DE3915556C2 - - Google Patents

Info

Publication number
DE3915556C2
DE3915556C2 DE3915556A DE3915556A DE3915556C2 DE 3915556 C2 DE3915556 C2 DE 3915556C2 DE 3915556 A DE3915556 A DE 3915556A DE 3915556 A DE3915556 A DE 3915556A DE 3915556 C2 DE3915556 C2 DE 3915556C2
Authority
DE
Germany
Prior art keywords
head
suction head
rotor
suction
stator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3915556A
Other languages
German (de)
English (en)
Other versions
DE3915556A1 (de
Inventor
Susumu Shizuoka Jp Nakayama
Masato Itagaki
Keisuke Shimizu Shizuoka Jp Fujishiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63114671A external-priority patent/JPH0831712B2/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3915556A1 publication Critical patent/DE3915556A1/de
Application granted granted Critical
Publication of DE3915556C2 publication Critical patent/DE3915556C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H10W72/0711—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
DE3915556A 1988-05-13 1989-05-12 Vorrichtung und verfahren zum montieren elektrischer bauteile Granted DE3915556A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63114671A JPH0831712B2 (ja) 1987-12-09 1988-05-13 電子部品装着機

Publications (2)

Publication Number Publication Date
DE3915556A1 DE3915556A1 (de) 1989-11-23
DE3915556C2 true DE3915556C2 (cg-RX-API-DMAC10.html) 1992-10-22

Family

ID=14643689

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3915556A Granted DE3915556A1 (de) 1988-05-13 1989-05-12 Vorrichtung und verfahren zum montieren elektrischer bauteile

Country Status (2)

Country Link
US (1) US4979286A (cg-RX-API-DMAC10.html)
DE (1) DE3915556A1 (cg-RX-API-DMAC10.html)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155903A (en) * 1990-04-18 1992-10-20 Matsushita Electric Industrial Co., Ltd. Electrical component placing apparatus and placing method therefor
US5208975A (en) * 1990-07-06 1993-05-11 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic parts
EP0477606A1 (de) * 1990-09-28 1992-04-01 Siemens Aktiengesellschaft Saugpipette zum Aufnehmen, Transportieren und Positionieren von Bauelementen
DE9112930U1 (de) * 1991-10-17 1992-01-23 Naumann, Willi, 7560 Gaggenau Vorrichtung zum Übergeben von Teilen von einer Zuführeinrichtung in eine Vorrichtung zur Montage, Prüfung, Bearbeitung o.dgl. der Teile
US5410801A (en) * 1993-02-08 1995-05-02 Automated Production Systems Apparatus for manually controlled placement of components on circuit boards
JP2930870B2 (ja) * 1994-07-06 1999-08-09 株式会社三協精機製作所 電子部品表面実装装置
JP3215351B2 (ja) * 1997-04-30 2001-10-02 富士通株式会社 配置方式
JPH11251792A (ja) * 1998-03-03 1999-09-17 Matsushita Electric Ind Co Ltd 電子部品装着機
JP4255162B2 (ja) * 1999-04-01 2009-04-15 富士機械製造株式会社 電気部品の装着方法および電気部品装着システム
DE10236626A1 (de) * 2002-08-09 2004-02-19 Siemens Ag Vorrichtung zum selektiven Bewegen von Haltevorrichtungen und Bestückkopf zum Transportieren von Bauelementen
US20070220741A1 (en) * 2002-10-17 2007-09-27 Ui Holding Co. Cabeless interconnect system for pick and place machine
DE10302802A1 (de) * 2003-01-24 2004-08-26 Siemens Ag Mehrfach-Bestückkopf
US20050066507A1 (en) * 2003-09-23 2005-03-31 Gilman Engineering & Manufacturing Co., Llc Assembly process for scrapless clutch plate assembly
JP4546857B2 (ja) * 2005-03-16 2010-09-22 富士機械製造株式会社 電子部品保持装置および電子部品装着システム
US8136219B2 (en) * 2005-08-02 2012-03-20 Panasonic Corporation Electronic component mounter and mounting method
DE102005045818A1 (de) 2005-09-24 2007-03-29 Eisenmann Maschinenbau Gmbh & Co. Kg Vorrichtung zur Behandlung von Werkstücken, insbesondere von Fahrzeugrädern, insbesondere im Rahmen einer Pulverlackierung
TWI391307B (zh) * 2010-01-15 2013-04-01 Advanced Semiconductor Eng 吸頭與應用此吸頭之輸送機台
CN102142390B (zh) * 2010-02-03 2013-03-20 日月光半导体制造股份有限公司 吸头与应用此吸头的输送机台
CN105359639B (zh) * 2013-07-12 2018-09-14 富士机械制造株式会社 元件安装装置
WO2015063934A1 (ja) * 2013-10-31 2015-05-07 富士機械製造株式会社 部品装着機
KR101500385B1 (ko) * 2013-12-31 2015-03-09 현대자동차 주식회사 무빙파트 핸들링 장치
SG11202008085SA (en) 2018-02-26 2020-09-29 Universal Instruments Corp Dispensing head, nozzle and method
US11382248B2 (en) 2018-02-26 2022-07-05 Universal Instruments Corporation Dispensing head
WO2021191968A1 (ja) * 2020-03-23 2021-09-30 株式会社Ｆｕｊｉ 管理装置、実装システム及び管理方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3887998A (en) * 1973-11-09 1975-06-10 Gen Motors Corp Air-biased probe for semiconductor device bonding
US4458412A (en) * 1981-05-06 1984-07-10 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
JPS60177833A (ja) * 1984-02-25 1985-09-11 Toyoda Mach Works Ltd 真空チヤツク装置
JP2537770B2 (ja) * 1984-08-31 1996-09-25 松下電器産業株式会社 電子部品の装着方法
JPS61115387A (ja) * 1984-11-09 1986-06-02 パイオニア株式会社 部品取付装置
JPS61168298A (ja) * 1985-01-21 1986-07-29 富士機械製造株式会社 電子部品の姿勢変更が可能な電子部品装着装置
US4780956A (en) * 1987-05-05 1988-11-01 Reliability Incorporated Floating crown for insertion-extraction head
JP6213839B2 (ja) * 2014-09-19 2017-10-18 本田技研工業株式会社 内燃機関用ダンパ装置

Also Published As

Publication number Publication date
DE3915556A1 (de) 1989-11-23
US4979286A (en) 1990-12-25

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8365 Fully valid after opposition proceedings
8339 Ceased/non-payment of the annual fee