11-30
KR100706148B1 (ko) 2007-04-11
EP1178872A1 (en) 2002-02-13
KR20020011417A (ko) 2002-02-08
US6634936B2 (en) 2003-10-21
EP1329290A2 (en) 2003-07-23
JP2003500843A (ja) 2003-01-07
US20020028646A1 (en) 2002-03-07
EP1329290A3 (en) 2003-07-30
DE60005816D1 (de) 2003-11-13
EP1178872B1 (en) 2003-10-08
US6585579B2 (en) 2003-07-01
US20010031615A1 (en) 2001-10-18
ATE251524T1 (de) 2003-10-15
US6261168B1 (en) 2001-07-17

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee