DE4107658A1 - Montageverfahren fuer mikromechanische sensoren - Google Patents

Montageverfahren fuer mikromechanische sensoren

Info

Publication number
DE4107658A1
DE4107658A1 DE4107658A DE4107658A DE4107658A1 DE 4107658 A1 DE4107658 A1 DE 4107658A1 DE 4107658 A DE4107658 A DE 4107658A DE 4107658 A DE4107658 A DE 4107658A DE 4107658 A1 DE4107658 A1 DE 4107658A1
Authority
DE
Germany
Prior art keywords
carrier
sensor element
silicon
mounting base
silicon sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE4107658A
Other languages
German (de)
English (en)
Other versions
DE4107658C2 (enExample
Inventor
Jiri Dr Ing Marek
Kurt Ing Grad Weiblen
Martin Dr Ing Willmann
Klaus Dipl Ing Jaeckel
Frank Dipl Phys Dr Bantien
Helmut Dipl Phys Dr Baumann
Rolf Dr Ing Becker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE4107658A priority Critical patent/DE4107658A1/de
Priority to US07/828,106 priority patent/US5273939A/en
Priority to GB9203292A priority patent/GB2253739B/en
Priority to JP4050357A priority patent/JPH0575176A/ja
Publication of DE4107658A1 publication Critical patent/DE4107658A1/de
Application granted granted Critical
Publication of DE4107658C2 publication Critical patent/DE4107658C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)
DE4107658A 1991-03-09 1991-03-09 Montageverfahren fuer mikromechanische sensoren Granted DE4107658A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE4107658A DE4107658A1 (de) 1991-03-09 1991-03-09 Montageverfahren fuer mikromechanische sensoren
US07/828,106 US5273939A (en) 1991-03-09 1992-01-30 Method of assembling micromechanical sensors
GB9203292A GB2253739B (en) 1991-03-09 1992-02-17 Mircomechanical sensors
JP4050357A JPH0575176A (ja) 1991-03-09 1992-03-09 マイクロメカニツクセンサの組立て法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4107658A DE4107658A1 (de) 1991-03-09 1991-03-09 Montageverfahren fuer mikromechanische sensoren

Publications (2)

Publication Number Publication Date
DE4107658A1 true DE4107658A1 (de) 1992-09-17
DE4107658C2 DE4107658C2 (enExample) 1993-09-02

Family

ID=6426916

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4107658A Granted DE4107658A1 (de) 1991-03-09 1991-03-09 Montageverfahren fuer mikromechanische sensoren

Country Status (4)

Country Link
US (1) US5273939A (enExample)
JP (1) JPH0575176A (enExample)
DE (1) DE4107658A1 (enExample)
GB (1) GB2253739B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19800574B4 (de) * 1998-01-09 2013-11-14 Robert Bosch Gmbh Mikromechanisches Bauelement
DE102012215742A1 (de) * 2012-09-05 2014-03-06 Bundesdruckerei Gmbh Sicherheits- und/oder Wertprodukt
EP3156361A1 (fr) * 2015-10-16 2017-04-19 Thales Microsystème électromécanique et procédé de fabrication

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US6002252A (en) * 1991-05-22 1999-12-14 Wolff Controls Corporation Compact sensing apparatus having transducer and signal conditioner with a plurality of mounting pins
JP2533272B2 (ja) * 1992-11-17 1996-09-11 住友電気工業株式会社 半導体デバイスの製造方法
FR2686191B1 (fr) * 1993-02-23 1994-10-28 Sextant Avionique Montage de micro-capteur.
DE9314084U1 (de) * 1993-09-17 1994-01-05 Mannesmann Kienzle Gmbh, 78052 Villingen-Schwenningen Anordnung zum Befestigen eines mikromechanischen Sensors auf einem Träger durch Kleben
DE4342890A1 (de) * 1993-12-16 1995-06-22 Mannesmann Kienzle Gmbh Verfahren zum Abdichten herstellprozeßbedingter Öffnungen an mikromechanischen Beschleunigungssensoren
US5520054A (en) * 1994-03-29 1996-05-28 Rosemount Inc. Increased wall thickness for robust bond for micromachined sensor
US5659195A (en) * 1995-06-08 1997-08-19 The Regents Of The University Of California CMOS integrated microsensor with a precision measurement circuit
US5770465A (en) * 1995-06-23 1998-06-23 Cornell Research Foundation, Inc. Trench-filling etch-masking microfabrication technique
US6346811B1 (en) 1997-10-20 2002-02-12 Wolff Controls Corp. Methods for mounting a sensor and signal conditioner to form sensing apparatus having enhanced sensing capabilities and reduced size
US5945605A (en) * 1997-11-19 1999-08-31 Sensym, Inc. Sensor assembly with sensor boss mounted on substrate
US6143583A (en) * 1998-06-08 2000-11-07 Honeywell, Inc. Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas
US6232150B1 (en) 1998-12-03 2001-05-15 The Regents Of The University Of Michigan Process for making microstructures and microstructures made thereby
JP2003510192A (ja) * 1999-09-28 2003-03-18 ハネウェル・インターナショナル・インコーポレーテッド 溶解ウェーハ製造プロセス、およびスペーシング・メサを持つ支持基板を有する関連マイクロ電気機械デバイス
US20020167312A1 (en) * 2001-05-01 2002-11-14 Marshall E. Smith Compact sensing apparatus having an orthogonal sensor and methods for forming same
US6787897B2 (en) * 2001-12-20 2004-09-07 Agilent Technologies, Inc. Wafer-level package with silicon gasket
JP4392246B2 (ja) * 2002-02-06 2009-12-24 アナログ・デバイスズ・インク マイクロ加工されたジャイロスコープ
US7089792B2 (en) * 2002-02-06 2006-08-15 Analod Devices, Inc. Micromachined apparatus utilizing box suspensions
US6946742B2 (en) * 2002-12-19 2005-09-20 Analog Devices, Inc. Packaged microchip with isolator having selected modulus of elasticity
US20040041254A1 (en) * 2002-09-04 2004-03-04 Lewis Long Packaged microchip
US6768196B2 (en) * 2002-09-04 2004-07-27 Analog Devices, Inc. Packaged microchip with isolation
US7166911B2 (en) 2002-09-04 2007-01-23 Analog Devices, Inc. Packaged microchip with premolded-type package
US20050056870A1 (en) * 2002-12-19 2005-03-17 Karpman Maurice S. Stress sensitive microchip with premolded-type package
JP4516113B2 (ja) 2004-04-14 2010-08-04 アナログ デバイシス， インコーポレイテッド 慣性センサのためのカップリング装置
US7478557B2 (en) 2004-10-01 2009-01-20 Analog Devices, Inc. Common centroid micromachine driver
EP1847025A2 (en) 2005-01-20 2007-10-24 BAE SYSTEMS Information and Electronic Systems Integration Inc. Microradio design, manufacturing method and applications for the use of microradios
US8160497B2 (en) 2005-01-20 2012-04-17 Bae Systems Information And Electronic Systems Integration Inc. Method of determining conditions on the ground using microradios
US7421897B2 (en) 2005-04-14 2008-09-09 Analog Devices, Inc. Cross-quad and vertically coupled inertial sensors
DE102005040789B4 (de) * 2005-08-29 2014-12-24 Robert Bosch Gmbh Herstellungsverfahren für ein Mikromechanisches Bauelement mit anodisch gebondeter Kappe
US8129801B2 (en) * 2006-01-06 2012-03-06 Honeywell International Inc. Discrete stress isolator attachment structures for MEMS sensor packages
JP4671874B2 (ja) * 2006-01-23 2011-04-20 シャープ株式会社 中継装置
US8344487B2 (en) 2006-06-29 2013-01-01 Analog Devices, Inc. Stress mitigation in packaged microchips
EP1944266A1 (en) * 2007-01-10 2008-07-16 Infineon Technologies SensoNor AS MEMS Packaging with reduced mechanical strain
US20080164546A1 (en) * 2007-01-10 2008-07-10 Infineon Technologies Sensonor As Design of MEMS Packaging
US20110304430A1 (en) 2007-07-30 2011-12-15 Bae Systems Information And Electronic Systems Integration Inc. Method of tracking a container using microradios
US7970357B2 (en) * 2007-07-30 2011-06-28 Bae Systems Information And Electronic Systems Integration Inc. Transponder with stabilized oscillator
US8260201B2 (en) * 2007-07-30 2012-09-04 Bae Systems Information And Electronic Systems Integration Inc. Dispersive antenna for RFID tags
DE102008043382B4 (de) * 2008-11-03 2017-01-19 Robert Bosch Gmbh Bauelement und Verfahren zu dessen Herstellung
WO2010134181A1 (ja) * 2009-05-21 2010-11-25 パナソニック電工株式会社 チップの実装構造、及びそれを備えたモジュール
EP2426083A3 (en) * 2010-09-03 2013-11-13 Domintech Co., LTD. Mems sensor package
CN102398885A (zh) * 2010-09-14 2012-04-04 利顺精密科技股份有限公司 微机电传感器装置
GB201200128D0 (en) 2012-01-05 2012-02-15 Atlantic Inertial Systems Ltd Strain decoupled sensor
US8803262B2 (en) * 2012-01-17 2014-08-12 Rosemount Aerospace Inc. Die attach stress isolation
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
CN104201168B (zh) * 2014-09-16 2017-01-25 山东华芯半导体有限公司 一种芯片倾斜堆叠的圆片级封装单元及封装方法
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
US9499393B2 (en) * 2015-02-06 2016-11-22 Mks Instruments, Inc. Stress relief MEMS structure and package
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
CN106371041A (zh) * 2016-10-10 2017-02-01 北京艾森博威科技发展有限公司 霍尔传感器及其组装方法
JP6926568B2 (ja) 2017-03-24 2021-08-25 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
CN112444238A (zh) * 2019-08-16 2021-03-05 北京小米移动软件有限公司 加速度陀螺传感器
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
US11981560B2 (en) 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture

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US4670092A (en) * 1986-04-18 1987-06-02 Rockwell International Corporation Method of fabricating a cantilever beam for a monolithic accelerometer
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DE-Buch: A. Heuberger "Mikromechanik", Springer Verl. 1989, S. 475 u. 476 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19800574B4 (de) * 1998-01-09 2013-11-14 Robert Bosch Gmbh Mikromechanisches Bauelement
DE102012215742A1 (de) * 2012-09-05 2014-03-06 Bundesdruckerei Gmbh Sicherheits- und/oder Wertprodukt
EP3156361A1 (fr) * 2015-10-16 2017-04-19 Thales Microsystème électromécanique et procédé de fabrication
US9731958B2 (en) 2015-10-16 2017-08-15 Thales Microelectromechanical system and fabricating process having decoupling structure that includes attaching element for fastening to carrier

Also Published As

Publication number Publication date
US5273939A (en) 1993-12-28
GB2253739A (en) 1992-09-16
GB9203292D0 (en) 1992-04-01
DE4107658C2 (enExample) 1993-09-02
GB2253739B (en) 1995-07-19
JPH0575176A (ja) 1993-03-26

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OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8365 Fully valid after opposition proceedings
8339 Ceased/non-payment of the annual fee