DE4200149A1 - Vorrichtung und verfahren zur beschichtung von leiterplatten mit loesungsmittelfreien lackschichten - Google Patents

Vorrichtung und verfahren zur beschichtung von leiterplatten mit loesungsmittelfreien lackschichten

Info

Publication number
DE4200149A1
DE4200149A1 DE19924200149 DE4200149A DE4200149A1 DE 4200149 A1 DE4200149 A1 DE 4200149A1 DE 19924200149 DE19924200149 DE 19924200149 DE 4200149 A DE4200149 A DE 4200149A DE 4200149 A1 DE4200149 A1 DE 4200149A1
Authority
DE
Germany
Prior art keywords
varnish
circuit boards
paint
curtain
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19924200149
Other languages
German (de)
English (en)
Inventor
Hans-Juergen Dipl Ing Schaefer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19924200149 priority Critical patent/DE4200149A1/de
Priority to JP5506428A priority patent/JPH07502603A/ja
Priority to US08/030,217 priority patent/US5336529A/en
Priority to DE59300265T priority patent/DE59300265D1/de
Priority to EP93901735A priority patent/EP0620930B1/de
Priority to AT93901735T priority patent/ATE123884T1/de
Priority to PCT/EP1993/000004 priority patent/WO1993014444A1/de
Priority to TW082100095A priority patent/TW215452B/zh
Publication of DE4200149A1 publication Critical patent/DE4200149A1/de
Priority to US08/204,648 priority patent/US5421884A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/007—Slide-hopper coaters, i.e. apparatus in which the liquid or other fluent material flows freely on an inclined surface before contacting the work
    • B05C5/008—Slide-hopper curtain coaters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
DE19924200149 1992-01-07 1992-01-07 Vorrichtung und verfahren zur beschichtung von leiterplatten mit loesungsmittelfreien lackschichten Withdrawn DE4200149A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE19924200149 DE4200149A1 (de) 1992-01-07 1992-01-07 Vorrichtung und verfahren zur beschichtung von leiterplatten mit loesungsmittelfreien lackschichten
JP5506428A JPH07502603A (ja) 1992-01-07 1993-01-04 プリント配線基板を被覆する方法及び装置
US08/030,217 US5336529A (en) 1992-01-07 1993-01-04 Method for coating circuitboards
DE59300265T DE59300265D1 (de) 1992-01-07 1993-01-04 Verfahren und vorrichtung zur beschichtung von leiterplatten.
EP93901735A EP0620930B1 (de) 1992-01-07 1993-01-04 Verfahren und vorrichtung zur beschichtung von leiterplatten
AT93901735T ATE123884T1 (de) 1992-01-07 1993-01-04 Verfahren und vorrichtung zur beschichtung von leiterplatten.
PCT/EP1993/000004 WO1993014444A1 (de) 1992-01-07 1993-01-04 Verfahren und vorrichtung zur beschichtung von leiterplatten
TW082100095A TW215452B (zh) 1992-01-07 1993-01-07
US08/204,648 US5421884A (en) 1992-01-07 1994-03-01 Apparatus for coating circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19924200149 DE4200149A1 (de) 1992-01-07 1992-01-07 Vorrichtung und verfahren zur beschichtung von leiterplatten mit loesungsmittelfreien lackschichten

Publications (1)

Publication Number Publication Date
DE4200149A1 true DE4200149A1 (de) 1993-07-08

Family

ID=6449139

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19924200149 Withdrawn DE4200149A1 (de) 1992-01-07 1992-01-07 Vorrichtung und verfahren zur beschichtung von leiterplatten mit loesungsmittelfreien lackschichten

Country Status (2)

Country Link
DE (1) DE4200149A1 (zh)
TW (1) TW215452B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017118243B3 (de) 2017-08-10 2018-10-11 Thyssenkrupp Ag Bandbeschichtungsanlage und Verfahren zum Beschichten eines bandförmigen Metallbands mit einer Bandbeschichtungsanlage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017118243B3 (de) 2017-08-10 2018-10-11 Thyssenkrupp Ag Bandbeschichtungsanlage und Verfahren zum Beschichten eines bandförmigen Metallbands mit einer Bandbeschichtungsanlage

Also Published As

Publication number Publication date
TW215452B (zh) 1993-11-01

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Legal Events

Date Code Title Description
8122 Nonbinding interest in granting licenses declared
8139 Disposal/non-payment of the annual fee