DE4210835C1 - - Google Patents

Info

Publication number
DE4210835C1
DE4210835C1 DE4210835A DE4210835A DE4210835C1 DE 4210835 C1 DE4210835 C1 DE 4210835C1 DE 4210835 A DE4210835 A DE 4210835A DE 4210835 A DE4210835 A DE 4210835A DE 4210835 C1 DE4210835 C1 DE 4210835C1
Authority
DE
Germany
Prior art keywords
cooling
spider
plate
cooling plate
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4210835A
Other languages
German (de)
English (en)
Inventor
Johann Dipl.-Ing. 8000 Muenchen De Bachl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wincor Nixdorf International GmbH
Original Assignee
Siemens Nixdorf Informationssysteme AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Nixdorf Informationssysteme AG filed Critical Siemens Nixdorf Informationssysteme AG
Priority to DE4210835A priority Critical patent/DE4210835C1/de
Priority to EP93104262A priority patent/EP0563679A1/de
Application granted granted Critical
Publication of DE4210835C1 publication Critical patent/DE4210835C1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE4210835A 1992-04-01 1992-04-01 Expired - Fee Related DE4210835C1 (https=)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE4210835A DE4210835C1 (https=) 1992-04-01 1992-04-01
EP93104262A EP0563679A1 (de) 1992-04-01 1993-03-16 Einrichtung zum Kühlen von zu Flachbaugruppen zusammengefassten gehäuselosen integrierten Bausteinen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4210835A DE4210835C1 (https=) 1992-04-01 1992-04-01

Publications (1)

Publication Number Publication Date
DE4210835C1 true DE4210835C1 (https=) 1993-06-17

Family

ID=6455727

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4210835A Expired - Fee Related DE4210835C1 (https=) 1992-04-01 1992-04-01

Country Status (2)

Country Link
EP (1) EP0563679A1 (https=)
DE (1) DE4210835C1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10227008B4 (de) 2002-06-18 2012-10-18 Robert Bosch Gmbh Kühlvorrichtung für Halbleitermodule und Elektronikanordnung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5772357A (en) * 1980-10-24 1982-05-06 Nec Corp Mounting method of integrated circuit
EP0241290A1 (en) * 1986-04-09 1987-10-14 Nec Corporation Cooling system for electronic components
EP0103068B1 (de) * 1982-09-09 1989-01-04 Siemens Aktiengesellschaft Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen
WO1989008327A1 (en) * 1988-03-01 1989-09-08 Digital Equipment Corporation Method and apparatus for packaging and cooling integrated circuit chips
US4884630A (en) * 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758926A (en) * 1986-03-31 1988-07-19 Microelectronics And Computer Technology Corporation Fluid-cooled integrated circuit package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5772357A (en) * 1980-10-24 1982-05-06 Nec Corp Mounting method of integrated circuit
EP0103068B1 (de) * 1982-09-09 1989-01-04 Siemens Aktiengesellschaft Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen
EP0241290A1 (en) * 1986-04-09 1987-10-14 Nec Corporation Cooling system for electronic components
WO1989008327A1 (en) * 1988-03-01 1989-09-08 Digital Equipment Corporation Method and apparatus for packaging and cooling integrated circuit chips
US4884630A (en) * 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Patents Abstracts of Japan, E-124 & JP-A-57 072 357 *

Also Published As

Publication number Publication date
EP0563679A1 (de) 1993-10-06

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Legal Events

Date Code Title Description
8100 Publication of patent without earlier publication of application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee