DE50209370D1 - Elektrisches vielschichtbauelement - Google Patents

Elektrisches vielschichtbauelement

Info

Publication number
DE50209370D1
DE50209370D1 DE50209370T DE50209370T DE50209370D1 DE 50209370 D1 DE50209370 D1 DE 50209370D1 DE 50209370 T DE50209370 T DE 50209370T DE 50209370 T DE50209370 T DE 50209370T DE 50209370 D1 DE50209370 D1 DE 50209370D1
Authority
DE
Germany
Prior art keywords
outer contacts
base body
dielectric layers
multilayer element
electric multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50209370T
Other languages
English (en)
Inventor
Robert Krumphals
Axel Pecina
Guenther Greier
Harald Koeppel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE50209370T priority Critical patent/DE50209370D1/de
Application granted granted Critical
Publication of DE50209370D1 publication Critical patent/DE50209370D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Details Of Resistors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
DE50209370T 2001-09-10 2002-08-12 Elektrisches vielschichtbauelement Expired - Lifetime DE50209370D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50209370T DE50209370D1 (de) 2001-09-10 2002-08-12 Elektrisches vielschichtbauelement

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10144364A DE10144364A1 (de) 2001-09-10 2001-09-10 Elektrisches Vielschichtbauelement
PCT/DE2002/002952 WO2003028045A2 (de) 2001-09-10 2002-08-12 Elektrisches vielschichtbauelement
DE50209370T DE50209370D1 (de) 2001-09-10 2002-08-12 Elektrisches vielschichtbauelement

Publications (1)

Publication Number Publication Date
DE50209370D1 true DE50209370D1 (de) 2007-03-15

Family

ID=7698380

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10144364A Ceased DE10144364A1 (de) 2001-09-10 2001-09-10 Elektrisches Vielschichtbauelement
DE50209370T Expired - Lifetime DE50209370D1 (de) 2001-09-10 2002-08-12 Elektrisches vielschichtbauelement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10144364A Ceased DE10144364A1 (de) 2001-09-10 2001-09-10 Elektrisches Vielschichtbauelement

Country Status (8)

Country Link
US (1) US7012501B2 (de)
EP (1) EP1425762B1 (de)
JP (1) JP4095961B2 (de)
CN (1) CN100490025C (de)
AT (1) ATE352847T1 (de)
DE (2) DE10144364A1 (de)
TW (1) TW569247B (de)
WO (1) WO2003028045A2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10356498A1 (de) * 2003-12-03 2005-07-07 Epcos Ag Elektrisches Bauelement und Schaltungsanordnung
DE102004010001A1 (de) * 2004-03-01 2005-09-22 Epcos Ag Elektrisches Bauelement und schaltungsanordnung mit dem Bauelement
US7763833B2 (en) * 2004-03-12 2010-07-27 Goodrich Corp. Foil heating element for an electrothermal deicer
DE102004037588A1 (de) * 2004-08-03 2006-02-23 Epcos Ag Elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements
JP4715248B2 (ja) * 2005-03-11 2011-07-06 パナソニック株式会社 積層セラミック電子部品
US7923668B2 (en) * 2006-02-24 2011-04-12 Rohr, Inc. Acoustic nacelle inlet lip having composite construction and an integral electric ice protection heater disposed therein
DE102006060634A1 (de) * 2006-12-21 2008-06-26 Robert Bosch Gmbh Verfahren zur Herstellung eines elektrischen Widerstands auf einem Substrat
DE102007046607A1 (de) 2007-09-28 2009-04-02 Epcos Ag Elektrisches Vielschichtbauelement sowie Verfahren zur Herstellung eines elektrischen Vielschichtbauelements
US8264816B2 (en) * 2009-08-24 2012-09-11 Kemet Electronics Corporation Externally fused and resistively loaded safety capacitor
US8844103B2 (en) * 2011-09-01 2014-09-30 Medtronic, Inc. Methods for making feedthrough assemblies including a capacitive filter array
EP2793539A4 (de) * 2011-12-16 2016-03-23 Epcos Ag Mehrschichtiges glaskeramiksubstrat mit eingebettetem widerstand
KR20150069901A (ko) * 2013-12-16 2015-06-24 삼성전기주식회사 칩 저항기
US10842318B2 (en) * 2017-01-06 2020-11-24 Revolution Cooking, Llc Heating element for a cooking appliance
CN107393784A (zh) * 2017-09-07 2017-11-24 上海长园维安电子线路保护有限公司 一种可以耐受高压的自控制型保护器及其制备方法
JP7027176B2 (ja) * 2018-01-22 2022-03-01 ラピスセミコンダクタ株式会社 半導体装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB570026A (en) * 1943-12-14 1945-06-19 Johnson Matthey Co Ltd Improvements in or relating to the manufacture and production of electrical resistors with a low inductance
US3266005A (en) * 1964-04-15 1966-08-09 Western Electric Co Apertured thin-film circuit components
US3846345A (en) * 1969-10-06 1974-11-05 Owens Illinois Inc Electroconductive paste composition and structures formed therefrom
DE3125281A1 (de) * 1981-06-26 1983-01-13 Siemens AG, 1000 Berlin und 8000 München Elektrische bauelementekombination, insbesondere r-c-kombination
DE3336229A1 (de) 1983-10-05 1985-04-25 Resista Fabrik elektrischer Widerstände GmbH, 8300 Landshut Verfahren zur wertjustierung von widerstaenden
US4568908A (en) * 1984-12-24 1986-02-04 General Electric Company Compact resistor assembly
EP0211331A3 (de) * 1985-08-02 1989-10-25 Hitachi, Ltd. Thermischer Druckkopf und Verfahren zu dessen Herstellung
US4811164A (en) * 1988-03-28 1989-03-07 American Telephone And Telegraph Company, At&T Bell Laboratories Monolithic capacitor-varistor
US4870746A (en) * 1988-11-07 1989-10-03 Litton Systems, Inc. Method of making a multilayer printed circuit board having screened-on resistors
JPH02312203A (ja) * 1989-05-26 1990-12-27 Matsushita Electric Ind Co Ltd 厚膜抵抗体のトリミング方法
DE69021689T2 (de) 1989-10-26 1996-04-04 Takeshi Ikeda LC-Störfilter.
JPH0833327B2 (ja) * 1990-06-11 1996-03-29 株式会社村田製作所 温度センサ
JPH05275958A (ja) * 1992-03-25 1993-10-22 Murata Mfg Co Ltd ノイズフィルタ
JP3097332B2 (ja) * 1992-07-21 2000-10-10 株式会社村田製作所 積層型チップバリスタ
US5430429A (en) * 1992-09-29 1995-07-04 Murata Manufacturing Co., Ltd. Ceramic resistor wherein a resistance film is embedded
US5379016A (en) * 1993-06-03 1995-01-03 E. I. Du Pont De Nemours And Company Chip resistor
US5521576A (en) * 1993-10-06 1996-05-28 Collins; Franklyn M. Fine-line thick film resistors and resistor networks and method of making same
JP3138631B2 (ja) * 1996-01-26 2001-02-26 太陽社電気株式会社 チップ抵抗器及びその製造方法
US5815367A (en) 1996-03-11 1998-09-29 Murata Manufacturing Co., Ltd. Layered capacitors having an internal inductor element
DE19612841A1 (de) * 1996-03-30 1997-10-02 Abb Research Ltd Strombegrenzender Widerstand mit PTC-Verhalten
JP3631341B2 (ja) * 1996-10-18 2005-03-23 Ｔｄｋ株式会社 積層型複合機能素子およびその製造方法
GB9623460D0 (en) * 1996-11-09 1997-01-08 Oxley Dev Co Ltd Electronic components incorporating capacitors
JPH1116703A (ja) * 1997-06-20 1999-01-22 Shoei Chem Ind Co 超低抵抗抵抗器
US5889445A (en) * 1997-07-22 1999-03-30 Avx Corporation Multilayer ceramic RC device
US6362723B1 (en) * 1999-11-18 2002-03-26 Murata Manufacturing Co., Ltd. Chip thermistors
DE10108662A1 (de) * 2000-02-23 2001-08-30 Tyco Electronics Amp Gmbh Leiterbahn auf einem Substrat
DE10064447C2 (de) 2000-12-22 2003-01-02 Epcos Ag Elektrisches Vielschichtbauelement und Entstörschaltung mit dem Bauelement
EP1223591A3 (de) * 2001-01-11 2007-06-06 Matsushita Electric Industrial Co., Ltd. Vielschichtelektronikbauteil und Kommunikationsgerät

Also Published As

Publication number Publication date
WO2003028045A3 (de) 2003-12-04
EP1425762B1 (de) 2007-01-24
JP2005504438A (ja) 2005-02-10
JP4095961B2 (ja) 2008-06-04
ATE352847T1 (de) 2007-02-15
EP1425762A2 (de) 2004-06-09
US7012501B2 (en) 2006-03-14
WO2003028045A2 (de) 2003-04-03
US20040239476A1 (en) 2004-12-02
TW569247B (en) 2004-01-01
CN100490025C (zh) 2009-05-20
DE10144364A1 (de) 2003-04-03
CN1554101A (zh) 2004-12-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition