DE60001894D1 - Busschienenverbindungsstruktur - Google Patents
BusschienenverbindungsstrukturInfo
- Publication number
- DE60001894D1 DE60001894D1 DE60001894T DE60001894T DE60001894D1 DE 60001894 D1 DE60001894 D1 DE 60001894D1 DE 60001894 T DE60001894 T DE 60001894T DE 60001894 T DE60001894 T DE 60001894T DE 60001894 D1 DE60001894 D1 DE 60001894D1
- Authority
- DE
- Germany
- Prior art keywords
- busschienenverbindungsstruktur
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0221—Laser welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/22—Bases, e.g. strip, block, panel
- H01R9/24—Terminal blocks
- H01R9/2458—Electrical interconnections between terminal blocks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Connection Or Junction Boxes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30971499A JP3694200B2 (ja) | 1999-10-29 | 1999-10-29 | バスバーの接続構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60001894D1 true DE60001894D1 (de) | 2003-05-08 |
DE60001894T2 DE60001894T2 (de) | 2004-01-29 |
Family
ID=17996419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60001894T Expired - Fee Related DE60001894T2 (de) | 1999-10-29 | 2000-09-14 | Busschienenverbindungsstruktur |
Country Status (4)
Country | Link |
---|---|
US (1) | US6390830B1 (de) |
EP (1) | EP1096607B1 (de) |
JP (1) | JP3694200B2 (de) |
DE (1) | DE60001894T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4001788B2 (ja) * | 2002-07-03 | 2007-10-31 | 矢崎総業株式会社 | 回路体アセンブリ及び電気接続箱 |
JP2004104946A (ja) * | 2002-09-11 | 2004-04-02 | Sumitomo Wiring Syst Ltd | バスバー |
DE10259634B4 (de) * | 2002-12-18 | 2008-02-21 | Qimonda Ag | Verfahren zur Herstellung von Kontakten auf einem Wafer |
DE102004020832A1 (de) * | 2004-04-28 | 2005-11-24 | Behr Gmbh & Co. Kg | Vorrichtung zum Anschluss eines elektrischen Antriebs an mindestens ein Leitungsnetz und Verfahren zur Herstellung einer derartigen Anschlussvorrichtung |
JP5044259B2 (ja) * | 2007-04-03 | 2012-10-10 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
WO2009037747A1 (ja) * | 2007-09-19 | 2009-03-26 | Iriso Electronics Co., Ltd. | レーザー溶接方法 |
DE102008001915A1 (de) * | 2008-05-21 | 2009-11-26 | Robert Bosch Gmbh | Stelleinheit |
JP2016025229A (ja) * | 2014-07-22 | 2016-02-08 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP6635294B2 (ja) * | 2015-12-15 | 2020-01-22 | 株式会社オートネットワーク技術研究所 | バスバー及び蓄電モジュール |
US9905953B1 (en) | 2016-09-30 | 2018-02-27 | Slobodan Pavlovic | High power spring-actuated electrical connector |
GB2562770A (en) * | 2017-05-25 | 2018-11-28 | Jaguar Land Rover Ltd | An electrical circuit |
CH716093B1 (de) | 2018-02-26 | 2023-12-29 | Royal Prec Products Llc | Federbetätigter elektrischer Steckverbinder für Hochleistungsanwendungen. |
CN112956085B (zh) | 2018-06-07 | 2023-09-15 | 皇家精密制品有限责任公司 | 具有内部弹簧部件的电连接器系统及其应用 |
WO2020154330A1 (en) | 2019-01-21 | 2020-07-30 | Royal Precision Products, Llc | Power distribution assembly with boltless busbar system |
US11721942B2 (en) | 2019-09-09 | 2023-08-08 | Eaton Intelligent Power Limited | Connector system for a component in a power management system in a motor vehicle |
CN114787815A (zh) | 2019-09-09 | 2022-07-22 | 伊顿智能动力有限公司 | 具有可读和可记录标记的连接器记录系统 |
WO2021050609A1 (en) * | 2019-09-09 | 2021-03-18 | Royal Precision Products Llc | Electrical busbar and method of fabricating the same |
CN116210128A (zh) | 2020-07-29 | 2023-06-02 | 伊顿智能动力有限公司 | 包括联锁系统的连接器系统 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2977672A (en) | 1958-12-12 | 1961-04-04 | Gen Electric | Method of making bonded wire circuit |
SE458248B (sv) | 1987-06-30 | 1989-03-06 | Svensson Lars Goeran | Saett foer tillverkning av ett moensterkort samt anordning foer anvaendning vid tillverkning av moensterkort |
EP0887884B1 (de) | 1997-05-28 | 2003-04-02 | Autonetworks Technologies, Ltd. | Sammelschienenstruktur |
JPH11180649A (ja) | 1997-12-25 | 1999-07-06 | Tenryu Technics:Kk | テーピング部材用カバーテープ巻取装置およびその方法 |
US6008982A (en) * | 1998-05-20 | 1999-12-28 | General Motors Corporation | Low profile electrical distribution center and method of making a bus subassembly therefor |
DE69908896T2 (de) * | 1999-01-04 | 2004-05-19 | Sumitomo Wiring Systems, Ltd., Yokkaichi | Elektrische Anschlussdose mit einer Sammelschiene |
-
1999
- 1999-10-29 JP JP30971499A patent/JP3694200B2/ja not_active Expired - Fee Related
-
2000
- 2000-09-12 US US09/660,401 patent/US6390830B1/en not_active Expired - Fee Related
- 2000-09-14 DE DE60001894T patent/DE60001894T2/de not_active Expired - Fee Related
- 2000-09-14 EP EP00120021A patent/EP1096607B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60001894T2 (de) | 2004-01-29 |
JP3694200B2 (ja) | 2005-09-14 |
US6390830B1 (en) | 2002-05-21 |
JP2001135373A (ja) | 2001-05-18 |
EP1096607A1 (de) | 2001-05-02 |
EP1096607B1 (de) | 2003-04-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |