DE4121710A1 - Verfahren und vorrichtung zur fehlerlokalisierung bei korrekturzuloetenden baugruppen - Google Patents
Verfahren und vorrichtung zur fehlerlokalisierung bei korrekturzuloetenden baugruppenInfo
- Publication number
- DE4121710A1 DE4121710A1 DE4121710A DE4121710A DE4121710A1 DE 4121710 A1 DE4121710 A1 DE 4121710A1 DE 4121710 A DE4121710 A DE 4121710A DE 4121710 A DE4121710 A DE 4121710A DE 4121710 A1 DE4121710 A1 DE 4121710A1
- Authority
- DE
- Germany
- Prior art keywords
- soldering
- signals
- assembly
- sensor
- triggered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 69
- 238000012937 correction Methods 0.000 title claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title abstract description 28
- 229910052742 iron Inorganic materials 0.000 title abstract description 12
- 238000012544 monitoring process Methods 0.000 title description 3
- 239000000523 sample Substances 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims description 11
- 230000004807 localization Effects 0.000 claims description 8
- 230000001960 triggered effect Effects 0.000 claims description 8
- 230000011514 reflex Effects 0.000 claims description 6
- 238000013459 approach Methods 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- 230000005693 optoelectronics Effects 0.000 abstract 1
- 238000011156 evaluation Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- 238000010972 statistical evaluation Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
- H05K13/0491—Hand tools therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Operations Research (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4121710A DE4121710A1 (de) | 1991-07-01 | 1991-07-01 | Verfahren und vorrichtung zur fehlerlokalisierung bei korrekturzuloetenden baugruppen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4121710A DE4121710A1 (de) | 1991-07-01 | 1991-07-01 | Verfahren und vorrichtung zur fehlerlokalisierung bei korrekturzuloetenden baugruppen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE4121710A1 true DE4121710A1 (de) | 1993-01-14 |
| DE4121710C2 DE4121710C2 (enrdf_load_html_response) | 1993-08-26 |
Family
ID=6435149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE4121710A Granted DE4121710A1 (de) | 1991-07-01 | 1991-07-01 | Verfahren und vorrichtung zur fehlerlokalisierung bei korrekturzuloetenden baugruppen |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE4121710A1 (enrdf_load_html_response) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353578A (zh) * | 2013-07-30 | 2013-10-16 | 青岛海信宽带多媒体技术有限公司 | 一种电路板器件故障检测方法 |
| US10646945B2 (en) * | 2017-01-17 | 2020-05-12 | Hakko Corporation | Soldering apparatus and method |
| CN113977332A (zh) * | 2021-12-02 | 2022-01-28 | 上海维宏智能技术有限公司 | 基于电容传感器实现障碍物检测并主动避障控制的方法、装置、处理器及其存储介质 |
| CN114473277A (zh) * | 2022-01-26 | 2022-05-13 | 浙江大学台州研究院 | 一种用于取线和焊接的高精度定位装置以及方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3728818A1 (de) * | 1987-08-28 | 1989-03-16 | Muet Gmbh | Anordnung zum ermitteln und beseitigen von fertigungsfehlern einer elektrischen baugruppe |
-
1991
- 1991-07-01 DE DE4121710A patent/DE4121710A1/de active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3728818A1 (de) * | 1987-08-28 | 1989-03-16 | Muet Gmbh | Anordnung zum ermitteln und beseitigen von fertigungsfehlern einer elektrischen baugruppe |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353578A (zh) * | 2013-07-30 | 2013-10-16 | 青岛海信宽带多媒体技术有限公司 | 一种电路板器件故障检测方法 |
| CN103353578B (zh) * | 2013-07-30 | 2015-12-02 | 青岛海信宽带多媒体技术有限公司 | 一种电路板器件故障检测方法 |
| US10646945B2 (en) * | 2017-01-17 | 2020-05-12 | Hakko Corporation | Soldering apparatus and method |
| CN113977332A (zh) * | 2021-12-02 | 2022-01-28 | 上海维宏智能技术有限公司 | 基于电容传感器实现障碍物检测并主动避障控制的方法、装置、处理器及其存储介质 |
| CN114473277A (zh) * | 2022-01-26 | 2022-05-13 | 浙江大学台州研究院 | 一种用于取线和焊接的高精度定位装置以及方法 |
| CN114473277B (zh) * | 2022-01-26 | 2024-04-05 | 浙江大学台州研究院 | 一种用于取线和焊接的高精度定位装置以及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4121710C2 (enrdf_load_html_response) | 1993-08-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3618570C2 (de) | Verfahren und Vorrichtung zur Erfassung und Korrektur von Fehlern bei der Bestückung von Leiterplatten mit elektronischen Bauteilen | |
| EP1701801B1 (de) | Verfahren zum erkennen einer auf einem substrat aufzubringenden struktur mit mehreren kameras sowie eine vorrichtung hierfür | |
| DE69926659T2 (de) | Verfahren und vorrichtung für die optische Inspektion von Objekten auf einem Substrat | |
| DE4014661C2 (de) | Optische Kontrolle von Stricknadeln an Strickautomaten | |
| DE4129126C2 (enrdf_load_html_response) | ||
| DE69735943T2 (de) | Methode zum anordnen von bauteilen auf einem träger mit kalibrierungsverfahren und vorrichtung dafür | |
| DE2300436A1 (de) | Ueberpruefungs- und ueberwachungssystem fuer aus vielen elementen bestehende einrichtungen | |
| DE3703422A1 (de) | Optoelektronischer abstandssensor | |
| DE69400528T2 (de) | Aeusserliche bild-pruefungsvorrichtung fuer gerdruckte schaltung | |
| DE102008048723A1 (de) | Bauelement-Montagevorrichtung, Warnungsausgabevorrichtung und Warnungsausgabeverfahren | |
| DE2830846A1 (de) | Vorrichtung zum ermitteln von fehlern in flaechenhaften mustern, insbesondere in photomasken | |
| EP2199999A1 (de) | Verfahren zum Testen eines optischen Sensors und testbarer optischer Sensor | |
| DE10335094A1 (de) | Ein Verfahren zum Erfassen von fehlenden Komponenten bei einem Elektrisch-Platine-Test unter Verwendung von optoelektronischen halterungsbefestigten Sensoren | |
| DE112007000959T5 (de) | Verfahren und System zum Detektieren der Position einer Kante einer Bahn | |
| DE102021101231A1 (de) | Markierungssystem, diagnoseungterstützungsvorrichtung, diagnoseunterstützungsverfahren, diagnoseunterstützungsprogramm und speichermedium | |
| DE4121710C2 (enrdf_load_html_response) | ||
| EP0340343B1 (de) | Drahtloses Fernsteuersystem elektronischer Geräte | |
| DE3342522C2 (enrdf_load_html_response) | ||
| DE3637689C1 (de) | Faseroptische Messwerterfassungs- und Uebertragungseinrichtung | |
| DE3779494T2 (de) | Geraet zur detektierung mittels ultraschallwellen. | |
| DE60225225T2 (de) | Vorrichtung und Verfahren zur Überwachung einer Papierbahn oder dergleichen | |
| DE69705918T2 (de) | Fehlerdiagnosevorrichtung | |
| DE102018113362B4 (de) | Sensorsystem mit optoelektronischen Distanzsensormodulen | |
| DE69412388T2 (de) | Speicherleuchtschirmleser mit Nachweis der Fehlfunktion von Löschlampen | |
| WO2010015313A1 (de) | Verfahren und vorrichtung zur bearbeitung von wertdokumenten |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8122 | Nonbinding interest in granting licences declared | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |