WO2009037747A1 - レーザー溶接方法 - Google Patents

レーザー溶接方法 Download PDF

Info

Publication number
WO2009037747A1
WO2009037747A1 PCT/JP2007/068161 JP2007068161W WO2009037747A1 WO 2009037747 A1 WO2009037747 A1 WO 2009037747A1 JP 2007068161 W JP2007068161 W JP 2007068161W WO 2009037747 A1 WO2009037747 A1 WO 2009037747A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
conductive section
welding
substrate
absorption rate
Prior art date
Application number
PCT/JP2007/068161
Other languages
English (en)
French (fr)
Inventor
Yujiro Sugaya
Tomomitsu Saito
Original Assignee
Iriso Electronics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iriso Electronics Co., Ltd. filed Critical Iriso Electronics Co., Ltd.
Priority to PCT/JP2007/068161 priority Critical patent/WO2009037747A1/ja
Publication of WO2009037747A1 publication Critical patent/WO2009037747A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/244—Overlap seam welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys

Abstract

金属薄板からなる第２導電部４３に、レーザー光の吸収率の高い有機物からなる厚さ０．１ｍｍ以下の基板４１（薄膜）を介してレーザー光を入射することにより、第２導電部４３を端子２０に溶接する。基板４１によってレーザー光の吸収率が高まり、例えば波長１０６４ｎｍのＹＡＧレーザーを用いた場合でも、レーザーの出力を大きくせずに確実に溶接することができる。これにより、第２導電部４３のように幅の小さい金属薄板であっても破断させることなく溶接することが可能になり、各端子２０が高密度に配列された小型コネクタ用の過電圧保護装置４０をコネクタに取付ける場合に極めて有利である。
PCT/JP2007/068161 2007-09-19 2007-09-19 レーザー溶接方法 WO2009037747A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/068161 WO2009037747A1 (ja) 2007-09-19 2007-09-19 レーザー溶接方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/068161 WO2009037747A1 (ja) 2007-09-19 2007-09-19 レーザー溶接方法

Publications (1)

Publication Number Publication Date
WO2009037747A1 true WO2009037747A1 (ja) 2009-03-26

Family

ID=40467579

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/068161 WO2009037747A1 (ja) 2007-09-19 2007-09-19 レーザー溶接方法

Country Status (1)

Country Link
WO (1) WO2009037747A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010272488A (ja) * 2009-05-25 2010-12-02 Littelfuse Inc 小型コネクタに静電気保護部を組み込むこと
JP2012004281A (ja) * 2010-06-16 2012-01-05 Toppan Printing Co Ltd レーザ溶接方法、電子部品接続構造及びレーザ溶接検査方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60152390A (ja) * 1984-01-20 1985-08-10 Fuji Electric Corp Res & Dev Ltd レ−ザによる銅合金の溶接方法
JPH11185918A (ja) * 1997-12-24 1999-07-09 Harness Syst Tech Res Ltd 平形ケーブルの接続構造
JP2001087877A (ja) * 1999-09-20 2001-04-03 Sony Corp レーザ溶接方法
JP2001135373A (ja) * 1999-10-29 2001-05-18 Auto Network Gijutsu Kenkyusho:Kk バスバーの接続構造
JP2001203015A (ja) * 1999-09-09 2001-07-27 Molex Inc 平型柔軟ケーブル用電気コネクタ
JP2007222907A (ja) * 2006-02-23 2007-09-06 Denso Corp 配線部材のレーザー照射式半田接合方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60152390A (ja) * 1984-01-20 1985-08-10 Fuji Electric Corp Res & Dev Ltd レ−ザによる銅合金の溶接方法
JPH11185918A (ja) * 1997-12-24 1999-07-09 Harness Syst Tech Res Ltd 平形ケーブルの接続構造
JP2001203015A (ja) * 1999-09-09 2001-07-27 Molex Inc 平型柔軟ケーブル用電気コネクタ
JP2001087877A (ja) * 1999-09-20 2001-04-03 Sony Corp レーザ溶接方法
JP2001135373A (ja) * 1999-10-29 2001-05-18 Auto Network Gijutsu Kenkyusho:Kk バスバーの接続構造
JP2007222907A (ja) * 2006-02-23 2007-09-06 Denso Corp 配線部材のレーザー照射式半田接合方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010272488A (ja) * 2009-05-25 2010-12-02 Littelfuse Inc 小型コネクタに静電気保護部を組み込むこと
JP2012004281A (ja) * 2010-06-16 2012-01-05 Toppan Printing Co Ltd レーザ溶接方法、電子部品接続構造及びレーザ溶接検査方法

Similar Documents

Publication Publication Date Title
AU2010235991B2 (en) Method and apparatus for the selective separation of two layers of material using an ultrashort pulse source or electromagnetic radiation
US20130176699A1 (en) Method and apparatus for deposition
TW200717661A (en) Method and apparatus for laser annealing
WO2009090098A3 (de) Verfahren und vorrichtung zur herstellung einer solarzelle
MY126842A (en) Copper foil excellent in laser beam drilling performance and production method therefor
WO2006087653A3 (en) An oled device
TW200637049A (en) Method of manufacturing array substrate and method of manufacturing organic EL display device
IE20000618A1 (en) A circuit singulation system and method
DK1989740T3 (da) Fremgangsmåde til solcellemarkering og solcelle
WO2010077368A3 (en) Electrochromic device and method for making electrochromic device
ATE477597T1 (de) Organische photovoltaische vorrichtung mit verkapselung
WO2007092716A3 (en) Laser-based method and system for processing a multi-material device having conductive links structures
WO2007092803A3 (en) Laser-based removal of target link structures
EP2430658A2 (de) Verfahren und vorrichtung zur herstellung eines photovoltaischen dünnschichtmoduls
EP2172978A3 (en) Structure of solar cell panel and manufacturing method of electrode of solar cell panel
Heo et al. Laser micromachining of permalloy for fine metal mask
WO2005097501A3 (en) System for and method of manufacturing gravure printing plates
Wang et al. Parameter optimization in femtosecond pulsed laser etching of fluorine-doped tin oxide films
TW200717819A (en) Manufacturing liquid crystal display substrates
WO2009037747A1 (ja) レーザー溶接方法
WO2006036203A3 (en) Polyphosphazenes including ionic or ionizable moieties and fluorine-containing moieties
TWI257137B (en) Contactor having contact electrodes formed by laser processing
WO2013139470A3 (de) Substrat für einen portablen datenträger
TW200709235A (en) Method of forming passive electronic components on a substrate by direct write technique using shaped uniform laser beam
US20100084002A1 (en) Method for manufacturing a solderable lfc solar cell rear side and a solar module from such connected lfc solar cells

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07828256

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: JP

122 Ep: pct application non-entry in european phase

Ref document number: 07828256

Country of ref document: EP

Kind code of ref document: A1