DE60001894T2 - Busschienenverbindungsstruktur - Google Patents

Busschienenverbindungsstruktur Download PDF

Info

Publication number
DE60001894T2
DE60001894T2 DE60001894T DE60001894T DE60001894T2 DE 60001894 T2 DE60001894 T2 DE 60001894T2 DE 60001894 T DE60001894 T DE 60001894T DE 60001894 T DE60001894 T DE 60001894T DE 60001894 T2 DE60001894 T2 DE 60001894T2
Authority
DE
Germany
Prior art keywords
busschienenverbindungsstruktur
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60001894T
Other languages
English (en)
Other versions
DE60001894D1 (de
Inventor
Takahiro Onizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Application granted granted Critical
Publication of DE60001894D1 publication Critical patent/DE60001894D1/de
Publication of DE60001894T2 publication Critical patent/DE60001894T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/22—Bases, e.g. strip, block, panel
    • H01R9/24—Terminal blocks
    • H01R9/2458—Electrical interconnections between terminal blocks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
DE60001894T 1999-10-29 2000-09-14 Busschienenverbindungsstruktur Expired - Fee Related DE60001894T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30971499A JP3694200B2 (ja) 1999-10-29 1999-10-29 バスバーの接続構造

Publications (2)

Publication Number Publication Date
DE60001894D1 DE60001894D1 (de) 2003-05-08
DE60001894T2 true DE60001894T2 (de) 2004-01-29

Family

ID=17996419

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60001894T Expired - Fee Related DE60001894T2 (de) 1999-10-29 2000-09-14 Busschienenverbindungsstruktur

Country Status (4)

Country Link
US (1) US6390830B1 (de)
EP (1) EP1096607B1 (de)
JP (1) JP3694200B2 (de)
DE (1) DE60001894T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4001788B2 (ja) * 2002-07-03 2007-10-31 矢崎総業株式会社 回路体アセンブリ及び電気接続箱
JP2004104946A (ja) * 2002-09-11 2004-04-02 Sumitomo Wiring Syst Ltd バスバー
DE10259634B4 (de) * 2002-12-18 2008-02-21 Qimonda Ag Verfahren zur Herstellung von Kontakten auf einem Wafer
DE102004020832A1 (de) * 2004-04-28 2005-11-24 Behr Gmbh & Co. Kg Vorrichtung zum Anschluss eines elektrischen Antriebs an mindestens ein Leitungsnetz und Verfahren zur Herstellung einer derartigen Anschlussvorrichtung
JP5044259B2 (ja) * 2007-04-03 2012-10-10 株式会社オートネットワーク技術研究所 回路構成体
WO2009037747A1 (ja) * 2007-09-19 2009-03-26 Iriso Electronics Co., Ltd. レーザー溶接方法
DE102008001915A1 (de) * 2008-05-21 2009-11-26 Robert Bosch Gmbh Stelleinheit
JP2016025229A (ja) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 回路構成体
JP6635294B2 (ja) * 2015-12-15 2020-01-22 株式会社オートネットワーク技術研究所 バスバー及び蓄電モジュール
US9905953B1 (en) 2016-09-30 2018-02-27 Slobodan Pavlovic High power spring-actuated electrical connector
GB2562770A (en) * 2017-05-25 2018-11-28 Jaguar Land Rover Ltd An electrical circuit
DE112018006954T5 (de) 2018-02-26 2020-11-26 Inventive Consulting Llc Federbetätigter elektrischer Steckverbinder für Hochleistungsanwendungen
CN112956084B (zh) 2018-06-07 2023-10-03 皇家精密制品有限责任公司 具有内部弹簧部件的电连接器组件
DE112020000459T5 (de) 2019-01-21 2021-11-25 Royal Precision Products, Llc Stromverteilungsanordnung mit schraubenlosem sammelschienensystem
DE112020003846T5 (de) 2019-09-09 2022-05-12 Royal Precision Products Llc Verbinderaufzeichnungssystem mit lesbaren und aufzeichenbarenkennzeichnungen
US11721942B2 (en) 2019-09-09 2023-08-08 Eaton Intelligent Power Limited Connector system for a component in a power management system in a motor vehicle
US11488742B2 (en) 2019-09-09 2022-11-01 Eaton Intelligent Power Limited Electrical busbar and method of fabricating the same
JP2023536817A (ja) 2020-07-29 2023-08-30 イートン インテリジェント パワー リミテッド 円筒形端子本体を有する電気コネクタシステム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2977672A (en) 1958-12-12 1961-04-04 Gen Electric Method of making bonded wire circuit
SE458248B (sv) 1987-06-30 1989-03-06 Svensson Lars Goeran Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid tillverkning av moensterkort
DE69812774T2 (de) 1997-05-28 2003-10-16 Autonetworks Technologies Ltd Sammelschienenstruktur
JPH11180649A (ja) 1997-12-25 1999-07-06 Tenryu Technics:Kk テーピング部材用カバーテープ巻取装置およびその方法
US6008982A (en) * 1998-05-20 1999-12-28 General Motors Corporation Low profile electrical distribution center and method of making a bus subassembly therefor
EP1018783B1 (de) * 1999-01-04 2003-06-18 Sumitomo Wiring Systems, Ltd. Elektrische Anschlussdose mit einer Sammelschiene

Also Published As

Publication number Publication date
JP3694200B2 (ja) 2005-09-14
US6390830B1 (en) 2002-05-21
EP1096607B1 (de) 2003-04-02
JP2001135373A (ja) 2001-05-18
DE60001894D1 (de) 2003-05-08
EP1096607A1 (de) 2001-05-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee