DE59814177D1 - Sensorsystem und Herstellungsverfahren sowie Selbsttestverfahren - Google Patents

Sensorsystem und Herstellungsverfahren sowie Selbsttestverfahren

Info

Publication number
DE59814177D1
DE59814177D1 DE59814177T DE59814177T DE59814177D1 DE 59814177 D1 DE59814177 D1 DE 59814177D1 DE 59814177 T DE59814177 T DE 59814177T DE 59814177 T DE59814177 T DE 59814177T DE 59814177 D1 DE59814177 D1 DE 59814177D1
Authority
DE
Germany
Prior art keywords
self
manufacturing
sensor system
test method
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE59814177T
Other languages
English (en)
Inventor
Joerg Dr Ing Schieferdecker
Marion Dr Simon
Karlheinz Dipl-Ing Storck
Manfred Rothley
Erich Zabler
Rolf Jaehne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Robert Bosch GmbH
Excelitas Technologies GmbH and Co KG
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Robert Bosch GmbH
PerkinElmer Optoelectronics GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV, Robert Bosch GmbH, PerkinElmer Optoelectronics GmbH and Co KG filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Application granted granted Critical
Publication of DE59814177D1 publication Critical patent/DE59814177D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/0045—End test of the packaged device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/026—Control of working procedures of a pyrometer, other than calibration; Bandwidth calculation; Gain control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J5/064—Ambient temperature sensor; Housing temperature sensor; Constructional details thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G01J5/22—Electrical features thereof

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
DE59814177T 1997-08-14 1998-08-03 Sensorsystem und Herstellungsverfahren sowie Selbsttestverfahren Expired - Lifetime DE59814177D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19735379A DE19735379B4 (de) 1997-08-14 1997-08-14 Sensorsystem und Herstellungsverfahren

Publications (1)

Publication Number Publication Date
DE59814177D1 true DE59814177D1 (de) 2008-04-10

Family

ID=7839048

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19735379A Expired - Fee Related DE19735379B4 (de) 1997-08-14 1997-08-14 Sensorsystem und Herstellungsverfahren
DE59814177T Expired - Lifetime DE59814177D1 (de) 1997-08-14 1998-08-03 Sensorsystem und Herstellungsverfahren sowie Selbsttestverfahren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19735379A Expired - Fee Related DE19735379B4 (de) 1997-08-14 1997-08-14 Sensorsystem und Herstellungsverfahren

Country Status (6)

Country Link
US (1) US6294787B1 (de)
EP (1) EP0898159B1 (de)
JP (1) JP4380813B2 (de)
KR (1) KR100631449B1 (de)
CN (1) CN1208966A (de)
DE (2) DE19735379B4 (de)

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DE19843984B4 (de) * 1998-09-25 2013-10-24 Robert Bosch Gmbh Verfahren zur Herstellung von Strahlungssensoren
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KR20010092770A (ko) 1999-11-01 2001-10-26 모리시타 요이찌 반도체 장치 및 그 제조방법
DE19962938A1 (de) * 1999-12-24 2001-07-19 Perkinelmer Optoelectronics Verfahren zum Korrigieren des Ausgangssignals eines Infrarotstrahlungsmehrelementsensors, Infrarotstrahlungsmehrelementsensor und Infrarotstrahlungsmehrelementsensorsystem
JPWO2002075262A1 (ja) * 2001-03-16 2004-07-08 セイコーエプソン株式会社 赤外線検出素子およびその製造方法並びに温度測定装置
DE10144343A1 (de) * 2001-09-10 2003-03-27 Perkinelmer Optoelectronics Sensor zum berührugslosen Messen einer Temperatur
US6828172B2 (en) * 2002-02-04 2004-12-07 Delphi Technologies, Inc. Process for a monolithically-integrated micromachined sensor and circuit
JP3684233B2 (ja) * 2002-05-14 2005-08-17 キヤノン株式会社 指紋入力装置及びその製造方法
DE10243014B4 (de) * 2002-09-17 2010-07-01 Robert Bosch Gmbh Vorrichtung zur Detektion und Vorrichtung zur Messung der Konzentration eines Stoffes
DE10243012B4 (de) * 2002-09-17 2006-01-05 Robert Bosch Gmbh Vorrichtung zur Wärmedetektion und Verfahren
US20040187904A1 (en) * 2003-02-05 2004-09-30 General Electric Company Apparatus for infrared radiation detection
JP3944465B2 (ja) * 2003-04-11 2007-07-11 三菱電機株式会社 熱型赤外線検出器及び赤外線フォーカルプレーンアレイ
DE10320357B4 (de) * 2003-05-07 2010-05-12 Perkinelmer Optoelectronics Gmbh & Co.Kg Strahlungssensor, Wafer, Sensorarray und Sensormodul
DE10321639A1 (de) * 2003-05-13 2004-12-02 Heimann Sensor Gmbh Infrarotsensor mit optimierter Flächennutzung
DE10323707A1 (de) * 2003-05-22 2004-12-30 Daimlerchrysler Ag System zur Objekt-Erfassung für Fahrzeuge
WO2005078118A1 (en) 2004-02-06 2005-08-25 Bayer Healthcare Llc Oxidizable species as an internal reference for biosensors and method of use
ATE430244T1 (de) * 2004-07-22 2009-05-15 Bea Sa Thermo-empfindliche vorrichtung zur anwesenheitsbestimmung von automatischen türen
JP5308814B2 (ja) * 2005-05-17 2013-10-09 ハイマン・ゼンゾル・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング サーモパイル赤外線センサアレイ
MX2008000836A (es) 2005-07-20 2008-03-26 Bayer Healthcare Llc Amperimetria regulada.
US7683464B2 (en) * 2005-09-13 2010-03-23 Alpha And Omega Semiconductor Incorporated Semiconductor package having dimpled plate interconnections
US20070057368A1 (en) * 2005-09-13 2007-03-15 Yueh-Se Ho Semiconductor package having plate interconnections
US7622796B2 (en) * 2005-09-13 2009-11-24 Alpha And Omega Semiconductor Limited Semiconductor package having a bridged plate interconnection
EP1934591B1 (de) 2005-09-30 2019-01-02 Ascensia Diabetes Care Holdings AG Gesteuerte voltammetrie
EP3753481B1 (de) 2006-10-24 2024-07-17 Ascensia Diabetes Care Holdings AG Nachwirkungsstrommessungsgerät
DE102007046451B4 (de) * 2007-09-28 2011-08-25 Pyreos Ltd. Vorrichtung zur Detektion von Wärmestrahlung mit hoher Auflösung, Verfahren zum Herstellen und Verwendung der Vorrichtung
WO2009076302A1 (en) 2007-12-10 2009-06-18 Bayer Healthcare Llc Control markers for auto-detection of control solution and methods of use
US8680658B2 (en) * 2008-05-30 2014-03-25 Alpha And Omega Semiconductor Incorporated Conductive clip for semiconductor device package
US8253111B2 (en) * 2009-12-15 2012-08-28 Shimadzu Corporation X-ray diagnostic apparatus
DE102010013661A1 (de) 2010-04-01 2011-10-06 Perkinelmer Technologies Gmbh & Co. Kg Strahlungssensor
DE102010013663A1 (de) 2010-04-01 2011-10-06 Perkinelmer Technologies Gmbh & Co. Kg Strahlungssensor
JP5638871B2 (ja) * 2010-08-18 2014-12-10 江藤電気株式会社 熱流センサ
CN103712737B (zh) * 2012-10-09 2016-03-09 京元电子股份有限公司 用于压力感测器的自我测试结构及其方法
US9219185B2 (en) * 2013-12-19 2015-12-22 Excelitas Technologies Singapore Pte. Ltd CMOS integrated method for the fabrication of thermopile pixel with umbrella absorber on semiconductor substrate
US9373772B2 (en) 2014-01-15 2016-06-21 Excelitas Technologies Singapore Pte. Ltd. CMOS integrated method for the release of thermopile pixel on a substrate by using anisotropic and isotropic etching
US9324760B2 (en) 2014-01-21 2016-04-26 Excelitas Technologies Singapore Pte. Ltd CMOS integrated method for fabrication of thermopile pixel on semiconductor substrate with buried insulation regions
TWI569427B (zh) * 2014-10-22 2017-02-01 精材科技股份有限公司 半導體封裝件及其製法
JP6279011B2 (ja) * 2016-05-13 2018-02-14 三菱電機株式会社 熱型赤外線検出器および熱型赤外線検出器の製造方法
JP6819163B2 (ja) * 2016-09-12 2021-01-27 株式会社デンソーウェーブ 絶縁型信号伝達装置、電子機器
US10914636B2 (en) 2018-03-16 2021-02-09 Ams Sensors Uk Limited Thermopile self-test and/or self-calibration
JP2019168347A (ja) * 2018-03-23 2019-10-03 三菱マテリアル株式会社 赤外線センサ装置
DE102020209534A1 (de) 2020-07-29 2022-02-03 Robert Bosch Gesellschaft mit beschränkter Haftung Temperatursensor für ein chirurgisches Instrument und Verfahren zu seiner Herstellung

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Also Published As

Publication number Publication date
EP0898159B1 (de) 2008-02-27
DE19735379B4 (de) 2008-06-05
CN1208966A (zh) 1999-02-24
KR19990023585A (ko) 1999-03-25
KR100631449B1 (ko) 2006-12-04
DE19735379A1 (de) 1999-02-18
JPH11118596A (ja) 1999-04-30
EP0898159A3 (de) 2000-03-29
US6294787B1 (en) 2001-09-25
EP0898159A2 (de) 1999-02-24
JP4380813B2 (ja) 2009-12-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANG, DE

Owner name: PERKINELMER TECHNOLOGIES GMBH & CO. KG, 65199 , DE

Owner name: ROBERT BOSCH GMBH, 70469 STUTTGART, DE

8327 Change in the person/name/address of the patent owner

Owner name: EXCELITAS TECHNOLOGIES GMBH & CO. KG, 65199 WI, DE

Owner name: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANG, DE

Owner name: ROBERT BOSCH GMBH, 70469 STUTTGART, DE